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SG11201701903QA - Marker having focusing and tilt correction design and alignment method - Google Patents

Marker having focusing and tilt correction design and alignment method

Info

Publication number
SG11201701903QA
SG11201701903QA SG11201701903QA SG11201701903QA SG11201701903QA SG 11201701903Q A SG11201701903Q A SG 11201701903QA SG 11201701903Q A SG11201701903Q A SG 11201701903QA SG 11201701903Q A SG11201701903Q A SG 11201701903QA SG 11201701903Q A SG11201701903Q A SG 11201701903QA
Authority
SG
Singapore
Prior art keywords
focusing
marker
alignment method
tilt correction
correction design
Prior art date
Application number
SG11201701903QA
Inventor
Rong Du
Yuefei Chen
Original Assignee
Shanghai Microelectronics Equi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Microelectronics Equi filed Critical Shanghai Microelectronics Equi
Publication of SG11201701903QA publication Critical patent/SG11201701903QA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70681—Metrology strategies
    • G03F7/70683—Mark designs
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706843—Metrology apparatus
    • G03F7/706845—Calibration, e.g. tool-to-tool calibration, beam alignment, spot position or focus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/708—Mark formation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Optical Head (AREA)
SG11201701903QA 2014-09-09 2015-09-08 Marker having focusing and tilt correction design and alignment method SG11201701903QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410456314.2A CN105467781B (en) 2014-09-09 2014-09-09 A kind of mark and alignment methods with focusing and slant correction design
PCT/CN2015/089167 WO2016037562A1 (en) 2014-09-09 2015-09-08 Marker having focusing and tilt correction design and alignment method

Publications (1)

Publication Number Publication Date
SG11201701903QA true SG11201701903QA (en) 2017-04-27

Family

ID=55458350

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201701903QA SG11201701903QA (en) 2014-09-09 2015-09-08 Marker having focusing and tilt correction design and alignment method

Country Status (6)

Country Link
JP (1) JP6309694B2 (en)
KR (1) KR101948906B1 (en)
CN (1) CN105467781B (en)
SG (1) SG11201701903QA (en)
TW (1) TWI585513B (en)
WO (1) WO2016037562A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107450287B (en) * 2016-05-31 2019-10-25 上海微电子装备（集团）股份有限公司 Focusing and leveling measurement apparatus and method
CN108333880B (en) * 2017-01-19 2020-08-04 上海微电子装备（集团）股份有限公司 Photoetching exposure device and focal plane measuring device and method thereof
JP7186531B2 (en) * 2018-07-13 2022-12-09 キヤノン株式会社 Exposure apparatus and article manufacturing method
CN111624856B (en) * 2019-02-28 2021-10-15 上海微电子装备（集团）股份有限公司 Mask plate, motion table positioning error compensation device and compensation method
CN110849266B (en) * 2019-11-28 2021-05-25 江西瑞普德测量设备有限公司 Telecentric lens telecentricity debugging method of image measuring instrument
CN111383537A (en) * 2020-04-02 2020-07-07 上海天马有机发光显示技术有限公司 Display panel and display device
CN115356898A (en) * 2022-08-25 2022-11-18 上海华力集成电路制造有限公司 Method for improving photoetching alignment precision
CN117492336B (en) * 2024-01-02 2024-04-09 天府兴隆湖实验室 Alignment mark and pattern alignment method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9000503A (en) * 1990-03-05 1991-10-01 Asm Lithography Bv APPARATUS AND METHOD FOR IMAGING A MASK PATTERN ON A SUBSTRATE.
JPH06196387A (en) * 1992-12-22 1994-07-15 Canon Inc Focusing method of substrate and projection exposure method
US6136662A (en) * 1999-05-13 2000-10-24 Lsi Logic Corporation Semiconductor wafer having a layer-to-layer alignment mark and method for fabricating the same
JP2004279166A (en) * 2003-03-14 2004-10-07 Canon Inc Position detector
JP4516826B2 (en) * 2004-11-15 2010-08-04 Ｏｋｉセミコンダクタ株式会社 Focus monitoring method
JP2006261644A (en) 2005-02-16 2006-09-28 Nikon Corp Exposure apparatus and method of aligning reticle with sensitive substrate stage
JP2006332480A (en) 2005-05-30 2006-12-07 Nikon Corp Position measurement method, exposure method, device-manufacturing method, position-measurement apparatus, and exposure apparatus
ATE412962T1 (en) * 2005-07-04 2008-11-15 Koninkl Philips Electronics Nv OPTICAL RECORDING AND/OR RECORDING DEVICE
JP2007305696A (en) * 2006-05-09 2007-11-22 Nsk Ltd Positioning device accuracy measurement method
CN100526994C (en) * 2007-08-20 2009-08-12 上海微电子装备有限公司 Transmission aligning mark combination and alignment method of light scribing device
JP2010098143A (en) * 2008-10-16 2010-04-30 Canon Inc Exposure apparatus and method of manufacturing device
CN101943865B (en) * 2009-07-09 2012-10-03 上海微电子装备有限公司 Alignment marks for photoetching equipment and alignment method
CN102566338B (en) 2010-12-28 2013-11-13 上海微电子装备有限公司 Method for correcting alignment positions in photoetching alignment system
CN103163747B (en) * 2011-12-14 2015-03-25 上海微电子装备有限公司 Small spot off-axis alignment system based on area lighting
CN203553154U (en) * 2013-11-14 2014-04-16 中芯国际集成电路制造(北京)有限公司 Measurement mark

Also Published As

Publication number Publication date
JP6309694B2 (en) 2018-04-11
CN105467781B (en) 2017-12-29
KR101948906B1 (en) 2019-02-15
KR20170051480A (en) 2017-05-11
WO2016037562A1 (en) 2016-03-17
CN105467781A (en) 2016-04-06
JP2017528766A (en) 2017-09-28
TW201614365A (en) 2016-04-16
TWI585513B (en) 2017-06-01

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