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SG11201504629YA - Thermal head for device under test and method for controlling the temperature of device under test - Google Patents

Thermal head for device under test and method for controlling the temperature of device under test

Info

Publication number
SG11201504629YA
SG11201504629YA SG11201504629YA SG11201504629YA SG11201504629YA SG 11201504629Y A SG11201504629Y A SG 11201504629YA SG 11201504629Y A SG11201504629Y A SG 11201504629YA SG 11201504629Y A SG11201504629Y A SG 11201504629YA SG 11201504629Y A SG11201504629Y A SG 11201504629YA
Authority
SG
Singapore
Prior art keywords
under test
device under
controlling
temperature
thermal head
Prior art date
Application number
SG11201504629YA
Inventor
Yew Poh Goh
Original Assignee
Marvelous Technology Pte Ltd
Yew Poh Goh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marvelous Technology Pte Ltd, Yew Poh Goh filed Critical Marvelous Technology Pte Ltd
Publication of SG11201504629YA publication Critical patent/SG11201504629YA/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/2872Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67109Apparatus for thermal treatment mainly by convection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
SG11201504629YA 2012-12-12 2012-12-12 Thermal head for device under test and method for controlling the temperature of device under test SG11201504629YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2012/000471 WO2014092642A1 (en) 2012-12-12 2012-12-12 Thermal head for device under test and method for controlling the temperature of device under test

Publications (1)

Publication Number Publication Date
SG11201504629YA true SG11201504629YA (en) 2015-07-30

Family

ID=50934749

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201504629YA SG11201504629YA (en) 2012-12-12 2012-12-12 Thermal head for device under test and method for controlling the temperature of device under test

Country Status (6)

Country Link
US (1) US20150309112A1 (en)
KR (1) KR20150095727A (en)
CN (1) CN104904007A (en)
SG (1) SG11201504629YA (en)
TW (1) TW201424568A (en)
WO (1) WO2014092642A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201712459A (en) * 2015-07-21 2017-04-01 三角設計公司 Continuous fluidic thermal interface material dispensing
TWI606242B (en) * 2015-09-17 2017-11-21 旺矽科技股份有限公司 Temperature control system and method thereof
US9921265B2 (en) * 2015-12-18 2018-03-20 Sensata Technologies, Inc. Thermal clutch for thermal control unit and methods related thereto
DE102018105353B3 (en) 2018-03-08 2019-01-03 Helmuth Heigl Contacting unit for a test handler for performing functional tests on semiconductor elements
US11039528B2 (en) 2018-07-09 2021-06-15 Delta Design, Inc. Assembly and sub-assembly for thermal control of electronic devices
US11385281B2 (en) * 2019-08-21 2022-07-12 Micron Technology, Inc. Heat spreaders for use in semiconductor device testing, such as burn-in testing
US11495478B2 (en) * 2019-12-16 2022-11-08 Advanced Micro Devices, Inc. Uninhibited cooling path solution for active thermal control in device testing
US11549981B2 (en) * 2020-10-01 2023-01-10 Advantest Test Solutions, Inc. Thermal solution for massively parallel testing
US11940271B2 (en) * 2020-11-17 2024-03-26 International Business Machines Corporation High power device fault localization via die surface contouring
US11754619B2 (en) * 2021-01-11 2023-09-12 Star Technologies, Inc. Probing apparatus with temperature-adjusting mechanism
WO2023112221A1 (en) * 2021-12-15 2023-06-22 株式会社アドバンテスト Temperature adjusting unit, electronic component handling device, and electronic component testing device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3724536A (en) * 1970-08-14 1973-04-03 Gen Instrument Corp Heating and cooling device
JPS56150601A (en) * 1980-04-22 1981-11-21 Toyooki Kogyo Co Ltd Driving system for hydraulic actuator
US6184504B1 (en) * 1999-04-13 2001-02-06 Silicon Thermal, Inc. Temperature control system for electronic devices
US6840305B2 (en) * 2001-04-04 2005-01-11 Cannon Instrument Company Cold cranking simulator having hybrid heat transfer system
US6668570B2 (en) * 2001-05-31 2003-12-30 Kryotech, Inc. Apparatus and method for controlling the temperature of an electronic device under test

Also Published As

Publication number Publication date
WO2014092642A1 (en) 2014-06-19
KR20150095727A (en) 2015-08-21
CN104904007A (en) 2015-09-09
TW201424568A (en) 2014-06-16
US20150309112A1 (en) 2015-10-29

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