SG103296A1 - Thin film transistors and semiconductor device - Google Patents
Thin film transistors and semiconductor deviceInfo
- Publication number
- SG103296A1 SG103296A1 SG200103453A SG200103453A SG103296A1 SG 103296 A1 SG103296 A1 SG 103296A1 SG 200103453 A SG200103453 A SG 200103453A SG 200103453 A SG200103453 A SG 200103453A SG 103296 A1 SG103296 A1 SG 103296A1
- Authority
- SG
- Singapore
- Prior art keywords
- thin film
- semiconductor device
- film transistors
- transistors
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6731—Top-gate only TFTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02595—Microstructure polycrystalline
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02609—Crystal orientation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02672—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using crystallisation enhancing elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0312—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
- H10D30/0314—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral top-gate TFTs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0321—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Recrystallisation Techniques (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000176188 | 2000-06-12 | ||
JP2000176173 | 2000-06-12 | ||
JP2000177641 | 2000-06-13 | ||
JP2000177652 | 2000-06-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG103296A1 true SG103296A1 (en) | 2004-04-29 |
Family
ID=27481357
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200407844-0A SG152040A1 (en) | 2000-06-12 | 2001-06-11 | Thin film transistors and semiconductor device |
SG200103453A SG103296A1 (en) | 2000-06-12 | 2001-06-11 | Thin film transistors and semiconductor device |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200407844-0A SG152040A1 (en) | 2000-06-12 | 2001-06-11 | Thin film transistors and semiconductor device |
Country Status (7)
Country | Link |
---|---|
US (2) | US6690068B2 (en) |
EP (1) | EP1164635A3 (en) |
KR (1) | KR100820248B1 (en) |
CN (1) | CN1346152A (en) |
MY (1) | MY124509A (en) |
SG (2) | SG152040A1 (en) |
TW (1) | TWI263336B (en) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4056571B2 (en) * | 1995-08-02 | 2008-03-05 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
US6335445B1 (en) * | 1997-03-24 | 2002-01-01 | Societe De Conseils De Recherches Et D'applications Scientifiques (S.C.R.A.S.) | Derivatives of 2-(iminomethyl)amino-phenyl, their preparation, their use as medicaments and the pharmaceutical compositions containing them |
TWI263336B (en) | 2000-06-12 | 2006-10-01 | Semiconductor Energy Lab | Thin film transistors and semiconductor device |
JP2002083974A (en) | 2000-06-19 | 2002-03-22 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
US6828587B2 (en) * | 2000-06-19 | 2004-12-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US7503975B2 (en) * | 2000-06-27 | 2009-03-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and fabrication method therefor |
US6703265B2 (en) * | 2000-08-02 | 2004-03-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
US7045444B2 (en) * | 2000-12-19 | 2006-05-16 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device that includes selectively adding a noble gas element |
JP4993810B2 (en) * | 2001-02-16 | 2012-08-08 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
US7052943B2 (en) * | 2001-03-16 | 2006-05-30 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device |
JP4718700B2 (en) * | 2001-03-16 | 2011-07-06 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
US6855584B2 (en) * | 2001-03-29 | 2005-02-15 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device |
JP4854866B2 (en) * | 2001-04-27 | 2012-01-18 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
US6479313B1 (en) * | 2001-05-25 | 2002-11-12 | Kopin Corporation | Method of manufacturing GaN-based p-type compound semiconductors and light emitting diodes |
WO2002101833A1 (en) * | 2001-06-07 | 2002-12-19 | Amberwave Systems Corporation | Multiple gate insulators with strained semiconductor heterostructures |
TW550648B (en) * | 2001-07-02 | 2003-09-01 | Semiconductor Energy Lab | Semiconductor device and method of manufacturing the same |
JP4267266B2 (en) * | 2001-07-10 | 2009-05-27 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
US7238557B2 (en) * | 2001-11-14 | 2007-07-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of fabricating the same |
US6994083B2 (en) * | 2001-12-21 | 2006-02-07 | Trudell Medical International | Nebulizer apparatus and method |
KR100466964B1 (en) * | 2001-12-27 | 2005-01-24 | 엘지.필립스 엘시디 주식회사 | Method of manufacturing for poly-Silicone thin layer |
KR100864493B1 (en) * | 2002-05-23 | 2008-10-20 | 삼성전자주식회사 | Surface treatment method of silicon layer and manufacturing method of thin film transistor substrate using same |
DE10236738B9 (en) * | 2002-08-09 | 2010-07-15 | Carl Zeiss Nts Gmbh | Electron microscopy system and electron microscopy method |
US6861338B2 (en) * | 2002-08-22 | 2005-03-01 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor and method of manufacturing the same |
US20050236616A1 (en) * | 2004-04-26 | 2005-10-27 | Horng-Huei Tseng | Reliable semiconductor structure and method for fabricating |
DE102005047081B4 (en) * | 2005-09-30 | 2019-01-31 | Robert Bosch Gmbh | Process for the plasma-free etching of silicon with the etching gas ClF3 or XeF2 |
EP2381745A1 (en) * | 2006-09-07 | 2011-10-26 | Saint-Gobain Glass France | Substrate for organic electroluminescent device, use and method for manufacturing said substrate, as well as an organic electroluminescent device |
KR20090091175A (en) * | 2006-11-17 | 2009-08-26 | 쌩-고벵 글래스 프랑스 | Electrode for organic light emitting device, acid etching and organic light emitting device comprising same |
KR100883350B1 (en) * | 2006-12-04 | 2009-02-11 | 한국전자통신연구원 | Schottky Barrier Thin Film Transistor Manufacturing Method |
FR2913146B1 (en) * | 2007-02-23 | 2009-05-01 | Saint Gobain | DISCONTINUOUS ELECTRODE, ORGANIC ELECTROLUMINESCENCE DEVICE INCORPORATING THE SAME, AND THEIR MANUFACTURING |
US7972943B2 (en) * | 2007-03-02 | 2011-07-05 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
KR100982395B1 (en) * | 2007-04-25 | 2010-09-14 | 주식회사 엘지화학 | Thin film transistor and method for manufacturing same |
FR2924274B1 (en) * | 2007-11-22 | 2012-11-30 | Saint Gobain | SUBSTRATE CARRYING AN ELECTRODE, ORGANIC ELECTROLUMINESCENT DEVICE INCORPORATING IT, AND MANUFACTURING THE SAME |
JP5395415B2 (en) | 2007-12-03 | 2014-01-22 | 株式会社半導体エネルギー研究所 | Method for manufacturing thin film transistor |
FR2925981B1 (en) * | 2007-12-27 | 2010-02-19 | Saint Gobain | CARRIER SUBSTRATE OF AN ELECTRODE, ORGANIC ELECTROLUMINESCENT DEVICE INCORPORATING IT. |
JP5527966B2 (en) * | 2007-12-28 | 2014-06-25 | 株式会社半導体エネルギー研究所 | Thin film transistor |
KR101015847B1 (en) * | 2008-01-18 | 2011-02-23 | 삼성모바일디스플레이주식회사 | Thin film transistor, manufacturing method thereof and organic light emitting display device having same |
FR2936358B1 (en) | 2008-09-24 | 2011-01-21 | Saint Gobain | PROCESS FOR MANUFACTURING SUBMILLIMETRIC MOLDED MASKS FOR SUBMILLIMETRIC ELECTROCONDUCTIVE GRID, SUBMILLIMETRIC MOLDING MASK, SUBMILLIMETRIC ELECTROCONDUCTIVE GRID. |
FR2936362B1 (en) | 2008-09-25 | 2010-09-10 | Saint Gobain | METHOD FOR MANUFACTURING AN ELECTROCONDUCTIVE SUBMILLIMETRIC GRID COATED WITH A SURGRILLE GRID, ELECTROCONDUCTIVE SUBMILLIMETER GRID COVERED WITH AN OVERGRILL |
US20100081251A1 (en) * | 2008-09-29 | 2010-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing soi substrate |
FR2944145B1 (en) | 2009-04-02 | 2011-08-26 | Saint Gobain | METHOD FOR MANUFACTURING TEXTURED SURFACE STRUCTURE FOR ORGANIC ELECTROLUMINESCENT DIODE DEVICE AND STRUCTURE WITH TEXTURED SURFACE |
KR101592016B1 (en) * | 2009-07-08 | 2016-02-05 | 삼성디스플레이 주식회사 | Polarizer and liquid crystal display device having the same |
WO2011004724A1 (en) * | 2009-07-10 | 2011-01-13 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
FR2955575B1 (en) | 2010-01-22 | 2012-02-24 | Saint Gobain | GLASS SUBSTRATE COATED WITH A HIGH INDEX LAYER UNDER AN ELECTRODE COATING AND ORGANIC ELECTROLUMINESCENT DEVICE COMPRISING SUCH A SUBSTRATE. |
JP5595054B2 (en) * | 2010-01-29 | 2014-09-24 | 株式会社日立ハイテクサイエンス | Electron microscope and sample analysis method |
KR101926646B1 (en) | 2010-04-16 | 2018-12-07 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Electrode for energy storage device and method for manufacturing the same |
KR102148834B1 (en) * | 2015-12-30 | 2020-08-28 | 베이징 이타운 세미컨덕터 테크놀로지 컴퍼니 리미티드 | Gas flow control for millisecond annealing systems |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19825081A1 (en) * | 1997-06-06 | 1998-12-10 | Semiconductor Energy Lab | Semiconductor thin film useful for TFT |
DE19833237A1 (en) * | 1997-07-23 | 1999-01-28 | Semiconductor Energy Lab | Semiconductor thin film and semiconductor device |
JPH11354443A (en) * | 1997-06-10 | 1999-12-24 | Semiconductor Energy Lab Co Ltd | Semiconductor thin film and semiconductor device |
US6452211B1 (en) * | 1997-06-10 | 2002-09-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor thin film and semiconductor device |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0658966B2 (en) | 1982-05-17 | 1994-08-03 | キヤノン株式会社 | Semiconductor element |
JPH02219234A (en) | 1989-02-20 | 1990-08-31 | Seiko Epson Corp | Semiconductor device |
US5162933A (en) | 1990-05-16 | 1992-11-10 | Nippon Telegraph And Telephone Corporation | Active matrix structure for liquid crystal display elements wherein each of the gate/data lines includes at least a molybdenum-base alloy layer containing 0.5 to 10 wt. % of chromium |
JP2840699B2 (en) | 1990-12-12 | 1998-12-24 | 株式会社 半導体エネルギー研究所 | Film forming apparatus and film forming method |
JP3131239B2 (en) * | 1991-04-25 | 2001-01-31 | キヤノン株式会社 | Wiring for semiconductor circuit device and semiconductor circuit device |
JPH04349619A (en) * | 1991-05-28 | 1992-12-04 | Nippondenso Co Ltd | Manufacture of single crystal semiconductor film |
JPH06349735A (en) | 1993-06-12 | 1994-12-22 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
US6808965B1 (en) | 1993-07-26 | 2004-10-26 | Seiko Epson Corporation | Methodology for fabricating a thin film transistor, including an LDD region, from amorphous semiconductor film deposited at 530° C. or less using low pressure chemical vapor deposition |
JPH0786602A (en) * | 1993-09-10 | 1995-03-31 | Fujitsu Ltd | Method of manufacturing thin film transistor |
JP3431033B2 (en) | 1993-10-29 | 2003-07-28 | 株式会社半導体エネルギー研究所 | Semiconductor fabrication method |
US5923962A (en) | 1993-10-29 | 1999-07-13 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a semiconductor device |
TW264575B (en) | 1993-10-29 | 1995-12-01 | Handotai Energy Kenkyusho Kk | |
JP2860869B2 (en) * | 1993-12-02 | 1999-02-24 | 株式会社半導体エネルギー研究所 | Semiconductor device and manufacturing method thereof |
TW251379B (en) | 1994-01-28 | 1995-07-11 | Nat Science Committee | Process of polysilicon, Ge or Si-Ge thin film transistor |
JP3464287B2 (en) | 1994-09-05 | 2003-11-05 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
US5985703A (en) | 1994-10-24 | 1999-11-16 | Banerjee; Sanjay | Method of making thin film transistors |
JPH08271880A (en) | 1995-04-03 | 1996-10-18 | Toshiba Corp | Light-shielding film, liquid crystal display device, and material for forming light-shielding film |
JP3204489B2 (en) * | 1995-09-19 | 2001-09-04 | シャープ株式会社 | Method for manufacturing semiconductor device |
TW310478B (en) | 1995-12-08 | 1997-07-11 | Nat Science Council | A method to fabricate thin film transistor |
US5943560A (en) | 1996-04-19 | 1999-08-24 | National Science Council | Method to fabricate the thin film transistor |
JP4282778B2 (en) | 1997-08-05 | 2009-06-24 | 株式会社半導体エネルギー研究所 | Semiconductor device |
JP4601731B2 (en) | 1997-08-26 | 2010-12-22 | 株式会社半導体エネルギー研究所 | Semiconductor device, electronic device having semiconductor device, and method for manufacturing semiconductor device |
JP4115589B2 (en) * | 1997-10-17 | 2008-07-09 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
TW408351B (en) * | 1997-10-17 | 2000-10-11 | Semiconductor Energy Lab | Semiconductor device and method of manufacturing the same |
JP4068219B2 (en) | 1997-10-21 | 2008-03-26 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
JPH11204434A (en) | 1998-01-12 | 1999-07-30 | Semiconductor Energy Lab Co Ltd | Semiconductor device and manufacturing method thereof |
JPH11233788A (en) | 1998-02-09 | 1999-08-27 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
JP4489201B2 (en) | 1998-02-18 | 2010-06-23 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
JP4115584B2 (en) | 1998-03-27 | 2008-07-09 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
JP4493749B2 (en) * | 1998-07-15 | 2010-06-30 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
JP4841740B2 (en) * | 2000-04-26 | 2011-12-21 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
TWI263336B (en) | 2000-06-12 | 2006-10-01 | Semiconductor Energy Lab | Thin film transistors and semiconductor device |
JP2002083974A (en) * | 2000-06-19 | 2002-03-22 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
US6828587B2 (en) | 2000-06-19 | 2004-12-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US6703265B2 (en) | 2000-08-02 | 2004-03-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
JP2002176180A (en) * | 2000-12-06 | 2002-06-21 | Hitachi Ltd | Thin film semiconductor device and method of manufacturing the same |
-
2001
- 2001-05-31 TW TW090113144A patent/TWI263336B/en not_active IP Right Cessation
- 2001-06-06 US US09/874,204 patent/US6690068B2/en not_active Expired - Lifetime
- 2001-06-11 KR KR1020010032440A patent/KR100820248B1/en not_active IP Right Cessation
- 2001-06-11 SG SG200407844-0A patent/SG152040A1/en unknown
- 2001-06-11 MY MYPI20012712 patent/MY124509A/en unknown
- 2001-06-11 SG SG200103453A patent/SG103296A1/en unknown
- 2001-06-12 CN CN01124907A patent/CN1346152A/en active Pending
- 2001-06-12 EP EP01114265A patent/EP1164635A3/en not_active Ceased
-
2003
- 2003-12-05 US US10/727,651 patent/US7307282B2/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19825081A1 (en) * | 1997-06-06 | 1998-12-10 | Semiconductor Energy Lab | Semiconductor thin film useful for TFT |
US6307214B1 (en) * | 1997-06-06 | 2001-10-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor thin film and semiconductor device |
JPH11354443A (en) * | 1997-06-10 | 1999-12-24 | Semiconductor Energy Lab Co Ltd | Semiconductor thin film and semiconductor device |
US6452211B1 (en) * | 1997-06-10 | 2002-09-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor thin film and semiconductor device |
DE19833237A1 (en) * | 1997-07-23 | 1999-01-28 | Semiconductor Energy Lab | Semiconductor thin film and semiconductor device |
US6087679A (en) * | 1997-07-23 | 2000-07-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor thin film and semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
MY124509A (en) | 2006-06-30 |
SG152040A1 (en) | 2009-05-29 |
EP1164635A3 (en) | 2004-09-29 |
KR20010112599A (en) | 2001-12-20 |
US6690068B2 (en) | 2004-02-10 |
TWI263336B (en) | 2006-10-01 |
US20020008286A1 (en) | 2002-01-24 |
US7307282B2 (en) | 2007-12-11 |
KR100820248B1 (en) | 2008-04-08 |
CN1346152A (en) | 2002-04-24 |
US20040108576A1 (en) | 2004-06-10 |
EP1164635A2 (en) | 2001-12-19 |
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