SG11201608609UA - Copper clad laminate provided with protective layer and multilayered printed wiring board - Google Patents
Copper clad laminate provided with protective layer and multilayered printed wiring boardInfo
- Publication number
- SG11201608609UA SG11201608609UA SG11201608609UA SG11201608609UA SG11201608609UA SG 11201608609U A SG11201608609U A SG 11201608609UA SG 11201608609U A SG11201608609U A SG 11201608609UA SG 11201608609U A SG11201608609U A SG 11201608609UA SG 11201608609U A SG11201608609U A SG 11201608609UA
- Authority
- SG
- Singapore
- Prior art keywords
- protective layer
- wiring board
- printed wiring
- clad laminate
- copper clad
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09645—Patterning on via walls; Plural lands around one hole
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014031398 | 2014-02-21 | ||
| PCT/JP2015/054636 WO2015125873A1 (en) | 2014-02-21 | 2015-02-19 | Protective layer-equipped copper-clad laminate and multilayer printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201608609UA true SG11201608609UA (en) | 2016-11-29 |
Family
ID=53878370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201608609UA SG11201608609UA (en) | 2014-02-21 | 2015-02-19 | Copper clad laminate provided with protective layer and multilayered printed wiring board |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10244640B2 (en) |
| JP (1) | JP5883542B2 (en) |
| KR (2) | KR101761163B1 (en) |
| CN (1) | CN106031310B (en) |
| SG (1) | SG11201608609UA (en) |
| TW (1) | TWI563892B (en) |
| WO (1) | WO2015125873A1 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6260871B2 (en) * | 2014-06-27 | 2018-01-17 | パナソニックＩｐマネジメント株式会社 | PREPARATE PARTS SET, PREPARATE, PREPARATE MANUFACTURING METHOD, IMAGE CAPTURE DEVICE, AND IMAGE CAPTURE METHOD |
| JP6832868B2 (en) * | 2015-12-07 | 2021-02-24 | 三井金属鉱業株式会社 | Method of manufacturing laminate and metal leaf with resin layer |
| US9872399B1 (en) * | 2016-07-22 | 2018-01-16 | International Business Machines Corporation | Implementing backdrilling elimination utilizing anti-electroplate coating |
| US10212828B1 (en) * | 2017-11-27 | 2019-02-19 | International Business Machines Corporation | Via stub elimination by disrupting plating |
| CN109862718A (en) * | 2019-04-02 | 2019-06-07 | 生益电子股份有限公司 | Through hole processing method for breaking hole wall copper layer at specified layer and PCB |
| CN110536566B (en) * | 2019-08-29 | 2021-04-02 | 江苏上达电子有限公司 | Hole forming method for flexible double-sided board |
| KR20220012041A (en) | 2020-07-22 | 2022-02-03 | 김진영 | magnetic note |
| KR20220078394A (en) | 2020-12-03 | 2022-06-10 | 노준수 | a notebook that can be carried with a writing instrument made of magnetized surface |
| CN115334779A (en) * | 2021-05-11 | 2022-11-11 | 中兴智能科技南京有限公司 | Method for manufacturing multilayer circuit board |
| CN118975416A (en) * | 2022-03-30 | 2024-11-15 | 京瓷株式会社 | Wiring substrate |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE7412169L (en) * | 1974-09-27 | 1976-03-29 | Perstorp Ab | PROCEDURE FOR PREPARING THROUGH TAIL IN A LAMINATE |
| JPS5179883A (en) | 1975-01-06 | 1976-07-12 | Hitachi Ltd | DENSHISHIKICHOSETSUKEI |
| JPH04354180A (en) * | 1991-05-31 | 1992-12-08 | Sharp Corp | Manufacture of multilayer printed wiring board |
| JP2891583B2 (en) | 1991-12-27 | 1999-05-17 | 株式会社ナガオカ | Method of manufacturing selective isolation screen |
| US5822856A (en) * | 1996-06-28 | 1998-10-20 | International Business Machines Corporation | Manufacturing circuit board assemblies having filled vias |
| US6270889B1 (en) * | 1998-01-19 | 2001-08-07 | Mitsui Mining & Smelting Co., Ltd. | Making and using an ultra-thin copper foil |
| US6319620B1 (en) * | 1998-01-19 | 2001-11-20 | Mitsui Mining & Smelting Co., Ltd. | Making and using an ultra-thin copper foil |
| US6280851B1 (en) * | 1998-03-23 | 2001-08-28 | Sentrex Company, Inc. | Multilayer product for printed circuit boards |
| JP2001015919A (en) * | 1999-06-25 | 2001-01-19 | Ibiden Co Ltd | Multilayer printed wiring board, circuit-board therefor and its manufacture |
| US6426470B1 (en) | 2001-01-17 | 2002-07-30 | International Business Machines Corporation | Formation of multisegmented plated through holes |
| JP4060629B2 (en) * | 2002-04-15 | 2008-03-12 | デンカＡｇｓｐ株式会社 | Method for forming plated through hole and method for manufacturing multilayer wiring board |
| JP2004281437A (en) * | 2003-03-12 | 2004-10-07 | Sumitomo Bakelite Co Ltd | Double-sided metal-clad laminated board with filled via hole and its manufacturing method |
| JP4075673B2 (en) * | 2003-04-22 | 2008-04-16 | 松下電工株式会社 | Copper-clad laminate for multilayer printed wiring board, multilayer printed wiring board, and method for manufacturing multilayer printed wiring board |
| TWI389205B (en) | 2005-03-04 | 2013-03-11 | Sanmina Sci Corp | Partitioning a via structure using plating resist |
| KR101520202B1 (en) | 2010-12-28 | 2015-05-13 | 미쓰이 가가쿠 토세로 가부시키가이샤 | Resin composition, protective film containing same, dry film, circuit board, and multilayer circuit board |
| CN103188886B (en) * | 2011-12-31 | 2016-02-03 | 北大方正集团有限公司 | A kind of printed circuit board and preparation method thereof |
-
2015
- 2015-02-19 KR KR1020167021167A patent/KR101761163B1/en active IP Right Grant
- 2015-02-19 JP JP2015515315A patent/JP5883542B2/en active Active
- 2015-02-19 US US15/111,315 patent/US10244640B2/en active Active
- 2015-02-19 SG SG11201608609UA patent/SG11201608609UA/en unknown
- 2015-02-19 KR KR1020177020048A patent/KR101975132B1/en active IP Right Grant
- 2015-02-19 CN CN201580009095.6A patent/CN106031310B/en active Active
- 2015-02-19 WO PCT/JP2015/054636 patent/WO2015125873A1/en active Application Filing
- 2015-02-24 TW TW104105894A patent/TWI563892B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI563892B (en) | 2016-12-21 |
| US10244640B2 (en) | 2019-03-26 |
| KR101975132B1 (en) | 2019-05-03 |
| JPWO2015125873A1 (en) | 2017-03-30 |
| KR101761163B1 (en) | 2017-07-25 |
| WO2015125873A1 (en) | 2015-08-27 |
| CN106031310A (en) | 2016-10-12 |
| KR20170086697A (en) | 2017-07-26 |
| TW201543983A (en) | 2015-11-16 |
| JP5883542B2 (en) | 2016-03-15 |
| US20160360624A1 (en) | 2016-12-08 |
| CN106031310B (en) | 2018-11-23 |
| KR20160096725A (en) | 2016-08-16 |
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