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SG10201913828UA - Continuous fluidic thermal interface material dispensing - Google Patents

Continuous fluidic thermal interface material dispensing

Info

Publication number
SG10201913828UA
SG10201913828UA SG10201913828UA SG10201913828UA SG10201913828UA SG 10201913828U A SG10201913828U A SG 10201913828UA SG 10201913828U A SG10201913828U A SG 10201913828UA SG 10201913828U A SG10201913828U A SG 10201913828UA SG 10201913828U A SG10201913828U A SG 10201913828UA
Authority
SG
Singapore
Prior art keywords
thermal interface
interface material
material dispensing
continuous fluidic
fluidic thermal
Prior art date
Application number
SG10201913828UA
Inventor
Samer Kabbani
Jerry Ihor Tustaniwskyj
James Wittman Babcock
Thomas Jones
Original Assignee
Delta Design Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Design Inc filed Critical Delta Design Inc
Publication of SG10201913828UA publication Critical patent/SG10201913828UA/en

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/30—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature
    • G05D23/32—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature with provision for adjustment of the effect of the auxiliary heating device, e.g. a function of time
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1902—Control of temperature characterised by the use of electric means characterised by the use of a variable reference value
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1919—Control of temperature characterised by the use of electric means characterised by the type of controller
    • G05D23/192—Control of temperature characterised by the use of electric means characterised by the type of controller using a modification of the thermal impedance between a source and the load
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
SG10201913828UA 2015-07-21 2016-07-14 Continuous fluidic thermal interface material dispensing SG10201913828UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201562195049P 2015-07-21 2015-07-21

Publications (1)

Publication Number Publication Date
SG10201913828UA true SG10201913828UA (en) 2020-03-30

Family

ID=56686889

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201913828UA SG10201913828UA (en) 2015-07-21 2016-07-14 Continuous fluidic thermal interface material dispensing

Country Status (8)

Country Link
US (1) US20170027084A1 (en)
EP (1) EP3326043A1 (en)
JP (1) JP2018523122A (en)
KR (1) KR20180033223A (en)
CN (1) CN107924204A (en)
SG (1) SG10201913828UA (en)
TW (1) TW201712459A (en)
WO (1) WO2017015052A1 (en)

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US11493551B2 (en) 2020-06-22 2022-11-08 Advantest Test Solutions, Inc. Integrated test cell using active thermal interposer (ATI) with parallel socket actuation
US11549981B2 (en) * 2020-10-01 2023-01-10 Advantest Test Solutions, Inc. Thermal solution for massively parallel testing
US11821913B2 (en) 2020-11-02 2023-11-21 Advantest Test Solutions, Inc. Shielded socket and carrier for high-volume test of semiconductor devices
US11808812B2 (en) 2020-11-02 2023-11-07 Advantest Test Solutions, Inc. Passive carrier-based device delivery for slot-based high-volume semiconductor test system
US20220155364A1 (en) 2020-11-19 2022-05-19 Advantest Test Solutions, Inc. Wafer scale active thermal interposer for device testing
US11609266B2 (en) 2020-12-04 2023-03-21 Advantest Test Solutions, Inc. Active thermal interposer device
US11573262B2 (en) 2020-12-31 2023-02-07 Advantest Test Solutions, Inc. Multi-input multi-zone thermal control for device testing
US11587640B2 (en) 2021-03-08 2023-02-21 Advantest Test Solutions, Inc. Carrier based high volume system level testing of devices with pop structures
US12235314B2 (en) 2021-09-14 2025-02-25 Advantest Test Solutions, Inc Parallel test cell with self actuated sockets
US11656273B1 (en) 2021-11-05 2023-05-23 Advantest Test Solutions, Inc. High current device testing apparatus and systems
EP4386398A1 (en) 2022-12-13 2024-06-19 Chroma ATE Inc. Multiphase thermal interface component, its method of manufacturing, and electronic device testing apparatus
WO2025040957A1 (en) * 2023-08-23 2025-02-27 Aem Singapore Pte. Ltd. Thermal control wafer with integrated heating-sensing elements

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Also Published As

Publication number Publication date
EP3326043A1 (en) 2018-05-30
JP2018523122A (en) 2018-08-16
CN107924204A (en) 2018-04-17
US20170027084A1 (en) 2017-01-26
KR20180033223A (en) 2018-04-02
TW201712459A (en) 2017-04-01
WO2017015052A1 (en) 2017-01-26

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