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SE9901319D0 - Cooling device at computer - Google Patents

Cooling device at computer

Info

Publication number
SE9901319D0
SE9901319D0 SE9901319A SE9901319A SE9901319D0 SE 9901319 D0 SE9901319 D0 SE 9901319D0 SE 9901319 A SE9901319 A SE 9901319A SE 9901319 A SE9901319 A SE 9901319A SE 9901319 D0 SE9901319 D0 SE 9901319D0
Authority
SE
Sweden
Prior art keywords
heat
cover
component
conducting
cooling plate
Prior art date
Application number
SE9901319A
Other languages
Swedish (sv)
Inventor
Helge Sabricius-Hansen
Niklas Jonce Olsson
Original Assignee
Multiq Products Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Multiq Products Ab filed Critical Multiq Products Ab
Priority to SE9901319A priority Critical patent/SE9901319D0/en
Publication of SE9901319D0 publication Critical patent/SE9901319D0/en
Priority to AU43224/00A priority patent/AU4322400A/en
Priority to PCT/SE2000/000655 priority patent/WO2000062302A1/en

Links

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Cooling device in an electric apparatus comprising a cover having a bottom plate (16), an upper part (17), a rear side (11), and an opposite front side (12) essentially covered by a flat display (13), at least one a large amount of heat emitting component (10) being provided within said cover, at least a section of said cover being formed as a cooling plate (15). A first end of said heat-conducting pipe (14) is in heat-conducting contact with said component (10), and a second end of said heat-conducting pipe (14) is in heat-conducting contact with said cooling plate (15). The invention also relates to a method for cooling an electric apparatus, wherein heat from a component (10) arranged within a cover is transported from said component (10) through a heat-conducting duct (14) to the exterior of the cover. The transport of heat is made without any addition of energy. In a computer according to the invention at least a section of a cover is formed as a cooling plate (15). A heat-conducting duct (14) is provided between said component (10) and said cooling plate (15), so as to cool off said component (10) without any contribution from a fan means.
SE9901319A 1999-04-13 1999-04-13 Cooling device at computer SE9901319D0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE9901319A SE9901319D0 (en) 1999-04-13 1999-04-13 Cooling device at computer
AU43224/00A AU4322400A (en) 1999-04-13 2000-04-06 Computer cooling device
PCT/SE2000/000655 WO2000062302A1 (en) 1999-04-13 2000-04-06 Computer cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9901319A SE9901319D0 (en) 1999-04-13 1999-04-13 Cooling device at computer

Publications (1)

Publication Number Publication Date
SE9901319D0 true SE9901319D0 (en) 1999-04-13

Family

ID=20415202

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9901319A SE9901319D0 (en) 1999-04-13 1999-04-13 Cooling device at computer

Country Status (3)

Country Link
AU (1) AU4322400A (en)
SE (1) SE9901319D0 (en)
WO (1) WO2000062302A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1422594A3 (en) 2002-11-22 2005-08-17 Contec Steuerungstechnik & Automation Gesellschaft m.b.H. A method and an apparatus for cooling a portable computer
EP1962570A1 (en) * 2007-02-26 2008-08-27 Siemens Aktiengesellschaft Electrical device and cooling method for an electrical device
DE102014017914B4 (en) * 2014-12-04 2021-06-24 Audi Ag Combination instrument for a motor vehicle and motor vehicle
CN111708415A (en) * 2020-05-29 2020-09-25 苏州浪潮智能科技有限公司 A method, system, equipment and medium for adjusting the air inlet diameter to reduce noise

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5339214A (en) * 1993-02-12 1994-08-16 Intel Corporation Multiple-fan microprocessor cooling through a finned heat pipe
US5712762A (en) * 1996-03-01 1998-01-27 Compaq Computer Corporation Computer having a heat sink structure incorporated therein
US5781409A (en) * 1996-12-19 1998-07-14 Compaq Computer Corporation Heat dissipating lid hinge structure with laterally offset heat pipe end portions

Also Published As

Publication number Publication date
AU4322400A (en) 2000-11-14
WO2000062302A1 (en) 2000-10-19

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