[go: up one dir, main page]

SG10201502708PA - Resin composition, prepreg, and laminated sheet - Google Patents

Resin composition, prepreg, and laminated sheet

Info

Publication number
SG10201502708PA
SG10201502708PA SG10201502708PA SG10201502708PA SG10201502708PA SG 10201502708P A SG10201502708P A SG 10201502708PA SG 10201502708P A SG10201502708P A SG 10201502708PA SG 10201502708P A SG10201502708P A SG 10201502708PA SG 10201502708P A SG10201502708P A SG 10201502708PA
Authority
SG
Singapore
Prior art keywords
prepreg
resin composition
laminated sheet
laminated
sheet
Prior art date
Application number
SG10201502708PA
Inventor
Takaaki Ogashiwa
Hiroshi Takahashi
Tetsuro Miyahira
Yoshihiro Kato
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of SG10201502708PA publication Critical patent/SG10201502708PA/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/098Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014Nitrogen containing compounds
    • C08G59/4042Imines; Imides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • C08G59/621Phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D161/00Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
    • C09D161/04Condensation polymers of aldehydes or ketones with phenols only
    • C09D161/06Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D171/00Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04Impregnation, embedding, or binder material
    • B32B2260/046Synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/306Resistant to heat
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/306Resistant to heat
    • B32B2307/3065Flame resistant or retardant, fire resistant or retardant
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/726Permeability to liquids, absorption
    • B32B2307/7265Non-permeable
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2361/00Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
    • C08J2361/04Condensation polymers of aldehydes or ketones with phenols only
    • C08J2361/06Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2461/00Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
    • C08J2461/04Condensation polymers of aldehydes or ketones with phenols only
    • C08J2461/06Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415Five-membered rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/20Applications use in electrical or conductive gadgets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • Y10T428/31529Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
SG10201502708PA 2010-04-08 2011-04-07 Resin composition, prepreg, and laminated sheet SG10201502708PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010089801 2010-04-08

Publications (1)

Publication Number Publication Date
SG10201502708PA true SG10201502708PA (en) 2015-05-28

Family

ID=44763005

Family Applications (2)

Application Number Title Priority Date Filing Date
SG2012074712A SG184504A1 (en) 2010-04-08 2011-04-07 Resin composition, prepreg, and laminated sheet
SG10201502708PA SG10201502708PA (en) 2010-04-08 2011-04-07 Resin composition, prepreg, and laminated sheet

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG2012074712A SG184504A1 (en) 2010-04-08 2011-04-07 Resin composition, prepreg, and laminated sheet

Country Status (8)

Country Link
US (2) US10212813B2 (en)
EP (1) EP2557121B1 (en)
JP (2) JP5935690B2 (en)
KR (2) KR101784541B1 (en)
CN (3) CN105400142A (en)
SG (2) SG184504A1 (en)
TW (2) TWI642719B (en)
WO (1) WO2011126070A1 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105860436B (en) 2010-08-31 2019-01-18 三菱瓦斯化学株式会社 Resin combination, prepreg and plywood
CN103180385B (en) * 2010-10-29 2015-11-25 爱沃特株式会社 Resin combination, the prepreg using this resin combination and plywood
JP6115225B2 (en) * 2013-03-22 2017-04-19 三菱瓦斯化学株式会社 Resin composition, prepreg, laminate and printed wiring board
JP6436378B2 (en) * 2014-02-06 2018-12-12 三菱瓦斯化学株式会社 Resin composition for printed wiring board, prepreg, laminate and printed wiring board
JP2015159177A (en) * 2014-02-24 2015-09-03 住友ベークライト株式会社 Resin substrate, metal clad laminated board, printed wiring board, and semiconductor device
JP6602563B2 (en) * 2015-06-11 2019-11-06 ソマール株式会社 Powder paint
KR102324898B1 (en) * 2016-06-29 2021-11-10 미츠비시 가스 가가쿠 가부시키가이샤 Resin composition, resin sheet, multilayer printed wiring board and semiconductor device
WO2019083006A1 (en) * 2017-10-27 2019-05-02 積水化学工業株式会社 Curable resin composition, cured product, adhesive agent, and adhesive film
CN111263782A (en) * 2017-10-27 2020-06-09 积水化学工业株式会社 Curable resin composition, cured product, adhesive, and adhesive film
JP6896591B2 (en) * 2017-11-14 2021-06-30 Eneos株式会社 Prepregs, fiber reinforced composites and moldings
JP6681055B2 (en) 2017-12-27 2020-04-15 三菱瓦斯化学株式会社 Resin composition, prepreg, laminated board, metal foil-clad laminated board, printed wiring board and multilayer printed wiring board
US11702504B2 (en) 2018-08-09 2023-07-18 Mitsubishi Gas Chemical Company, Inc. Resin composition for printed wiring board, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board
CN112955319A (en) * 2018-12-12 2021-06-11 松下知识产权经营株式会社 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board
JP7589681B2 (en) * 2019-05-27 2024-11-26 三菱瓦斯化学株式会社 Composition for forming underlayer film for lithography, underlayer film for lithography, pattern forming method and purification method
JPWO2021230104A1 (en) 2020-05-11 2021-11-18
CN114672166B (en) * 2020-12-24 2023-08-15 广东生益科技股份有限公司 Halogen-free flame-retardant resin composition and prepreg and printed circuit laminate prepared from same
WO2023032534A1 (en) 2021-08-30 2023-03-09 日鉄ケミカル&マテリアル株式会社 Allyl ether compound, resin composition, and cured product thereof
JPWO2023063282A1 (en) * 2021-10-15 2023-04-20
WO2023063277A1 (en) * 2021-10-15 2023-04-20 三菱瓦斯化学株式会社 Resin composition, laminate, semiconductor chip having resin composition layer, substrate for mounting semiconductor chip having resin composition layer, and semiconductor device

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH093167A (en) * 1995-04-21 1997-01-07 Toshiba Corp Resin composition and resin-sealed semiconductor device made by using the same
JP3611435B2 (en) 1997-10-22 2005-01-19 住友ベークライト株式会社 Flame retardant resin composition, prepreg and laminate using the same
JP3460820B2 (en) 1999-12-08 2003-10-27 日本電気株式会社 Flame retardant epoxy resin composition
JP4027560B2 (en) 2000-03-09 2007-12-26 住友ベークライト株式会社 Flame retardant resin composition, prepreg and laminate using the same
TW587094B (en) 2000-01-17 2004-05-11 Sumitomo Bakelite Co Flame-retardant resin composition comprising no halogen-containing flame retardant, and prepregs and laminates using such composition
JP2001283639A (en) 2000-03-30 2001-10-12 Fujitsu Ltd Insulating resin composition for build-up substrate
JP2002179772A (en) * 2000-12-08 2002-06-26 Mitsui Mining & Smelting Co Ltd Resin compound for composing insulating interlayer of print circuit board, resin sheet for forming insulating layer using the resin compound and copper-plated laminate using them
JP3824065B2 (en) * 2001-11-06 2006-09-20 信越化学工業株式会社 Epoxy resin composition for semiconductor encapsulation and semiconductor device
JP2004067968A (en) 2002-08-09 2004-03-04 Sumitomo Bakelite Co Ltd Resin composition, prepreg, and laminated plate
JP2006249343A (en) 2005-03-14 2006-09-21 Mitsui Chemicals Inc Epoxy resin composition and package for housing semiconductor element
JP4793565B2 (en) 2005-03-24 2011-10-12 信越化学工業株式会社 Epoxy resin composition for semiconductor encapsulation and semiconductor device
WO2007032424A1 (en) * 2005-09-15 2007-03-22 Sekisui Chemical Co., Ltd. Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate
TWI457363B (en) * 2005-11-29 2014-10-21 Ajinomoto Kk Resin composition for interlayer insulating layer of multi-layer printed wiring board
CN101522792B (en) * 2006-10-02 2013-01-09 日立化成工业株式会社 Epoxy resin molding material for sealing and electronic component device
JP2008127530A (en) 2006-11-24 2008-06-05 Matsushita Electric Works Ltd Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and multilayer printed wiring board
JP5263705B2 (en) * 2007-02-07 2013-08-14 三菱瓦斯化学株式会社 Prepreg and laminate
EP1961554B1 (en) 2007-02-07 2010-01-27 Mitsubishi Gas Chemical Company, Inc. Prepreg and laminate
JP5024205B2 (en) 2007-07-12 2012-09-12 三菱瓦斯化学株式会社 Prepreg and laminate
JP2009231790A (en) * 2008-02-27 2009-10-08 Ajinomoto Co Inc Manufacturing method of multilayer printed wiring board
JP2010229227A (en) * 2009-03-26 2010-10-14 Sekisui Chem Co Ltd Epoxy resin composition, sheet-like formed article, prepreg, cured product and laminate
WO2010109861A1 (en) * 2009-03-27 2010-09-30 三菱瓦斯化学株式会社 Method of storing resin solution and processes for producing prepreg and laminate

Also Published As

Publication number Publication date
CN105400142A (en) 2016-03-16
CN107298925A (en) 2017-10-27
US20150111044A1 (en) 2015-04-23
EP2557121A1 (en) 2013-02-13
EP2557121B1 (en) 2020-03-04
CN102947388A (en) 2013-02-27
KR20130045857A (en) 2013-05-06
JPWO2011126070A1 (en) 2013-07-11
KR101876697B1 (en) 2018-07-09
CN107298925B (en) 2020-04-21
TW201202335A (en) 2012-01-16
TWI642719B (en) 2018-12-01
SG184504A1 (en) 2012-11-29
US20130089743A1 (en) 2013-04-11
EP2557121A4 (en) 2015-11-18
JP2016040391A (en) 2016-03-24
TWI658058B (en) 2019-05-01
KR20170116183A (en) 2017-10-18
WO2011126070A1 (en) 2011-10-13
JP6183792B2 (en) 2017-08-23
US10212813B2 (en) 2019-02-19
KR101784541B1 (en) 2017-10-11
TW201841971A (en) 2018-12-01
JP5935690B2 (en) 2016-06-15

Similar Documents

Publication Publication Date Title
SG10201501469PA (en) Resin composition, prepreg, and laminated sheet
SG10201506152WA (en) Resin composition, prepreg, and laminated sheet
SG10201502708PA (en) Resin composition, prepreg, and laminated sheet
SG10201504246UA (en) Resin composition, and prepreg and laminated sheet using the same
SG10201602081SA (en) Resin composition, prepreg, and laminate
SG11201401906SA (en) Resin composition, and prepreg and laminate using the same
SG10201600443SA (en) Resin composition, and prepreg as well as laminate using the same
SG11201406174PA (en) Resin composition, prepreg, and laminate
EP2113534B8 (en) Resin composition, prepreg and metal-foil-clad laminate
EP2657295A4 (en) Halogen-free high-tg resin composition and prepreg and laminate fabricated by using the same
SG11201404727XA (en) Resin composition, prepreg, resin sheet, and metal foil-clad laminate
SG11201502925UA (en) Resin composition, prepreg, laminate and printed-wiring board
PL2750886T3 (en) Laminate composition, film and related methods
EP2610054A4 (en) Composite sheet
EP2611612A4 (en) Elastic laminate sheet
EP2666826A4 (en) Resin composition, and printed wiring board, laminated sheet, and prepreg using same
KR101937118B9 (en) Phenolic resin foam laminated sheet and method for manufacturing the same
PT2646287T (en) Laminate material
SG10201509881VA (en) Resin composition, prepreg, and laminate
EP2940053A4 (en) Resin composition, prepreg, and film
EP2484518A4 (en) Resin laminated plate
SG11201401958TA (en) Resin composition, prepreg, and laminate
SG11201400480SA (en) Polymer and composition including same, and adhesive composition
EP2762507A4 (en) Resin composition, prepreg, and metal foil-clad laminate
SG11201405224QA (en) Resin composition, prepreg, and metal foil-clad laminate