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SG107094A1 - Glass substrate for magnetic recording medium production method thereof, and magnetic recording medium using the substrate - Google Patents

Glass substrate for magnetic recording medium production method thereof, and magnetic recording medium using the substrate

Info

Publication number
SG107094A1
SG107094A1 SG200200481A SG200200481A SG107094A1 SG 107094 A1 SG107094 A1 SG 107094A1 SG 200200481 A SG200200481 A SG 200200481A SG 200200481 A SG200200481 A SG 200200481A SG 107094 A1 SG107094 A1 SG 107094A1
Authority
SG
Singapore
Prior art keywords
recording medium
magnetic recording
substrate
production method
glass substrate
Prior art date
Application number
SG200200481A
Inventor
Shimada Takashi
Hibino Kunio
Itou Kenta
Original Assignee
Fuji Electric Co Ltd
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd, Matsushita Electric Ind Co Ltd filed Critical Fuji Electric Co Ltd
Publication of SG107094A1 publication Critical patent/SG107094A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0056—Control means for lapping machines or devices taking regard of the pH-value of lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/002—Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B23/00—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture
    • G11B23/0014—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture record carriers not specifically of filamentary or web form
    • G11B23/0021—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture record carriers not specifically of filamentary or web form discs
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Surface Treatment Of Glass (AREA)
  • Magnetic Record Carriers (AREA)
SG200200481A 2001-01-24 2002-01-24 Glass substrate for magnetic recording medium production method thereof, and magnetic recording medium using the substrate SG107094A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001016279A JP2002219642A (en) 2001-01-24 2001-01-24 Glass substrate for magnetic recording medium, method for manufacturing the same, and magnetic recording medium using the substrate

Publications (1)

Publication Number Publication Date
SG107094A1 true SG107094A1 (en) 2004-11-29

Family

ID=18882680

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200200481A SG107094A1 (en) 2001-01-24 2002-01-24 Glass substrate for magnetic recording medium production method thereof, and magnetic recording medium using the substrate

Country Status (3)

Country Link
US (1) US20020142707A1 (en)
JP (1) JP2002219642A (en)
SG (1) SG107094A1 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4090247B2 (en) * 2002-02-12 2008-05-28 株式会社荏原製作所 Substrate processing equipment
MY138480A (en) * 2002-05-09 2009-06-30 Maxtor Corp Method of simultaneous two-disk processing of single-sided magnetic recording disks
US7600359B2 (en) * 2002-05-09 2009-10-13 Seagate Technology Llc Method of merging two disks concentrically without gap between disks
US7180709B2 (en) * 2002-05-09 2007-02-20 Maxtor Corporation Information-storage media with dissimilar outer diameter and/or inner diameter chamfer designs on two sides
US7628895B2 (en) * 2002-05-09 2009-12-08 Seagate Technology Llc W-patterned tools for transporting/handling pairs of disks
US7083871B2 (en) 2002-05-09 2006-08-01 Maxtor Corporation Single-sided sputtered magnetic recording disks
US7748532B2 (en) * 2002-10-10 2010-07-06 Seagate Technology Llc Cassette for holding disks of different diameters
JP3940693B2 (en) * 2003-02-24 2007-07-04 日本ミクロコーティング株式会社 Magnetic hard disk substrate and manufacturing method thereof
JP3534115B1 (en) * 2003-04-02 2004-06-07 住友電気工業株式会社 Edge-polished nitride semiconductor substrate, edge-polished GaN free-standing substrate, and edge processing method for nitride semiconductor substrate
US7682653B1 (en) * 2004-06-17 2010-03-23 Seagate Technology Llc Magnetic disk with uniform lubricant thickness distribution
US7355814B1 (en) 2004-09-02 2008-04-08 Maxtor Corporation Disk texture located in load/unload zone of disk for cleaning contamination and disk lubricant from head ABS surface
US7882616B1 (en) 2004-09-02 2011-02-08 Seagate Technology Llc Manufacturing single-sided storage media
JP2009532210A (en) * 2006-03-30 2009-09-10 アプライド マテリアルズ インコーポレイテッド Method and apparatus for polishing an edge of a substrate
JP2008112497A (en) * 2006-10-30 2008-05-15 Fujitsu Ltd Disc end face burnishing device and disc end face burnishing method
US8142260B2 (en) 2007-05-21 2012-03-27 Applied Materials, Inc. Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads
JP2008306180A (en) * 2007-05-21 2008-12-18 Applied Materials Inc Method and apparatus for controlling polishing profile of film on slope and edge of substrate
JP2009004765A (en) * 2007-05-21 2009-01-08 Applied Materials Inc Method and apparatus for using rolling backing pad for substrate polishing
WO2009104614A1 (en) * 2008-02-22 2009-08-27 日本ミクロコーティング株式会社 Method and apparatus for polishing outer circumferential end section of semiconductor wafer
WO2010029878A1 (en) * 2008-09-10 2010-03-18 Hoya株式会社 Method for manufacturing glass substrate for magnetic disc, glass substrate for magnetic disc, method for manufacturing magnetic disc, and magnetic disc
JP5352331B2 (en) * 2009-04-15 2013-11-27 ダイトエレクトロン株式会社 Wafer chamfering method
JP5464497B2 (en) * 2010-08-19 2014-04-09 株式会社サンシン Substrate polishing method and apparatus
US8986072B2 (en) * 2011-05-26 2015-03-24 Corning Incorporated Methods of finishing an edge of a glass sheet
JP5925539B2 (en) * 2012-03-16 2016-05-25 ＡｖａｎＳｔｒａｔｅ株式会社 Manufacturing method of glass plate
TWI663018B (en) * 2012-09-24 2019-06-21 日商荏原製作所股份有限公司 Grinding method and grinding device
US9339912B2 (en) 2013-01-31 2016-05-17 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer polishing tool using abrasive tape

Also Published As

Publication number Publication date
JP2002219642A (en) 2002-08-06
US20020142707A1 (en) 2002-10-03

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