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SG11201506950WA - Cobalt sputtering target and production method therefor - Google Patents

Cobalt sputtering target and production method therefor

Info

Publication number
SG11201506950WA
SG11201506950WA SG11201506950WA SG11201506950WA SG11201506950WA SG 11201506950W A SG11201506950W A SG 11201506950WA SG 11201506950W A SG11201506950W A SG 11201506950WA SG 11201506950W A SG11201506950W A SG 11201506950WA SG 11201506950W A SG11201506950W A SG 11201506950WA
Authority
SG
Singapore
Prior art keywords
production method
sputtering target
method therefor
cobalt sputtering
cobalt
Prior art date
Application number
SG11201506950WA
Inventor
Kentaro Harada
Kazushige Takahashi
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of SG11201506950WA publication Critical patent/SG11201506950WA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/07—Alloys based on nickel or cobalt based on cobalt
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/10—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of nickel or cobalt or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
SG11201506950WA 2013-03-27 2014-03-25 Cobalt sputtering target and production method therefor SG11201506950WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013066811 2013-03-27
PCT/JP2014/058250 WO2014157187A1 (en) 2013-03-27 2014-03-25 Cobalt sputtering target and production method therefor

Publications (1)

Publication Number Publication Date
SG11201506950WA true SG11201506950WA (en) 2015-10-29

Family

ID=51624157

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201506950WA SG11201506950WA (en) 2013-03-27 2014-03-25 Cobalt sputtering target and production method therefor

Country Status (5)

Country Link
JP (1) JP6084683B2 (en)
KR (2) KR20170095410A (en)
SG (1) SG11201506950WA (en)
TW (1) TWI600783B (en)
WO (1) WO2014157187A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11421315B2 (en) 2018-07-27 2022-08-23 Ulvac, Inc. Sputtering target and method of producing sputtering target

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013104207A1 (en) 2013-04-25 2014-11-13 Epcos Ag Apparatus and method for producing an electrically conductive and mechanical connection
CN107614744B (en) 2015-12-28 2020-04-24 Ｊｘ金属株式会社 Method for manufacturing sputtering target
KR101920836B1 (en) * 2016-11-30 2018-11-21 서보산업 주식회사 U bolt type fixture unit of construction material
KR101920837B1 (en) * 2016-11-30 2018-11-21 서보산업 주식회사 U bolt type fixture unit of construction material
CN111155060A (en) * 2018-11-07 2020-05-15 宁波江丰电子材料股份有限公司 Method for manufacturing cobalt target blank

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08260143A (en) * 1995-03-20 1996-10-08 Fujitsu Ltd Method for forming magnetic thin film and method for manufacturing semiconductor device
JPH09272970A (en) 1996-04-05 1997-10-21 Japan Energy Corp High-purity cobalt sputtering target and manufacturing method thereof
JPH10219439A (en) * 1997-02-10 1998-08-18 Applied Materials Inc Magnetron sputtering device and target
US6391172B2 (en) * 1997-08-26 2002-05-21 The Alta Group, Inc. High purity cobalt sputter target and process of manufacturing the same
US6176944B1 (en) * 1999-11-01 2001-01-23 Praxair S.T. Technology, Inc. Method of making low magnetic permeability cobalt sputter targets
US6827759B2 (en) * 2001-08-03 2004-12-07 Tosoh Smd, Inc. Method for reducing the oxygen and oxide content in cobalt to produce cobalt sputtering targets
JP2003073817A (en) * 2001-08-31 2003-03-12 Mitsubishi Materials Corp Sputtering target and arranging method therefor
JP3972719B2 (en) * 2002-04-16 2007-09-05 大同特殊鋼株式会社 Method for producing Co-based sputtering target
US6652668B1 (en) * 2002-05-31 2003-11-25 Praxair S.T. Technology, Inc. High-purity ferromagnetic sputter targets and method of manufacture
JP4963037B2 (en) * 2006-05-01 2012-06-27 株式会社アルバック Cobalt target for sputtering and manufacturing method thereof
JP5262436B2 (en) * 2008-08-27 2013-08-14 Ｊｆｅスチール株式会社 Magnetic measurement method and apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11421315B2 (en) 2018-07-27 2022-08-23 Ulvac, Inc. Sputtering target and method of producing sputtering target

Also Published As

Publication number Publication date
JPWO2014157187A1 (en) 2017-02-16
KR20150130552A (en) 2015-11-23
TW201447001A (en) 2014-12-16
JP6084683B2 (en) 2017-02-22
KR20170095410A (en) 2017-08-22
WO2014157187A1 (en) 2014-10-02
KR101991150B1 (en) 2019-06-19
TWI600783B (en) 2017-10-01

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