SG11201504629YA - Thermal head for device under test and method for controlling the temperature of device under test - Google Patents
Thermal head for device under test and method for controlling the temperature of device under testInfo
- Publication number
- SG11201504629YA SG11201504629YA SG11201504629YA SG11201504629YA SG11201504629YA SG 11201504629Y A SG11201504629Y A SG 11201504629YA SG 11201504629Y A SG11201504629Y A SG 11201504629YA SG 11201504629Y A SG11201504629Y A SG 11201504629YA SG 11201504629Y A SG11201504629Y A SG 11201504629YA
- Authority
- SG
- Singapore
- Prior art keywords
- under test
- device under
- controlling
- temperature
- thermal head
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/SG2012/000471 WO2014092642A1 (en) | 2012-12-12 | 2012-12-12 | Thermal head for device under test and method for controlling the temperature of device under test |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201504629YA true SG11201504629YA (en) | 2015-07-30 |
Family
ID=50934749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201504629YA SG11201504629YA (en) | 2012-12-12 | 2012-12-12 | Thermal head for device under test and method for controlling the temperature of device under test |
Country Status (6)
Country | Link |
---|---|
US (1) | US20150309112A1 (en) |
KR (1) | KR20150095727A (en) |
CN (1) | CN104904007A (en) |
SG (1) | SG11201504629YA (en) |
TW (1) | TW201424568A (en) |
WO (1) | WO2014092642A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201712459A (en) * | 2015-07-21 | 2017-04-01 | 三角設計公司 | Continuous fluidic thermal interface material dispensing |
TWI606242B (en) * | 2015-09-17 | 2017-11-21 | 旺矽科技股份有限公司 | Temperature control system and method thereof |
US9921265B2 (en) * | 2015-12-18 | 2018-03-20 | Sensata Technologies, Inc. | Thermal clutch for thermal control unit and methods related thereto |
DE102018105353B3 (en) | 2018-03-08 | 2019-01-03 | Helmuth Heigl | Contacting unit for a test handler for performing functional tests on semiconductor elements |
US11039528B2 (en) | 2018-07-09 | 2021-06-15 | Delta Design, Inc. | Assembly and sub-assembly for thermal control of electronic devices |
US11385281B2 (en) * | 2019-08-21 | 2022-07-12 | Micron Technology, Inc. | Heat spreaders for use in semiconductor device testing, such as burn-in testing |
US11495478B2 (en) * | 2019-12-16 | 2022-11-08 | Advanced Micro Devices, Inc. | Uninhibited cooling path solution for active thermal control in device testing |
US11549981B2 (en) * | 2020-10-01 | 2023-01-10 | Advantest Test Solutions, Inc. | Thermal solution for massively parallel testing |
US11940271B2 (en) * | 2020-11-17 | 2024-03-26 | International Business Machines Corporation | High power device fault localization via die surface contouring |
US11754619B2 (en) * | 2021-01-11 | 2023-09-12 | Star Technologies, Inc. | Probing apparatus with temperature-adjusting mechanism |
WO2023112221A1 (en) * | 2021-12-15 | 2023-06-22 | 株式会社アドバンテスト | Temperature adjusting unit, electronic component handling device, and electronic component testing device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3724536A (en) * | 1970-08-14 | 1973-04-03 | Gen Instrument Corp | Heating and cooling device |
JPS56150601A (en) * | 1980-04-22 | 1981-11-21 | Toyooki Kogyo Co Ltd | Driving system for hydraulic actuator |
US6184504B1 (en) * | 1999-04-13 | 2001-02-06 | Silicon Thermal, Inc. | Temperature control system for electronic devices |
US6840305B2 (en) * | 2001-04-04 | 2005-01-11 | Cannon Instrument Company | Cold cranking simulator having hybrid heat transfer system |
US6668570B2 (en) * | 2001-05-31 | 2003-12-30 | Kryotech, Inc. | Apparatus and method for controlling the temperature of an electronic device under test |
-
2012
- 2012-12-12 SG SG11201504629YA patent/SG11201504629YA/en unknown
- 2012-12-12 WO PCT/SG2012/000471 patent/WO2014092642A1/en active Application Filing
- 2012-12-12 KR KR1020157017697A patent/KR20150095727A/en not_active Application Discontinuation
- 2012-12-12 CN CN201280077693.3A patent/CN104904007A/en active Pending
- 2012-12-12 US US14/651,671 patent/US20150309112A1/en not_active Abandoned
-
2013
- 2013-02-08 TW TW102105115A patent/TW201424568A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2014092642A1 (en) | 2014-06-19 |
KR20150095727A (en) | 2015-08-21 |
CN104904007A (en) | 2015-09-09 |
TW201424568A (en) | 2014-06-16 |
US20150309112A1 (en) | 2015-10-29 |
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