[go: up one dir, main page]

SG11201608362TA - Method and device for embossing of a nanostructure - Google Patents

Method and device for embossing of a nanostructure

Info

Publication number
SG11201608362TA
SG11201608362TA SG11201608362TA SG11201608362TA SG11201608362TA SG 11201608362T A SG11201608362T A SG 11201608362TA SG 11201608362T A SG11201608362T A SG 11201608362TA SG 11201608362T A SG11201608362T A SG 11201608362TA SG 11201608362T A SG11201608362T A SG 11201608362TA
Authority
SG
Singapore
Prior art keywords
nanostructure
embossing
Prior art date
Application number
SG11201608362TA
Inventor
Gerald Kreindl
Original Assignee
Ev Group E Thallner Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ev Group E Thallner Gmbh filed Critical Ev Group E Thallner Gmbh
Publication of SG11201608362TA publication Critical patent/SG11201608362TA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F19/00Apparatus or machines for carrying out printing operations combined with other operations
    • B41F19/02Apparatus or machines for carrying out printing operations combined with other operations with embossing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B30PRESSES
    • B30BPRESSES IN GENERAL
    • B30B15/00Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06Platens or press rams
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44BMACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
    • B44B5/00Machines or apparatus for embossing decorations or marks, e.g. embossing coins
    • B44B5/0052Machines or apparatus for embossing decorations or marks, e.g. embossing coins by pressing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44BMACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
    • B44B5/00Machines or apparatus for embossing decorations or marks, e.g. embossing coins
    • B44B5/02Dies; Accessories
    • B44B5/026Dies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44CPRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/24Pressing or stamping ornamental designs on surfaces
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70783Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117Shapes of semiconductor bodies
    • H10D62/118Nanostructure semiconductor bodies
    • H10P76/204
    • H10P76/2041

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11201608362TA 2014-04-22 2014-04-22 Method and device for embossing of a nanostructure SG11201608362TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2014/058141 WO2015161868A1 (en) 2014-04-22 2014-04-22 Method and device for embossing a nanostructure

Publications (1)

Publication Number Publication Date
SG11201608362TA true SG11201608362TA (en) 2016-11-29

Family

ID=50588682

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201608362TA SG11201608362TA (en) 2014-04-22 2014-04-22 Method and device for embossing of a nanostructure

Country Status (8)

Country Link
US (4) US10118381B2 (en)
EP (2) EP3134771B1 (en)
JP (1) JP6391709B2 (en)
KR (3) KR102545684B1 (en)
CN (4) CN112445064A (en)
SG (1) SG11201608362TA (en)
TW (4) TWI824579B (en)
WO (1) WO2015161868A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019210976A1 (en) 2018-05-04 2019-11-07 Ev Group E. Thallner Gmbh Stamp and method for embossing
TWI875369B (en) * 2018-10-25 2025-03-01 日商尼康股份有限公司 Substrate bonding device, parameter calculation device, substrate bonding method and parameter calculation method
WO2020136048A1 (en) * 2018-12-28 2020-07-02 Asml Holding N.V. Apparatus and method for cleaning a support structure in a lithographic system
EP4646630A1 (en) 2023-01-03 2025-11-12 EV Group E. Thallner GmbH Device and method for processing a substrate in an evacuated processing chamber

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6180288B1 (en) * 1997-03-21 2001-01-30 Kimberly-Clark Worldwide, Inc. Gel sensors and method of use thereof
AT405775B (en) 1998-01-13 1999-11-25 Thallner Erich Method and apparatus for bringing together wafer-type (slice-type, disk-shaped) semiconductor substrates in an aligned manner
WO2004044651A1 (en) 2002-11-13 2004-05-27 Molecular Imprints, Inc. A chucking system and method for modulating shapes of substrates
US6943117B2 (en) 2003-03-27 2005-09-13 Korea Institute Of Machinery & Materials UV nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization
KR100504080B1 (en) * 2003-05-26 2005-07-27 한국기계연구원 Uv nanoimprint lithography using the selective added pressure
DE102004007060B3 (en) 2004-02-13 2005-07-07 Thallner, Erich, Dipl.-Ing. Semiconductor wafer bonding device using application of adhesive before alignment and contacting of corresponding surfaces of semiconductor wafers
CN100555076C (en) * 2004-07-26 2009-10-28 鸿富锦精密工业(深圳)有限公司 Be used for pressing mold of nano impression and preparation method thereof
DE102005036775B4 (en) * 2004-08-09 2007-01-25 Schuler Pressen Gmbh & Co. Kg Forming device with ejector and method for ejecting workpieces
US20070164476A1 (en) * 2004-09-01 2007-07-19 Wei Wu Contact lithography apparatus and method employing substrate deformation
DK1789848T3 (en) * 2004-09-08 2010-10-25 Nil Technology Aps Flexible nano-embossed piston
US7331283B2 (en) * 2004-12-16 2008-02-19 Asml Holding N.V. Method and apparatus for imprint pattern replication
US8563491B2 (en) 2005-03-04 2013-10-22 The Procter & Gamble Company Methods of cleansing skin and rinse-off or wipe-off compositions therefor
KR101256383B1 (en) 2005-05-03 2013-04-25 코닌클리케 필립스 일렉트로닉스 엔.브이. Method and device for transferring a pattern from a stamp to a substrate
JP4854383B2 (en) * 2006-05-15 2012-01-18 アピックヤマダ株式会社 Imprint method and nano-imprint apparatus
TWI322754B (en) 2006-05-18 2010-04-01 Molecular Imprints Inc Method for expelling gas positioned between a substrate and a mold
US8215946B2 (en) * 2006-05-18 2012-07-10 Molecular Imprints, Inc. Imprint lithography system and method
WO2007136832A2 (en) 2006-05-18 2007-11-29 Molecular Imprints, Inc. Method for expelling gas positioned between a substrate and a mold
EP2029963A1 (en) * 2006-05-31 2009-03-04 Canon Kabushiki Kaisha Gap measuring method, imprint method, and imprint apparatus
JP2008098263A (en) * 2006-10-10 2008-04-24 Canon Inc Near-field exposure mask and resist pattern forming method using the mask
JP4418476B2 (en) * 2007-03-20 2010-02-17 株式会社日立ハイテクノロジーズ MICROSTRUCTURE TRANSFER APPARATUS AND MICROSTRUCTURE MANUFACTURING METHOD
NL2004409A (en) 2009-05-19 2010-11-22 Asml Netherlands Bv Imprint lithography apparatus.
EP2287666B1 (en) 2009-08-22 2012-06-27 EV Group E. Thallner GmbH Device for embossing substrates
JP5469041B2 (en) * 2010-03-08 2014-04-09 株式会社日立ハイテクノロジーズ Fine structure transfer method and apparatus
CN103069251A (en) 2010-09-03 2013-04-24 Ev集团E·索尔纳有限责任公司 Apparatus and method for reducing wedge error
JP5930622B2 (en) 2010-10-08 2016-06-08 キヤノン株式会社 Imprint apparatus and article manufacturing method
CN102096315B (en) * 2010-12-22 2012-04-04 青岛理工大学 Device and method for nanoimprinting whole wafer
JP2012190877A (en) * 2011-03-09 2012-10-04 Fujifilm Corp Nanoimprint method and nanoimprint device for use therein
JPWO2012133840A1 (en) 2011-03-30 2014-07-28 日本電気株式会社 Imprint apparatus, imprint method, electronic circuit board, and electronic apparatus
KR20220008392A (en) * 2011-08-12 2022-01-20 에베 그룹 에. 탈너 게엠베하 Apparatus and method for bonding substrates
JP6004738B2 (en) * 2011-09-07 2016-10-12 キヤノン株式会社 Imprint apparatus and article manufacturing method using the same
CN102346369B (en) * 2011-09-08 2013-04-10 青岛理工大学 Whole wafer nanoimprint lithography machine
EP2587560A1 (en) * 2011-10-26 2013-05-01 Forschungsverbund Berlin e.V. Light emitting diode
JP5824380B2 (en) * 2012-02-07 2015-11-25 キヤノン株式会社 Imprint apparatus, imprint method, and article manufacturing method
CN102591143B (en) * 2012-02-29 2014-04-16 青岛理工大学 Large-area nano-imprint lithography device and method
CN102566262B (en) * 2012-02-29 2013-06-19 青岛理工大学 Device suitable for wafer-level nanoimprint lithography of non-flat substrate
JP6069689B2 (en) * 2012-07-26 2017-02-01 大日本印刷株式会社 Nanoimprint template
CN103631086A (en) * 2012-08-21 2014-03-12 华中科技大学 Manufacturing method for micro-nano graphs used for integrated optoelectronic device
TWI609763B (en) * 2012-10-04 2018-01-01 大日本印刷股份有限公司 Imprint method and imprinting device
JP6188123B2 (en) * 2012-12-28 2017-08-30 芝浦メカトロニクス株式会社 Bonding device and bonding processing method
JP6328001B2 (en) * 2013-08-30 2018-05-23 キヤノン株式会社 Curable composition for imprint, film, method for producing film
US10578964B2 (en) * 2013-12-31 2020-03-03 Canon Nanotechnologies, Inc. Asymmetric template shape modulation for partial field imprinting

Also Published As

Publication number Publication date
TWI772789B (en) 2022-08-01
US10493747B2 (en) 2019-12-03
KR20220058671A (en) 2022-05-09
CN112445066A (en) 2021-03-05
TWI654134B (en) 2019-03-21
KR102545684B1 (en) 2023-06-20
CN106462053B (en) 2020-12-01
WO2015161868A1 (en) 2015-10-29
JP6391709B2 (en) 2018-09-19
TWI694967B (en) 2020-06-01
CN112445065A (en) 2021-03-05
JP2017516302A (en) 2017-06-15
KR102394754B1 (en) 2022-05-04
KR102249004B1 (en) 2021-05-07
US20190022999A1 (en) 2019-01-24
EP3591470A1 (en) 2020-01-08
KR20160145599A (en) 2016-12-20
CN112445064A (en) 2021-03-05
KR20210050597A (en) 2021-05-07
US20200047485A1 (en) 2020-02-13
US10118381B2 (en) 2018-11-06
TW202237526A (en) 2022-10-01
US20170001431A1 (en) 2017-01-05
EP3134771A1 (en) 2017-03-01
EP3134771B1 (en) 2019-08-28
US20210129520A1 (en) 2021-05-06
TW202030145A (en) 2020-08-16
CN106462053A (en) 2017-02-22
TWI824579B (en) 2023-12-01
US10906293B2 (en) 2021-02-02
TW201930179A (en) 2019-08-01
TW201544447A (en) 2015-12-01

Similar Documents

Publication Publication Date Title
ZA201904259B (en) Device and method
EP3219412A4 (en) Shaping device and a shaping method
SG10201407721WA (en) Article anti-lost device and method
ZA201702900B (en) Device and method
PT2893817T (en) Device and method for producing of a de-alcoholised beverage
PL3275040T3 (en) Method and device for forming a battery
PT3204150T (en) A method and a device for producing nanoparticles
PL2982303T3 (en) Medical device and method for producing a medical device
GB201409795D0 (en) A Method and apparatus
GB2530380B (en) Device and method for generating a speed value
PL2923973T3 (en) Device and method for positioning products
EP3171391A4 (en) Step-and-repeat-type imprinting device and method
GB2525625B (en) Device and method
SG11201608362TA (en) Method and device for embossing of a nanostructure
GB2537546B (en) Method and device for activating and deactivating a gs-tool
GB2539611B (en) Belt-finishing device and method for operating a belt-finishing device
SG11201608018XA (en) Sensing device and method for sensing a force
HUE037769T2 (en) Method and device for applying a seal
GB201419799D0 (en) A test device and method of using a test device
IL235083B (en) Liquid-atomization method and device
GB201416790D0 (en) Device and method
PL3010316T3 (en) A deformable apparatus and method
SG11201701644XA (en) Drawing device and drawing method
SG11201609083RA (en) A method and a device forcoating a base body
SG10201911997PA (en) Method and device for embossing of a nanostructure