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SG11201406979VA - Device and method for aligning substrates - Google Patents

Device and method for aligning substrates

Info

Publication number
SG11201406979VA
SG11201406979VA SG11201406979VA SG11201406979VA SG11201406979VA SG 11201406979V A SG11201406979V A SG 11201406979VA SG 11201406979V A SG11201406979V A SG 11201406979VA SG 11201406979V A SG11201406979V A SG 11201406979VA SG 11201406979V A SG11201406979V A SG 11201406979VA
Authority
SG
Singapore
Prior art keywords
aligning substrates
aligning
substrates
Prior art date
Application number
SG11201406979VA
Inventor
Thomas Wagenleitner
Original Assignee
Ev Group E Thallner Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ev Group E Thallner Gmbh filed Critical Ev Group E Thallner Gmbh
Publication of SG11201406979VA publication Critical patent/SG11201406979VA/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H10P72/50
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007Alignment other than original with workpiece
    • G03F9/7011Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023Aligning or positioning in direction perpendicular to substrate surface
    • H10P72/0428
    • H10P72/53
    • H10P72/78
    • H10P74/238
    • H10P95/00
    • H10W99/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Length Measuring Devices By Optical Means (AREA)
SG11201406979VA 2013-12-06 2013-12-06 Device and method for aligning substrates SG11201406979VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2013/075831 WO2015082020A1 (en) 2013-12-06 2013-12-06 Device and method for aligning substrates

Publications (1)

Publication Number Publication Date
SG11201406979VA true SG11201406979VA (en) 2015-07-30

Family

ID=49753165

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201406979VA SG11201406979VA (en) 2013-12-06 2013-12-06 Device and method for aligning substrates

Country Status (8)

Country Link
US (1) US9851645B2 (en)
EP (1) EP2893556B9 (en)
JP (1) JP6042564B2 (en)
KR (2) KR20150080449A (en)
CN (1) CN105247670B (en)
SG (1) SG11201406979VA (en)
TW (1) TWI637458B (en)
WO (1) WO2015082020A1 (en)

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KR102904959B1 (en) 2017-03-02 2025-12-31 에베 그룹 에. 탈너 게엠베하 Method and device for bonding chips
DE102017105697B4 (en) 2017-03-16 2025-12-31 Ev Group E. Thallner Gmbh Method and system for aligning two oppositely arranged optical subsystems and camera chip
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KR102365283B1 (en) * 2017-03-20 2022-02-18 에베 그룹 에. 탈너 게엠베하 How to align two substrates
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US10636688B2 (en) * 2018-06-22 2020-04-28 Taiwan Semiconductor Manufacturing Co., Ltd. Method for alignment, process tool and method for wafer-level alignment
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EP4018472B1 (en) 2019-08-23 2025-08-13 EV Group E. Thallner GmbH Method and apparatus for alignment of substrates
US11145530B2 (en) * 2019-11-08 2021-10-12 Cerebras Systems Inc. System and method for alignment of an integrated circuit
EP4073835A1 (en) 2019-12-10 2022-10-19 EV Group E. Thallner GmbH Method and device for aligning substrates
JP7391733B2 (en) * 2020-03-17 2023-12-05 キオクシア株式会社 Semiconductor manufacturing equipment and semiconductor device manufacturing method
CN111524449B (en) * 2020-04-28 2022-03-29 昆山国显光电有限公司 Bonding equipment correction device and method and display panel bonding equipment and method
DE102020126211A1 (en) * 2020-05-28 2021-12-02 Taiwan Semiconductor Manufacturing Co. Ltd. Photolithography alignment process for bonded wafers
EP4354495A3 (en) 2020-06-29 2024-07-10 EV Group E. Thallner GmbH Method and device for bonding substrates
JP7130720B2 (en) * 2020-11-25 2022-09-05 エーファウ・グループ・エー・タルナー・ゲーエムベーハー Method and apparatus for aligning substrates
US11845179B2 (en) * 2020-12-22 2023-12-19 Kawasaki Jukogyo Kabushiki Kaisha Wafer jig, robot system, communication method, and robot teaching method
TWI792785B (en) * 2020-12-31 2023-02-11 南韓商Tes股份有限公司 Substrate bonding apparatus and substrate bonding method
KR102677190B1 (en) * 2020-12-31 2024-06-20 주식회사 테스 Substrate bonding apparatus and Substrate bonding method
TWM627561U (en) * 2021-08-26 2022-06-01 雷傑科技股份有限公司 Alignment apparatus
CN118355481A (en) * 2021-12-17 2024-07-16 Ev 集团 E·索尔纳有限责任公司 Method and apparatus for alignment of substrates
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WO2025061255A1 (en) 2023-09-18 2025-03-27 Erich Thallner Substrate stack, modified layer system, method for handling the substrate stack, and device for such a method

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Also Published As

Publication number Publication date
EP2893556A1 (en) 2015-07-15
TW201523782A (en) 2015-06-16
KR20150080449A (en) 2015-07-09
CN105247670B (en) 2018-06-12
EP2893556B9 (en) 2018-09-12
KR20160101202A (en) 2016-08-24
JP6042564B2 (en) 2016-12-14
EP2893556B1 (en) 2018-01-10
JP2016503589A (en) 2016-02-04
KR101741384B1 (en) 2017-05-29
US20160240420A1 (en) 2016-08-18
US9851645B2 (en) 2017-12-26
TWI637458B (en) 2018-10-01
CN105247670A (en) 2016-01-13
WO2015082020A1 (en) 2015-06-11

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