SG10201505726RA - Accommodation cassette - Google Patents
Accommodation cassetteInfo
- Publication number
- SG10201505726RA SG10201505726RA SG10201505726RA SG10201505726RA SG10201505726RA SG 10201505726R A SG10201505726R A SG 10201505726RA SG 10201505726R A SG10201505726R A SG 10201505726RA SG 10201505726R A SG10201505726R A SG 10201505726RA SG 10201505726R A SG10201505726R A SG 10201505726RA
- Authority
- SG
- Singapore
- Prior art keywords
- accommodation cassette
- accommodation
- cassette
- Prior art date
Links
- 230000004308 accommodation Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012143352A JP2014007344A (en) | 2012-06-26 | 2012-06-26 | Housing cassette |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201505726RA true SG10201505726RA (en) | 2015-08-28 |
Family
ID=49773516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201505726RA SG10201505726RA (en) | 2012-06-26 | 2013-06-12 | Accommodation cassette |
Country Status (6)
Country | Link |
---|---|
US (2) | US20130341239A1 (en) |
JP (1) | JP2014007344A (en) |
KR (1) | KR20140001111A (en) |
CN (1) | CN103515271A (en) |
SG (1) | SG10201505726RA (en) |
TW (1) | TW201400383A (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6189047B2 (en) * | 2013-02-18 | 2017-08-30 | 株式会社ディスコ | cassette |
US10566226B2 (en) * | 2014-11-11 | 2020-02-18 | Applied Materials, Inc. | Multi-cassette carrying case |
US11315815B2 (en) * | 2016-01-05 | 2022-04-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer container and method for holding wafer |
JP2019110157A (en) * | 2017-12-15 | 2019-07-04 | 株式会社ディスコ | cassette |
US10504762B2 (en) * | 2018-02-06 | 2019-12-10 | Applied Materials, Inc. | Bridging front opening unified pod (FOUP) |
JP7357453B2 (en) | 2019-03-07 | 2023-10-06 | 東京エレクトロン株式会社 | Substrate processing system and substrate transport method |
CN109968549B (en) * | 2019-04-08 | 2020-11-17 | 紫光宏茂微电子(上海)有限公司 | Lockable wafer placing frame |
US12165905B2 (en) * | 2019-05-20 | 2024-12-10 | Applied Materials, Inc. | Process kit enclosure system |
EP3748670B1 (en) * | 2019-06-04 | 2024-04-17 | Infineon Technologies AG | Transport system |
JP7344681B2 (en) * | 2019-06-18 | 2023-09-14 | 株式会社ディスコ | Wafer unit pop-out prevention jig |
JP7679136B2 (en) * | 2021-02-01 | 2025-05-19 | 東京エレクトロン株式会社 | Storage vessel, processing system and base plate |
KR102653120B1 (en) * | 2023-04-27 | 2024-04-01 | (주)한국엔지니어링 | Transferring material fixing apparatus and transporting cart comprising the same |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62139341A (en) * | 1985-12-13 | 1987-06-23 | Plasma Syst:Kk | Treating device for substrate and wafer surface |
JPS6356935A (en) * | 1986-08-27 | 1988-03-11 | Nikon Corp | Cassette for semiconductor wafer |
JPH04103653U (en) * | 1991-02-13 | 1992-09-07 | シヤープ株式会社 | Wafer frame cassette |
EP0573381B1 (en) * | 1992-06-03 | 2000-09-20 | Videcart, S.A. | Stackable cardboard tray |
JPH07117810A (en) | 1993-10-22 | 1995-05-09 | Mitsubishi Electric Corp | Wafer cassette and auxiliary member of wafer cassette |
JPH0927543A (en) * | 1995-07-10 | 1997-01-28 | Disco Abrasive Syst Ltd | Wafer cassette |
US5788082A (en) | 1996-07-12 | 1998-08-04 | Fluoroware, Inc. | Wafer carrier |
JP4024333B2 (en) * | 1996-12-04 | 2007-12-19 | ミライアル株式会社 | Thin plate support |
JPH1131740A (en) * | 1997-05-14 | 1999-02-02 | Komatsu Ltd | Semiconductor wafer container |
JPH11179692A (en) * | 1997-12-16 | 1999-07-06 | Shin Meiwa Ind Co Ltd | Industrial robot hand abnormality detection device and hand abnormality detection method |
US6341703B1 (en) * | 1998-04-06 | 2002-01-29 | Taiwan Semiconductor Manufacturing Company, Ltd | Wafer cassette having dividers of different length or color |
JP3998354B2 (en) | 1998-11-24 | 2007-10-24 | 信越ポリマー株式会社 | Transport container, lid opening / closing method and lid opening / closing device |
JP2000277603A (en) * | 1999-03-25 | 2000-10-06 | Shin Etsu Polymer Co Ltd | Wafer frame cassette |
US6276525B1 (en) * | 2000-07-05 | 2001-08-21 | Mary I. Kobeluch | Puzzle holder |
KR100480821B1 (en) * | 2002-05-17 | 2005-04-07 | 엘지.필립스 엘시디 주식회사 | Panel receipt device for prevention of static electricity |
JP2004153193A (en) * | 2002-11-01 | 2004-05-27 | Disco Abrasive Syst Ltd | Semiconductor wafer processing method |
US7677394B2 (en) * | 2003-01-09 | 2010-03-16 | Brooks Automation, Inc. | Wafer shipping container |
JP2004273895A (en) * | 2003-03-11 | 2004-09-30 | Disco Abrasive Syst Ltd | Method of dividing semiconductor wafer |
JP4630689B2 (en) * | 2005-03-01 | 2011-02-09 | 株式会社ディスコ | Wafer division method |
JP2007073670A (en) * | 2005-09-06 | 2007-03-22 | Disco Abrasive Syst Ltd | Water-soluble resin coating method |
JP4745209B2 (en) * | 2006-12-13 | 2011-08-10 | 信越ポリマー株式会社 | Substrate carrier |
WO2009034774A1 (en) * | 2007-09-14 | 2009-03-19 | The Furukawa Electric Co., Ltd. | Wafer processing tape |
CN101981684B (en) | 2008-01-13 | 2013-01-30 | 诚实公司 | Methods and apparatuses for large diameter wafer handling |
JP5473691B2 (en) * | 2010-03-16 | 2014-04-16 | 株式会社ディスコ | Containment cassette |
FR2960094B1 (en) * | 2010-05-12 | 2012-06-08 | St Microelectronics Tours Sas | PROCESS FOR PRODUCING SEMICONDUCTOR CHIPS |
WO2011148450A1 (en) * | 2010-05-24 | 2011-12-01 | ミライアル株式会社 | Substrate storage container |
FR2961014A1 (en) * | 2010-06-08 | 2011-12-09 | St Microelectronics Tours Sas | PROCESS FOR PRODUCING SEMICONDUCTOR CHIPS FROM A SEMICONDUCTOR WAFER |
JP2013102126A (en) * | 2011-10-14 | 2013-05-23 | Fuji Electric Co Ltd | Manufacturing method of semiconductor device and manufacturing apparatus of semiconductor device |
JP5600372B2 (en) * | 2012-06-24 | 2014-10-01 | キング通信工業株式会社 | Centralized monitoring system |
-
2012
- 2012-06-26 JP JP2012143352A patent/JP2014007344A/en active Pending
-
2013
- 2013-05-06 TW TW102116060A patent/TW201400383A/en unknown
- 2013-06-05 KR KR1020130064658A patent/KR20140001111A/en not_active Ceased
- 2013-06-12 SG SG10201505726RA patent/SG10201505726RA/en unknown
- 2013-06-25 US US13/926,624 patent/US20130341239A1/en not_active Abandoned
- 2013-06-25 CN CN201310254395.3A patent/CN103515271A/en active Pending
-
2014
- 2014-10-15 US US14/515,284 patent/US9455167B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR20140001111A (en) | 2014-01-06 |
US20130341239A1 (en) | 2013-12-26 |
TW201400383A (en) | 2014-01-01 |
JP2014007344A (en) | 2014-01-16 |
CN103515271A (en) | 2014-01-15 |
US9455167B2 (en) | 2016-09-27 |
US20150027971A1 (en) | 2015-01-29 |
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