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SG10201404989SA - System, method and apparatus for coordinating pressure pulses and rf modulation in a small volume confined process reactor - Google Patents

System, method and apparatus for coordinating pressure pulses and rf modulation in a small volume confined process reactor

Info

Publication number
SG10201404989SA
SG10201404989SA SG10201404989SA SG10201404989SA SG10201404989SA SG 10201404989S A SG10201404989S A SG 10201404989SA SG 10201404989S A SG10201404989S A SG 10201404989SA SG 10201404989S A SG10201404989S A SG 10201404989SA SG 10201404989S A SG10201404989S A SG 10201404989SA
Authority
SG
Singapore
Prior art keywords
modulation
small volume
pressure pulses
process reactor
volume confined
Prior art date
Application number
SG10201404989SA
Inventor
Rajinder Dhindsa
Harmeet Singh
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG10201404989SA publication Critical patent/SG10201404989SA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32633—Baffles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32834—Exhausting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
SG10201404989SA 2013-09-03 2014-08-18 System, method and apparatus for coordinating pressure pulses and rf modulation in a small volume confined process reactor SG10201404989SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/016,994 US9184029B2 (en) 2013-09-03 2013-09-03 System, method and apparatus for coordinating pressure pulses and RF modulation in a small volume confined process reactor

Publications (1)

Publication Number Publication Date
SG10201404989SA true SG10201404989SA (en) 2015-04-29

Family

ID=52581682

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201404989SA SG10201404989SA (en) 2013-09-03 2014-08-18 System, method and apparatus for coordinating pressure pulses and rf modulation in a small volume confined process reactor

Country Status (6)

Country Link
US (2) US9184029B2 (en)
JP (1) JP6599086B2 (en)
KR (1) KR102105214B1 (en)
CN (1) CN104425324B (en)
SG (1) SG10201404989SA (en)
TW (1) TWI646571B (en)

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US9299574B2 (en) 2013-01-25 2016-03-29 Applied Materials, Inc. Silicon dioxide-polysilicon multi-layered stack etching with plasma etch chamber employing non-corrosive etchants
US9330927B2 (en) * 2013-08-28 2016-05-03 Lam Research Corporation System, method and apparatus for generating pressure pulses in small volume confined process reactor
JP6570993B2 (en) * 2015-12-16 2019-09-04 東京エレクトロン株式会社 Plasma processing equipment
CN108780735B (en) * 2016-03-13 2023-04-21 应用材料公司 Selective Deposition of Silicon Nitride Films for Spacer Applications
JP6749268B2 (en) * 2017-03-07 2020-09-02 東京エレクトロン株式会社 Substrate processing equipment
KR102449621B1 (en) * 2017-08-22 2022-09-30 삼성전자주식회사 Shroud unit and substrate processing apparatus including same
JP2019075517A (en) * 2017-10-19 2019-05-16 東京エレクトロン株式会社 Processing device and member having diffusion path
JP6967954B2 (en) * 2017-12-05 2021-11-17 東京エレクトロン株式会社 Exhaust device, processing device and exhaust method
CN109994357B (en) * 2017-12-29 2021-07-27 中微半导体设备(上海)股份有限公司 Plasma processing device
US11515128B2 (en) * 2018-08-28 2022-11-29 Lam Research Corporation Confinement ring with extended life
US12354847B2 (en) * 2020-03-12 2025-07-08 Applied Materials, Inc. Methods and apparatus for conductance liners in semiconductor process chambers
US11380524B2 (en) 2020-03-19 2022-07-05 Applied Materials, Inc. Low resistance confinement liner for use in plasma chamber
USD979524S1 (en) 2020-03-19 2023-02-28 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD943539S1 (en) 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
CN113838730B (en) * 2020-06-08 2024-05-14 中微半导体设备(上海)股份有限公司 Gas shielding ring, plasma processing device and method for regulating and controlling polymer distribution
KR102805979B1 (en) * 2020-11-19 2025-05-13 (주)아이씨디 Pressure Control Device and Control Method of Plasma Processing Device
JP7561067B2 (en) * 2021-03-17 2024-10-03 東京エレクトロン株式会社 Plasma processing apparatus and plasma processing method
JP7682040B2 (en) 2021-06-21 2025-05-23 東京エレクトロン株式会社 Plasma Processing Equipment
JP7462728B2 (en) * 2021-10-26 2024-04-05 東京エレクトロン株式会社 Plasma Processing Equipment
DE102023124377A1 (en) * 2023-09-11 2025-03-13 Eltro Gmbh Process for surface coating based on the sputtering principle

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Also Published As

Publication number Publication date
KR20150027007A (en) 2015-03-11
US20160042921A1 (en) 2016-02-11
US10636625B2 (en) 2020-04-28
TWI646571B (en) 2019-01-01
US9184029B2 (en) 2015-11-10
TW201521077A (en) 2015-06-01
US20150060404A1 (en) 2015-03-05
KR102105214B1 (en) 2020-04-28
CN104425324A (en) 2015-03-18
JP2015062225A (en) 2015-04-02
CN104425324B (en) 2017-10-03
JP6599086B2 (en) 2019-10-30

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