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SG10201705680XA - Hold checking method and unhold checking method for wafer - Google Patents

Hold checking method and unhold checking method for wafer

Info

Publication number
SG10201705680XA
SG10201705680XA SG10201705680XA SG10201705680XA SG10201705680XA SG 10201705680X A SG10201705680X A SG 10201705680XA SG 10201705680X A SG10201705680X A SG 10201705680XA SG 10201705680X A SG10201705680X A SG 10201705680XA SG 10201705680X A SG10201705680X A SG 10201705680XA
Authority
SG
Singapore
Prior art keywords
checking method
unhold
wafer
hold
checking
Prior art date
Application number
SG10201705680XA
Inventor
Chito Kenta
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201705680XA publication Critical patent/SG10201705680XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32697—Electrostatic control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
SG10201705680XA 2016-07-20 2017-07-11 Hold checking method and unhold checking method for wafer SG10201705680XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016142216A JP6697346B2 (en) 2016-07-20 2016-07-20 Adsorption confirmation method, desorption confirmation method, and decompression treatment device

Publications (1)

Publication Number Publication Date
SG10201705680XA true SG10201705680XA (en) 2018-02-27

Family

ID=60990106

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201705680XA SG10201705680XA (en) 2016-07-20 2017-07-11 Hold checking method and unhold checking method for wafer

Country Status (6)

Country Link
US (1) US10910246B2 (en)
JP (1) JP6697346B2 (en)
KR (1) KR102174879B1 (en)
CN (1) CN107644830B (en)
SG (1) SG10201705680XA (en)
TW (1) TWI727055B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6905382B2 (en) * 2017-04-14 2021-07-21 株式会社ディスコ Wafer loading / unloading method
US10825645B2 (en) * 2017-08-17 2020-11-03 Varian Semiconductor Equipment Associates, Inc. System and method for reduced workpiece adhesion due to electrostatic charge during removal from a processing station
KR102516885B1 (en) * 2018-05-10 2023-03-30 삼성전자주식회사 Deposition equipment and method of fabricating semiconductor device using the same
SG11202010268QA (en) * 2018-06-08 2020-12-30 Applied Materials Inc Apparatus for suppressing parasitic plasma in plasma enhanced chemical vapor deposition chamber
JP7052584B2 (en) * 2018-06-15 2022-04-12 東京エレクトロン株式会社 Plasma processing equipment and plasma processing method
JP6913060B2 (en) * 2018-07-24 2021-08-04 株式会社日立ハイテク Plasma processing equipment and plasma processing method
JP2020038907A (en) * 2018-09-04 2020-03-12 株式会社ディスコ Plasma processing equipment
JP7188992B2 (en) * 2018-11-27 2022-12-13 株式会社ディスコ Plasma etching equipment
JP7696840B2 (en) 2019-06-07 2025-06-23 アプライド マテリアルズ インコーポレイテッド Seamless wire conduit
CN114613657A (en) * 2020-12-09 2022-06-10 细美事有限公司 Control program, container, and semiconductor element manufacturing equipment for charging and automatic calibration of wafer-type sensors
JP7652484B2 (en) * 2021-03-08 2025-03-27 東京エレクトロン株式会社 SUBSTRATE PROCESSING APPARATUS AND ABNORMALITY DETECTION METHOD
US20220356027A1 (en) * 2021-05-04 2022-11-10 Applied Materials, Inc. Roller for transporting a flexible substrate, vacuum processing apparatus, and methods therefor
JP7675051B2 (en) * 2022-06-29 2025-05-12 東京エレクトロン株式会社 Plasma processing apparatus and plasma processing method
WO2024225020A1 (en) * 2023-04-27 2024-10-31 株式会社クリエイティブテクノロジー Workpiece holding device

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JPS63139634A (en) * 1986-11-29 1988-06-11 Tokuda Seisakusho Ltd Electrostatic chuck
JP2867526B2 (en) * 1990-01-16 1999-03-08 富士通株式会社 Semiconductor manufacturing equipment
JPH06224286A (en) * 1993-01-26 1994-08-12 Hitachi Ltd Attraction monitoring device of electrostatic attraction apparatus
JPH06291174A (en) * 1993-04-06 1994-10-18 Fuji Electric Co Ltd Electrostatic chuck, and method for adhering and holding semiconductor wafer to electrostatic chuck
JP2879887B2 (en) * 1995-08-24 1999-04-05 東京エレクトロン株式会社 Plasma processing method
JP3373762B2 (en) * 1997-08-22 2003-02-04 株式会社日立製作所 Electrostatic suction device and electron beam lithography device using the same
US6238160B1 (en) * 1998-12-02 2001-05-29 Taiwan Semiconductor Manufacturing Company, Ltd' Method for transporting and electrostatically chucking a semiconductor wafer or the like
JP3633854B2 (en) 2000-06-12 2005-03-30 株式会社ディスコ Semiconductor wafer processing equipment
JP4227865B2 (en) * 2003-08-12 2009-02-18 株式会社ディスコ Plasma etching method and plasma etching apparatus
JP2006202939A (en) * 2005-01-20 2006-08-03 Mitsubishi Heavy Ind Ltd Attraction method, releasing method, plasma processing method, electrostatic chuck, and plasma processing apparatus
JP4699061B2 (en) * 2005-03-25 2011-06-08 東京エレクトロン株式会社 Substrate removal method, substrate processing apparatus, program
US7535688B2 (en) * 2005-03-25 2009-05-19 Tokyo Electron Limited Method for electrically discharging substrate, substrate processing apparatus and program
JP2007281007A (en) * 2006-04-03 2007-10-25 Nikon Corp Substrate conveyance method, substrate conveyance apparatus and exposure apparatus
JP2008028021A (en) * 2006-07-19 2008-02-07 Disco Abrasive Syst Ltd Plasma etching apparatus and plasma etching method
US7750645B2 (en) * 2007-08-15 2010-07-06 Applied Materials, Inc. Method of wafer level transient sensing, threshold comparison and arc flag generation/deactivation
KR101127165B1 (en) * 2010-04-23 2012-03-20 청진테크 주식회사 A leakage current monitoring apparatus for an electrostatic chuck system
JP5592833B2 (en) * 2011-05-20 2014-09-17 株式会社日立ハイテクノロジーズ Charged particle beam device and electrostatic chuck device
JP6649689B2 (en) * 2015-03-16 2020-02-19 株式会社ディスコ Decompression processing apparatus and wafer holding method

Also Published As

Publication number Publication date
TWI727055B (en) 2021-05-11
US20180025928A1 (en) 2018-01-25
KR20180010133A (en) 2018-01-30
CN107644830A (en) 2018-01-30
JP2018014383A (en) 2018-01-25
JP6697346B2 (en) 2020-05-20
TW201812966A (en) 2018-04-01
CN107644830B (en) 2022-12-20
KR102174879B1 (en) 2020-11-05
US10910246B2 (en) 2021-02-02

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