[go: up one dir, main page]

SG11201400840UA - Microelectronic substrate cleaning compositions having copper/azole polymer inhibition - Google Patents

Microelectronic substrate cleaning compositions having copper/azole polymer inhibition

Info

Publication number
SG11201400840UA
SG11201400840UA SG11201400840UA SG11201400840UA SG11201400840UA SG 11201400840U A SG11201400840U A SG 11201400840UA SG 11201400840U A SG11201400840U A SG 11201400840UA SG 11201400840U A SG11201400840U A SG 11201400840UA SG 11201400840U A SG11201400840U A SG 11201400840UA
Authority
SG
Singapore
Prior art keywords
copper
cleaning compositions
substrate cleaning
microelectronic substrate
azole polymer
Prior art date
Application number
SG11201400840UA
Inventor
Chien-Pin Sherman Hsu
Original Assignee
Avantor Performance Mat Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avantor Performance Mat Inc filed Critical Avantor Performance Mat Inc
Publication of SG11201400840UA publication Critical patent/SG11201400840UA/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/425Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/0005Other compounding ingredients characterised by their effect
    • C11D3/0073Anticorrosion compositions
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/26Organic compounds containing oxygen
    • C11D7/261Alcohols; Phenols
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/26Organic compounds containing oxygen
    • C11D7/265Carboxylic acids or salts thereof
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/32Organic compounds containing nitrogen
    • C11D7/3281Heterocyclic compounds
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/34Organic compounds containing sulfur
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50Solvents
    • C11D7/5004Organic solvents
    • C11D7/5022Organic solvents containing oxygen
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02057Cleaning during device manufacture
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105After-treatment
    • H01L21/311Etching the insulating layers by chemical or physical means
    • H01L21/31127Etching organic layers
    • H01L21/31133Etching organic layers by chemical means
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10Objects to be cleaned
    • C11D2111/14Hard surfaces
    • C11D2111/22Electronic devices, e.g. PCBs or semiconductors
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/26Organic compounds containing oxygen
    • C11D7/263Ethers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Emergency Medicine (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
SG11201400840UA 2011-10-05 2012-10-05 Microelectronic substrate cleaning compositions having copper/azole polymer inhibition SG11201400840UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161626915P 2011-10-05 2011-10-05
PCT/US2012/058976 WO2013052809A1 (en) 2011-10-05 2012-10-05 Microelectronic substrate cleaning compositions having copper/azole polymer inhibition

Publications (1)

Publication Number Publication Date
SG11201400840UA true SG11201400840UA (en) 2014-04-28

Family

ID=48044188

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201400840UA SG11201400840UA (en) 2011-10-05 2012-10-05 Microelectronic substrate cleaning compositions having copper/azole polymer inhibition

Country Status (10)

Country Link
US (1) US10133180B2 (en)
EP (1) EP2764079A4 (en)
JP (1) JP6033314B2 (en)
KR (1) KR101999641B1 (en)
CN (1) CN103975052B (en)
IL (1) IL231874A0 (en)
MY (1) MY172099A (en)
PH (1) PH12014500719B1 (en)
SG (1) SG11201400840UA (en)
WO (1) WO2013052809A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013071475A1 (en) * 2011-11-14 2013-05-23 广州天至环保科技有限公司 Aqueous phase pore sealing agent improving pcb coating oxidation-resistant and corrosion-resistant properties and method for using same
TWI518467B (en) * 2013-11-15 2016-01-21 達興材料股份有限公司 Photoresist stripper composition, electronic device and method of fabricating the same
KR101976885B1 (en) * 2014-11-07 2019-05-10 삼성에스디아이 주식회사 Cleaning composition after chemical mechanical polishing of organic film and cleaning method using the same
US10233413B2 (en) * 2015-09-23 2019-03-19 Versum Materials Us, Llc Cleaning formulations
CN107980105B (en) * 2016-11-29 2019-10-18 松下知识产权经营株式会社 Anticorrosive additive stripping liquid controlling
WO2018122992A1 (en) * 2016-12-28 2018-07-05 パナソニックIpマネジメント株式会社 Resist removal solution
EP3986997A4 (en) * 2019-06-19 2023-07-19 Versum Materials US, LLC CLEANING COMPOSITION FOR SEMICONDUCTOR SUBSTRATES
US11214762B2 (en) 2019-08-05 2022-01-04 Chem-Trend Limited Partnership Compositions and methods for cleaning urethane molds
JP2022549372A (en) * 2019-09-30 2022-11-24 バーサム マテリアルズ ユーエス,リミティド ライアビリティ カンパニー photoresist remover

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7135445B2 (en) * 2001-12-04 2006-11-14 Ekc Technology, Inc. Process for the use of bis-choline and tris-choline in the cleaning of quartz-coated polysilicon and other materials
US6413923B2 (en) * 1999-11-15 2002-07-02 Arch Specialty Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
DE60108286T2 (en) 2000-03-27 2005-12-29 Shipley Co., L.L.C., Marlborough Removal agent for polymer
US6455479B1 (en) * 2000-08-03 2002-09-24 Shipley Company, L.L.C. Stripping composition
US6558879B1 (en) * 2000-09-25 2003-05-06 Ashland Inc. Photoresist stripper/cleaner compositions containing aromatic acid inhibitors
KR100438015B1 (en) 2001-10-10 2004-06-30 엘지.필립스 엘시디 주식회사 Cu-compatible Resist removing composition
JP2003129089A (en) 2001-10-24 2003-05-08 Daikin Ind Ltd Cleaning composition
WO2003064581A1 (en) 2002-01-28 2003-08-07 Ekc Technology, Inc. Methods and compositions for chemically treating a substrate using foam technology
US20040055621A1 (en) 2002-09-24 2004-03-25 Air Products And Chemicals, Inc. Processing of semiconductor components with dense processing fluids and ultrasonic energy
EP1505146A1 (en) 2003-08-05 2005-02-09 Air Products And Chemicals, Inc. Processing of substrates with dense fluids comprising acetylenic diols and/or alcohols
US20050032657A1 (en) 2003-08-06 2005-02-10 Kane Sean Michael Stripping and cleaning compositions for microelectronics
US7384900B2 (en) 2003-08-27 2008-06-10 Lg Display Co., Ltd. Composition and method for removing copper-compatible resist
ATE488570T1 (en) * 2004-03-01 2010-12-15 Mallinckrodt Baker Inc NANOELECTRONICS AND MICROELECTRONICS CLEANERS
US8030263B2 (en) * 2004-07-01 2011-10-04 Air Products And Chemicals, Inc. Composition for stripping and cleaning and use thereof
CA2573788A1 (en) 2004-07-15 2006-02-23 Mallinckrodt Baker, Inc. Non-aqueous microelectronic cleaning compositions containing fructose
US20060094612A1 (en) * 2004-11-04 2006-05-04 Mayumi Kimura Post etch cleaning composition for use with substrates having aluminum
KR20060064441A (en) 2004-12-08 2006-06-13 말린크로트 베이커, 인코포레이티드 Non-Aqueous Non-Corrosive Microelectronic Cleaning Compositions
PT1828848E (en) 2004-12-10 2010-05-21 Mallinckrodt Baker Inc Non-aqueous, non-corrosive microelectronic cleaning compositions containing polymeric corrosion inhibitors
EP1701218A3 (en) 2005-03-11 2008-10-15 Rohm and Haas Electronic Materials LLC Polymer remover
WO2006110645A2 (en) 2005-04-11 2006-10-19 Advanced Technology Materials, Inc. Fluoride liquid cleaners with polar and non-polar solvent mixtures for cleaning low-k-containing microelectronic devices
WO2006133253A1 (en) 2005-06-07 2006-12-14 Advanced Technology Materials, Inc. Metal and dielectric compatible sacrificial anti-reflective coating cleaning and removal composition
JP4741315B2 (en) 2005-08-11 2011-08-03 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. Polymer removal composition
GB2445505A (en) 2005-09-30 2008-07-09 Peratech Ltd Fabric bag including control device
EP1932174A4 (en) 2005-10-05 2009-09-23 Advanced Tech Materials Oxidizing aqueous cleaner for the removal of post-etch residues
CN101496146A (en) 2005-10-05 2009-07-29 高级技术材料公司 Composition and method for selectively etching gate spacer oxide material
EP1945748A4 (en) 2005-10-13 2009-01-07 Advanced Tech Materials Metals compatible photoresist and/or sacrificial antireflective coating removal composition
WO2007120259A2 (en) 2005-11-08 2007-10-25 Advanced Technology Materials, Inc. Formulations for removing copper-containing post-etch residue from microelectronic devices
JP2009515055A (en) 2005-11-09 2009-04-09 アドバンスド テクノロジー マテリアルズ,インコーポレイテッド Compositions and methods for recycling semiconductor wafers having low-K dielectric material thereon
US20080139436A1 (en) * 2006-09-18 2008-06-12 Chris Reid Two step cleaning process to remove resist, etch residue, and copper oxide from substrates having copper and low-K dielectric material
US8685909B2 (en) 2006-09-21 2014-04-01 Advanced Technology Materials, Inc. Antioxidants for post-CMP cleaning formulations
US20080076688A1 (en) 2006-09-21 2008-03-27 Barnes Jeffrey A Copper passivating post-chemical mechanical polishing cleaning composition and method of use
WO2008039730A1 (en) 2006-09-25 2008-04-03 Advanced Technology Materials, Inc. Compositions and methods for the removal of photoresist for a wafer rework application
US20080125342A1 (en) 2006-11-07 2008-05-29 Advanced Technology Materials, Inc. Formulations for cleaning memory device structures
JP5072091B2 (en) * 2006-12-08 2012-11-14 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor device
US20100163788A1 (en) 2006-12-21 2010-07-01 Advanced Technology Materials, Inc. Liquid cleaner for the removal of post-etch residues
EP1975987A3 (en) 2007-03-31 2011-03-09 Advanced Technology Materials, Inc. Methods for stripping material for wafer reclamation
TWI454574B (en) * 2007-05-17 2014-10-01 Advanced Tech Materials Novel antioxidants for chemical mechanical polishing (post-CMP) cleaning formulations
US7933350B2 (en) 2007-10-30 2011-04-26 Telefonaktiebolaget Lm Ericsson (Publ) Channel-dependent frequency-domain scheduling in an orthogonal frequency division multiplexing communications system
KR20090072546A (en) 2007-12-28 2009-07-02 삼성전자주식회사 Composition for removing photoresist and method of manufacturing array substrate using same
US8110535B2 (en) * 2009-08-05 2012-02-07 Air Products And Chemicals, Inc. Semi-aqueous stripping and cleaning formulation for metal substrate and methods for using same
CN103003923A (en) * 2010-07-16 2013-03-27 高级技术材料公司 Aqueous cleaner for the removal of post-etch residues

Also Published As

Publication number Publication date
JP2014534627A (en) 2014-12-18
CN103975052A (en) 2014-08-06
WO2013052809A1 (en) 2013-04-11
US20140249065A1 (en) 2014-09-04
PH12014500719A1 (en) 2014-05-12
US10133180B2 (en) 2018-11-20
MY172099A (en) 2019-11-13
CN103975052B (en) 2016-11-09
EP2764079A4 (en) 2015-06-03
IL231874A0 (en) 2014-05-28
EP2764079A1 (en) 2014-08-13
KR101999641B1 (en) 2019-07-12
PH12014500719B1 (en) 2020-11-25
KR20140082713A (en) 2014-07-02
JP6033314B2 (en) 2016-11-30

Similar Documents

Publication Publication Date Title
IL231874A0 (en) Microelectronic substrate cleaning compositions having copper/azole polymer inhibition
SG10201500387RA (en) Cleaning agent for semiconductor provided with metal wiring
TWI372791B (en) Etching compositions for copper-containing materials
HK1201186A1 (en) Solid compositions comprising an hcv inhibitor hcv
DK2704743T3 (en) Compositions for inhibiting masp-2 dependent complement acitivation
EP2869977A4 (en) High performance silicon based coating compositions
GB2484134B (en) Cleaning compositions
SG10201605687VA (en) Process for cleaning wafers
GB2491810B (en) Organic semiconductor compositions
PL2614097T3 (en) Erosion-resistant coating compositions
EP2632237A4 (en) Wiring substrate
EP2647693A4 (en) Substrate cleaner for copper wiring, and method for cleaning copper wiring semiconductor substrate
PT2526179T (en) Hydrochlorofluoroolefin-based cleaning compositions
ZA201404398B (en) Drier for auto-oxidisable coating compositions
GB2505594B (en) Microelectronic substrate for alternate package functionality
ZA201404274B (en) Drier for auto-oxidisable coating compositions
EP2626408A4 (en) Detergent compositions
GB201520518D0 (en) Improvements for electrical circuits
EP2698684A4 (en) Semiconductor integrated circuit
HK1179641A1 (en) Fluoropolymer coating compositions
GB0912201D0 (en) Coating compositions
GB2497664B (en) Substrates for semiconductor devices
EP2690941A4 (en) Wiring substrate
EP2545152A4 (en) Functional additives for cleansing compositions
GB201222325D0 (en) Substrates for semiconductor devices