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SG10201505726RA - Accommodation cassette - Google Patents

Accommodation cassette

Info

Publication number
SG10201505726RA
SG10201505726RA SG10201505726RA SG10201505726RA SG10201505726RA SG 10201505726R A SG10201505726R A SG 10201505726RA SG 10201505726R A SG10201505726R A SG 10201505726RA SG 10201505726R A SG10201505726R A SG 10201505726RA SG 10201505726R A SG10201505726R A SG 10201505726RA
Authority
SG
Singapore
Prior art keywords
accommodation cassette
accommodation
cassette
Prior art date
Application number
SG10201505726RA
Inventor
Inoue Takaaki
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201505726RA publication Critical patent/SG10201505726RA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00Containers, packaging elements or packages, specially adapted for particular articles or materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
SG10201505726RA 2012-06-26 2013-06-12 Accommodation cassette SG10201505726RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012143352A JP2014007344A (en) 2012-06-26 2012-06-26 Housing cassette

Publications (1)

Publication Number Publication Date
SG10201505726RA true SG10201505726RA (en) 2015-08-28

Family

ID=49773516

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201505726RA SG10201505726RA (en) 2012-06-26 2013-06-12 Accommodation cassette

Country Status (6)

Country Link
US (2) US20130341239A1 (en)
JP (1) JP2014007344A (en)
KR (1) KR20140001111A (en)
CN (1) CN103515271A (en)
SG (1) SG10201505726RA (en)
TW (1) TW201400383A (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6189047B2 (en) * 2013-02-18 2017-08-30 株式会社ディスコ cassette
US10566226B2 (en) * 2014-11-11 2020-02-18 Applied Materials, Inc. Multi-cassette carrying case
US11315815B2 (en) * 2016-01-05 2022-04-26 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer container and method for holding wafer
JP2019110157A (en) * 2017-12-15 2019-07-04 株式会社ディスコ cassette
US10504762B2 (en) * 2018-02-06 2019-12-10 Applied Materials, Inc. Bridging front opening unified pod (FOUP)
JP7357453B2 (en) 2019-03-07 2023-10-06 東京エレクトロン株式会社 Substrate processing system and substrate transport method
CN109968549B (en) * 2019-04-08 2020-11-17 紫光宏茂微电子(上海)有限公司 Lockable wafer placing frame
US12165905B2 (en) * 2019-05-20 2024-12-10 Applied Materials, Inc. Process kit enclosure system
EP3748670B1 (en) * 2019-06-04 2024-04-17 Infineon Technologies AG Transport system
JP7344681B2 (en) * 2019-06-18 2023-09-14 株式会社ディスコ Wafer unit pop-out prevention jig
JP7679136B2 (en) * 2021-02-01 2025-05-19 東京エレクトロン株式会社 Storage vessel, processing system and base plate
KR102653120B1 (en) * 2023-04-27 2024-04-01 (주)한국엔지니어링 Transferring material fixing apparatus and transporting cart comprising the same

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62139341A (en) * 1985-12-13 1987-06-23 Plasma Syst:Kk Treating device for substrate and wafer surface
JPS6356935A (en) * 1986-08-27 1988-03-11 Nikon Corp Cassette for semiconductor wafer
JPH04103653U (en) * 1991-02-13 1992-09-07 シヤープ株式会社 Wafer frame cassette
EP0573381B1 (en) * 1992-06-03 2000-09-20 Videcart, S.A. Stackable cardboard tray
JPH07117810A (en) 1993-10-22 1995-05-09 Mitsubishi Electric Corp Wafer cassette and auxiliary member of wafer cassette
JPH0927543A (en) * 1995-07-10 1997-01-28 Disco Abrasive Syst Ltd Wafer cassette
US5788082A (en) 1996-07-12 1998-08-04 Fluoroware, Inc. Wafer carrier
JP4024333B2 (en) * 1996-12-04 2007-12-19 ミライアル株式会社 Thin plate support
JPH1131740A (en) * 1997-05-14 1999-02-02 Komatsu Ltd Semiconductor wafer container
JPH11179692A (en) * 1997-12-16 1999-07-06 Shin Meiwa Ind Co Ltd Industrial robot hand abnormality detection device and hand abnormality detection method
US6341703B1 (en) * 1998-04-06 2002-01-29 Taiwan Semiconductor Manufacturing Company, Ltd Wafer cassette having dividers of different length or color
JP3998354B2 (en) 1998-11-24 2007-10-24 信越ポリマー株式会社 Transport container, lid opening / closing method and lid opening / closing device
JP2000277603A (en) * 1999-03-25 2000-10-06 Shin Etsu Polymer Co Ltd Wafer frame cassette
US6276525B1 (en) * 2000-07-05 2001-08-21 Mary I. Kobeluch Puzzle holder
KR100480821B1 (en) * 2002-05-17 2005-04-07 엘지.필립스 엘시디 주식회사 Panel receipt device for prevention of static electricity
JP2004153193A (en) * 2002-11-01 2004-05-27 Disco Abrasive Syst Ltd Semiconductor wafer processing method
US7677394B2 (en) * 2003-01-09 2010-03-16 Brooks Automation, Inc. Wafer shipping container
JP2004273895A (en) * 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd Method of dividing semiconductor wafer
JP4630689B2 (en) * 2005-03-01 2011-02-09 株式会社ディスコ Wafer division method
JP2007073670A (en) * 2005-09-06 2007-03-22 Disco Abrasive Syst Ltd Water-soluble resin coating method
JP4745209B2 (en) * 2006-12-13 2011-08-10 信越ポリマー株式会社 Substrate carrier
WO2009034774A1 (en) * 2007-09-14 2009-03-19 The Furukawa Electric Co., Ltd. Wafer processing tape
CN101981684B (en) 2008-01-13 2013-01-30 诚实公司 Methods and apparatuses for large diameter wafer handling
JP5473691B2 (en) * 2010-03-16 2014-04-16 株式会社ディスコ Containment cassette
FR2960094B1 (en) * 2010-05-12 2012-06-08 St Microelectronics Tours Sas PROCESS FOR PRODUCING SEMICONDUCTOR CHIPS
WO2011148450A1 (en) * 2010-05-24 2011-12-01 ミライアル株式会社 Substrate storage container
FR2961014A1 (en) * 2010-06-08 2011-12-09 St Microelectronics Tours Sas PROCESS FOR PRODUCING SEMICONDUCTOR CHIPS FROM A SEMICONDUCTOR WAFER
JP2013102126A (en) * 2011-10-14 2013-05-23 Fuji Electric Co Ltd Manufacturing method of semiconductor device and manufacturing apparatus of semiconductor device
JP5600372B2 (en) * 2012-06-24 2014-10-01 キング通信工業株式会社 Centralized monitoring system

Also Published As

Publication number Publication date
KR20140001111A (en) 2014-01-06
US20130341239A1 (en) 2013-12-26
TW201400383A (en) 2014-01-01
JP2014007344A (en) 2014-01-16
CN103515271A (en) 2014-01-15
US9455167B2 (en) 2016-09-27
US20150027971A1 (en) 2015-01-29

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