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SG10201506731PA - Buffing apparatus, and substrate processing apparatus - Google Patents

Buffing apparatus, and substrate processing apparatus

Info

Publication number
SG10201506731PA
SG10201506731PA SG10201506731PA SG10201506731PA SG10201506731PA SG 10201506731P A SG10201506731P A SG 10201506731PA SG 10201506731P A SG10201506731P A SG 10201506731PA SG 10201506731P A SG10201506731P A SG 10201506731PA SG 10201506731P A SG10201506731P A SG 10201506731PA
Authority
SG
Singapore
Prior art keywords
substrate processing
buffing
processing apparatus
buffing apparatus
substrate
Prior art date
Application number
SG10201506731PA
Inventor
Kuniaki Yamaguchi
Toshio Mizuno
Itsuki Kobata
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2014171859A external-priority patent/JP6430177B2/en
Priority claimed from JP2014210949A external-priority patent/JP2016078156A/en
Priority claimed from JP2014248993A external-priority patent/JP2016111264A/en
Priority claimed from JP2014256473A external-priority patent/JP2016119333A/en
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201506731PA publication Critical patent/SG10201506731PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H10P72/0428—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/002—Grinding heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H10P72/0456—
    • H10P72/0458—
    • H10P72/0472—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
SG10201506731PA 2014-08-26 2015-08-25 Buffing apparatus, and substrate processing apparatus SG10201506731PA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014171859A JP6430177B2 (en) 2014-08-26 2014-08-26 Buff processing module and processing device
JP2014210949A JP2016078156A (en) 2014-10-15 2014-10-15 Processing module
JP2014248993A JP2016111264A (en) 2014-12-09 2014-12-09 Buff processing device and substrate processing device
JP2014256473A JP2016119333A (en) 2014-12-18 2014-12-18 Buff processing unit, and substrate processing apparatus

Publications (1)

Publication Number Publication Date
SG10201506731PA true SG10201506731PA (en) 2016-03-30

Family

ID=55401430

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201506731PA SG10201506731PA (en) 2014-08-26 2015-08-25 Buffing apparatus, and substrate processing apparatus

Country Status (5)

Country Link
US (1) US10183374B2 (en)
KR (1) KR102213468B1 (en)
CN (1) CN105390417B (en)
SG (1) SG10201506731PA (en)
TW (1) TWI702111B (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201902651QA (en) * 2016-10-18 2019-05-30 Ebara Corp Substrate processing control system, substrate processing control method, and program
JP6885754B2 (en) * 2017-03-09 2021-06-16 株式会社Ｓｃｒｅｅｎホールディングス Board processing method and board processing equipment
CN107471087A (en) * 2017-09-13 2017-12-15 武汉新芯集成电路制造有限公司 It is a kind of to prevent crystal column surface from the method damaged occur
US11515130B2 (en) * 2018-03-05 2022-11-29 Applied Materials, Inc. Fast response pedestal assembly for selective preclean
JP7098240B2 (en) * 2018-08-22 2022-07-11 株式会社ディスコ Abrasive pad
DE102018121626A1 (en) * 2018-09-05 2020-03-05 Rud. Starcke Gmbh & Co. Kg Polishing device
CN109015314A (en) * 2018-09-07 2018-12-18 杭州众硅电子科技有限公司 A kind of based CMP apparatus
CN110103119A (en) * 2018-09-20 2019-08-09 杭州众硅电子科技有限公司 A kind of polishing handling parts module
CN109148341A (en) * 2018-10-16 2019-01-04 杭州众硅电子科技有限公司 A kind of CMP wafer cleaning equipment
TWI718508B (en) 2019-03-25 2021-02-11 智勝科技股份有限公司 Polishing pad, manufacturing method of polishing pad and polishing method
KR102644399B1 (en) * 2019-06-05 2024-03-08 주식회사 케이씨텍 Substrate cleaning apparatus
KR102733484B1 (en) * 2020-11-05 2024-11-25 어플라이드 머티어리얼스, 인코포레이티드 Horizontal buffing module
CN112372509B (en) * 2020-11-11 2022-02-25 西安奕斯伟硅片技术有限公司 Method and apparatus for changing initial state of polishing pad to hydrophilicity
EP4404242A4 (en) * 2021-09-14 2025-10-22 Ebara Corp Substrate processing device and substrate processing method
JP7783107B2 (en) * 2022-03-30 2025-12-09 株式会社荏原製作所 Method and apparatus for polishing a workpiece
JP2024040031A (en) * 2022-09-12 2024-03-25 株式会社荏原製作所 Substrate processing equipment and protective layer formation method

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2309016A (en) * 1942-02-09 1943-01-19 Norton Co Composite grinding wheel
JP3114156B2 (en) 1994-06-28 2000-12-04 株式会社荏原製作所 Cleaning method and apparatus
JP3027551B2 (en) * 1997-07-03 2000-04-04 キヤノン株式会社 Substrate holding device, polishing method and polishing device using the substrate holding device
US5888120A (en) * 1997-09-29 1999-03-30 Lsi Logic Corporation Method and apparatus for chemical mechanical polishing
US6336849B1 (en) * 1998-02-04 2002-01-08 Koennemann Ronny Grinding spindle
JP2000141215A (en) * 1998-11-05 2000-05-23 Sony Corp Flattening polishing apparatus and flattening polishing method
JP4127346B2 (en) 1999-08-20 2008-07-30 株式会社荏原製作所 Polishing apparatus and method
JP2001237206A (en) 1999-12-15 2001-08-31 Matsushita Electric Ind Co Ltd Flattening method
US6248006B1 (en) * 2000-01-24 2001-06-19 Chartered Semiconductor Manufacturing Ltd. CMP uniformity
US6390905B1 (en) * 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
JP2001310254A (en) 2000-04-26 2001-11-06 Toshiba Mach Co Ltd Surface polishing device
WO2001098027A1 (en) * 2000-06-19 2001-12-27 Struers A/S A multi-zone grinding and/or polishing sheet
TW581716B (en) * 2001-06-29 2004-04-01 Applied Materials Inc Material for use in carrier and polishing pads
US6905398B2 (en) * 2001-09-10 2005-06-14 Oriol, Inc. Chemical mechanical polishing tool, apparatus and method
JP2003181759A (en) 2001-12-19 2003-07-02 Tokyo Seimitsu Co Ltd Apparatus and method for machining wafers
US6857947B2 (en) * 2002-01-17 2005-02-22 Asm Nutool, Inc Advanced chemical mechanical polishing system with smart endpoint detection
US7166015B2 (en) * 2002-06-28 2007-01-23 Lam Research Corporation Apparatus and method for controlling fluid material composition on a polishing pad
DE10322360A1 (en) * 2003-05-09 2004-11-25 Kadia Produktion Gmbh + Co. Device for finishing flat surfaces
KR100807046B1 (en) * 2003-11-26 2008-02-25 동부일렉트로닉스 주식회사 Chemical mechanical polishing equipment
CN105904335B (en) * 2004-11-01 2019-04-30 株式会社荏原制作所 Polissoir
US7014542B1 (en) * 2005-01-11 2006-03-21 Po Wen Lu Cutter for cutting and grinding optical lens in a single process
KR100693251B1 (en) * 2005-03-07 2007-03-13 삼성전자주식회사 Pad conditioner and chemical mechanical polishing apparatus using the same for improving polishing speed and roughness of polishing pad
JP5744382B2 (en) 2008-07-24 2015-07-08 株式会社荏原製作所 Substrate processing apparatus and substrate processing method
JP2010010351A (en) * 2008-06-26 2010-01-14 Nec Electronics Corp Retainer ring and chemical mechanical polishing equipment
JP5552401B2 (en) * 2010-09-08 2014-07-16 株式会社荏原製作所 Polishing apparatus and method
JP2014053355A (en) * 2012-09-05 2014-03-20 Disco Abrasive Syst Ltd Wafer processing method
JP2014223684A (en) * 2013-05-15 2014-12-04 株式会社東芝 Polishing device, and polishing method

Also Published As

Publication number Publication date
US10183374B2 (en) 2019-01-22
KR20160024797A (en) 2016-03-07
KR102213468B1 (en) 2021-02-08
CN105390417A (en) 2016-03-09
US20160059376A1 (en) 2016-03-03
TW201618898A (en) 2016-06-01
CN105390417B (en) 2020-04-07
TWI702111B (en) 2020-08-21

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