[go: up one dir, main page]

SG11201403191PA - Abrasive material regeneration method and regenerated abrasive material - Google Patents

Abrasive material regeneration method and regenerated abrasive material

Info

Publication number
SG11201403191PA
SG11201403191PA SG11201403191PA SG11201403191PA SG11201403191PA SG 11201403191P A SG11201403191P A SG 11201403191PA SG 11201403191P A SG11201403191P A SG 11201403191PA SG 11201403191P A SG11201403191P A SG 11201403191PA SG 11201403191P A SG11201403191P A SG 11201403191PA
Authority
SG
Singapore
Prior art keywords
abrasive material
regeneration method
regenerated
material regeneration
regenerated abrasive
Prior art date
Application number
SG11201403191PA
Inventor
Atsushi Takahashi
Yuuki Nagai
Akihiro Maezawa
Original Assignee
Konica Minolta Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Inc filed Critical Konica Minolta Inc
Publication of SG11201403191PA publication Critical patent/SG11201403191PA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/52—Treatment of water, waste water, or sewage by flocculation or precipitation of suspended impurities
    • C02F1/5236—Treatment of water, waste water, or sewage by flocculation or precipitation of suspended impurities using inorganic agents
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/66—Treatment of water, waste water, or sewage by neutralisation; pH adjustment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K23/00—Use of substances as emulsifying, wetting, dispersing, or foam-producing agents
    • C09K23/002—Inorganic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2101/00—Nature of the contaminant
    • C02F2101/10—Inorganic compounds
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/12—Nature of the water, waste water, sewage or sludge to be treated from the silicate or ceramic industries, e.g. waste waters from cement or glass factories
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/34—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32
    • C02F2103/346—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32 from semiconductor processing, e.g. waste water from polishing of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Hydrology & Water Resources (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Water Supply & Treatment (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Treatment Of Sludge (AREA)
  • Emulsifying, Dispersing, Foam-Producing Or Wetting Agents (AREA)
  • Mixers With Rotating Receptacles And Mixers With Vibration Mechanisms (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11201403191PA 2011-12-22 2012-12-05 Abrasive material regeneration method and regenerated abrasive material SG11201403191PA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011282041 2011-12-22
JP2011282037 2011-12-22
PCT/JP2012/081463 WO2013094399A1 (en) 2011-12-22 2012-12-05 Abrasive material regeneration method and regenerated abrasive material

Publications (1)

Publication Number Publication Date
SG11201403191PA true SG11201403191PA (en) 2014-08-28

Family

ID=48668298

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201403191PA SG11201403191PA (en) 2011-12-22 2012-12-05 Abrasive material regeneration method and regenerated abrasive material

Country Status (9)

Country Link
US (1) US9796894B2 (en)
EP (1) EP2796243B1 (en)
JP (1) JP5858050B2 (en)
KR (1) KR20140102697A (en)
CN (1) CN104010770B (en)
MY (1) MY177685A (en)
PH (1) PH12014501375B1 (en)
SG (1) SG11201403191PA (en)
WO (1) WO2013094399A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013132713A (en) * 2011-12-26 2013-07-08 Tosoh Corp Method and device for separating and removing foreign matter from circulated and reused polishing agent slurry
EP2799185B1 (en) * 2011-12-27 2017-02-01 Konica Minolta, Inc. Method for separating polishing material and regenerated polishing material
CN104203497B (en) * 2012-02-16 2016-11-16 柯尼卡美能达株式会社 Grinding-material renovation process
JP6107668B2 (en) * 2012-02-17 2017-04-05 コニカミノルタ株式会社 Abrasive recycling method
JP6372059B2 (en) * 2013-08-08 2018-08-15 コニカミノルタ株式会社 Collection method of cerium abrasive grains
JP6172030B2 (en) * 2014-04-03 2017-08-02 信越半導体株式会社 Workpiece cutting method and machining fluid
DE102014015549A1 (en) * 2014-10-22 2016-04-28 Thyssenkrupp Ag Grinding plant for comminuting regrind and method for comminuting regrind
JP6233296B2 (en) * 2014-12-26 2017-11-22 株式会社Sumco Abrasive grain evaluation method and silicon wafer manufacturing method
EP3388195B1 (en) * 2015-12-09 2022-05-04 Konica Minolta, Inc. Method for regenerating abrasive slurry
CN107652898A (en) * 2017-08-31 2018-02-02 安徽青花坊瓷业股份有限公司 A kind of domestic ceramics tableware vibropolish grinding-material
KR102670426B1 (en) * 2020-01-15 2024-06-03 오씨아이 주식회사 Method for separating and collecting single aggregate from fumed silica and method for classifying shape of single aggregate
JP2022172678A (en) * 2021-05-06 2022-11-17 コニカミノルタ株式会社 Method for preparing recycled/regenerated polishing agent slurry and polishing agent slurry
CN113304664B (en) * 2021-05-31 2023-09-05 广州兰德环保资源科技有限公司 Emulsifying device optimized through high-frequency ultrasonic action and laminar sedimentation
US11938586B2 (en) * 2021-08-27 2024-03-26 Taiwan Semiconductor Manufacturing Company Ltd. Slurry monitoring device, CMP system and method of in-line monitoring a slurry
CN115282692B (en) * 2022-07-19 2024-03-08 江阴萃科智能制造技术有限公司 Grinding liquid filtering circulation method of grinding and polishing equipment

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1997114A (en) * 1930-09-29 1935-04-09 Martin Michael James Filtration and clarification of water
US2816824A (en) * 1953-12-28 1957-12-17 Corning Glass Works Cerium oxide polishing composition
US4419246A (en) * 1982-09-30 1983-12-06 E. I. Du Pont De Nemours & Co. Removal of heavy metal ions
JPH06254764A (en) 1993-03-03 1994-09-13 Asahi Glass Co Ltd Regenerating method for polishing liquid
US5593339A (en) * 1993-08-12 1997-01-14 Church & Dwight Co., Inc. Slurry cleaning process
JP3249373B2 (en) * 1996-02-21 2002-01-21 信越半導体株式会社 Water-soluble slurry wastewater recycling system
US5664990A (en) * 1996-07-29 1997-09-09 Integrated Process Equipment Corp. Slurry recycling in CMP apparatus
KR100761636B1 (en) * 1996-09-30 2007-09-27 히다치 가세고교 가부시끼가이샤 A Cerium Oxide Particle
JPH1110540A (en) * 1997-06-23 1999-01-19 Speedfam Co Ltd Slurry recycling system of cmp device and its method
JPH1150168A (en) 1997-07-31 1999-02-23 Canon Inc Recovery of rare earth metal component from optical glass sludge
JP3134189B2 (en) 1997-09-18 2001-02-13 福島県 How to collect abrasives
JP3426149B2 (en) * 1998-12-25 2003-07-14 富士通株式会社 Method and apparatus for recycling polishing waste liquid in semiconductor manufacturing
JP2002534564A (en) * 1999-01-15 2002-10-15 ナルコ ケミカル カンパニー Compositions and methods for precipitating metal ions from semiconductor wastewater while improving microfilter operation
JP4168520B2 (en) * 1999-03-12 2008-10-22 栗田工業株式会社 Method for treating CMP drainage
US6746309B2 (en) * 1999-05-27 2004-06-08 Sanyo Electric Co., Ltd. Method of fabricating a semiconductor device
JP3316484B2 (en) * 1999-05-27 2002-08-19 三洋電機株式会社 Method for manufacturing semiconductor device
DE19960380C2 (en) * 1999-12-14 2002-05-29 Fraunhofer Ges Forschung Process for fractionating a cutting suspension
JP2001308043A (en) 2000-04-26 2001-11-02 Hitachi Chem Co Ltd Cmp-polishing agent and polishing method for substrate
SG115439A1 (en) 2001-12-28 2005-10-28 Jetsis Int Pte Ltd Method and apparatus for abrasive recycling and waste separation system
JP3557197B2 (en) * 2002-05-17 2004-08-25 三洋電機株式会社 Filtration method of colloid solution
JP2004306210A (en) * 2003-04-08 2004-11-04 Speedfam Co Ltd Processing method and processing equipment for reusing cerium oxide-based polishing agent and water, in drainage in glass polishing
JPWO2005090511A1 (en) * 2004-03-19 2008-01-31 ▲吉▼田 和昭 Polishing composition and polishing method
EP1818312A4 (en) * 2004-11-08 2010-09-08 Asahi Glass Co Ltd METHOD FOR PRODUCING CeO2 FINE PARTICLES AND POLISHING SLURRY CONTAINING SUCH FINE PARTICLES
ITRM20050329A1 (en) * 2005-06-24 2006-12-25 Guido Fragiacomo PROCEDURE FOR TREATING ABRASIVE SUSPENSIONS EXHAUSTED FOR THE RECOVERY OF THEIR RECYCLABLE COMPONENTS AND ITS PLANT.
JP4729428B2 (en) * 2006-04-07 2011-07-20 Ａｇｃセイミケミカル株式会社 Regeneration method of cerium-based abrasive
JP2010167551A (en) * 2008-12-26 2010-08-05 Nomura Micro Sci Co Ltd Method for regenerating used slurry
JP2010214515A (en) 2009-03-16 2010-09-30 Fukushima Univ Method of manufacturing glass abrasive material
US20110070811A1 (en) * 2009-03-25 2011-03-24 Applied Materials, Inc. Point of use recycling system for cmp slurry
JP5511261B2 (en) * 2009-08-19 2014-06-04 宇部マテリアルズ株式会社 Classification device
KR101245276B1 (en) * 2010-03-12 2013-03-19 주식회사 엘지화학 Method for recycling Cerium oxide abrasive
US20140144846A1 (en) * 2012-11-26 2014-05-29 Memc Singapore, Pte. Ltd (Uen200614797D) Methods For The Recycling of Wire-Saw Cutting Fluid

Also Published As

Publication number Publication date
US9796894B2 (en) 2017-10-24
KR20140102697A (en) 2014-08-22
PH12014501375A1 (en) 2014-09-22
PH12014501375B1 (en) 2014-09-22
JP5858050B2 (en) 2016-02-10
WO2013094399A1 (en) 2013-06-27
EP2796243A4 (en) 2015-09-09
EP2796243B1 (en) 2017-05-17
US20140331567A1 (en) 2014-11-13
EP2796243A1 (en) 2014-10-29
CN104010770B (en) 2017-07-21
CN104010770A (en) 2014-08-27
MY177685A (en) 2020-09-23
JPWO2013094399A1 (en) 2015-04-27

Similar Documents

Publication Publication Date Title
SG11201403191PA (en) Abrasive material regeneration method and regenerated abrasive material
GB2493398B (en) Methods and apparatus for selectively combining particulate material
HK1200678A1 (en) Apparatus, systems, and methods for grinding a material
IL231935A0 (en) Polishing pad and method for producing same
ZA201400656B (en) Track-module apparatus and open drive wheel therefor
EP2604323A4 (en) Honeycomb filter and production method for same
IL227593A (en) Method for preparing noribogaine from voacangine and purification thereof
EP2689770A4 (en) Damaged hair-improving agent and method for improving damaged hair using same
EP2693459A4 (en) Polishing composition and polishing method
ZA201403625B (en) Method for manufacturing spheroidal alumina particles
SG11201404444TA (en) Abrasive regeneration method
EP2738688A4 (en) Method and apparatus for file system cleaning and storage medium thereof
PT2377649E (en) Abrasive and abrasive method
EP2711514A4 (en) Method for manually renewing particulate filter
SG11201404446VA (en) Abrasive regeneration method
SG11201403175PA (en) Method for separating polishing material and regenerated polishing material
EP2692138A4 (en) Apparatus and methods for selective block decoding
EP2730372A4 (en) Grinding disc and grinding method
SI2739725T1 (en) Method for purifying virus-like particles
EP2699351A4 (en) System and method for catalyst regeneration
GB201117243D0 (en) Method and apparatus for grinding
GB201021072D0 (en) Method for controlling the regeneration process in lnt devices
SG11201401813PA (en) Recycling method for polishing agent
EP2762182A4 (en) Protector and method for using same
EP2720810A4 (en) System and method for segregating diamonds