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SE9801794L - Integrerad mikrovåghybridkrets - Google Patents

Integrerad mikrovåghybridkrets

Info

Publication number
SE9801794L
SE9801794L SE9801794A SE9801794A SE9801794L SE 9801794 L SE9801794 L SE 9801794L SE 9801794 A SE9801794 A SE 9801794A SE 9801794 A SE9801794 A SE 9801794A SE 9801794 L SE9801794 L SE 9801794L
Authority
SE
Sweden
Prior art keywords
hole
projection
pct
date
board
Prior art date
Application number
SE9801794A
Other languages
English (en)
Other versions
SE9801794D0 (sv
SE522106C2 (sv
Inventor
Viktor Anatolievich Iovdalsky
Eduard Volfovich Aizenberg
Vladimir Iliich Beil
Mikhail Ivanovich Lopin
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of SE9801794L publication Critical patent/SE9801794L/sv
Publication of SE9801794D0 publication Critical patent/SE9801794D0/sv
Publication of SE522106C2 publication Critical patent/SE522106C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
  • Structure Of Printed Boards (AREA)
SE9801794A 1996-09-26 1998-05-20 Integrerad mikrovåghybridkrets SE522106C2 (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/RU1996/000278 WO1998013876A1 (en) 1996-09-26 1996-09-26 Hybrid microwave-frequency integrated circuit

Publications (3)

Publication Number Publication Date
SE9801794L true SE9801794L (sv) 1998-05-20
SE9801794D0 SE9801794D0 (sv) 1998-05-20
SE522106C2 SE522106C2 (sv) 2004-01-13

Family

ID=20130041

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9801794A SE522106C2 (sv) 1996-09-26 1998-05-20 Integrerad mikrovåghybridkrets

Country Status (6)

Country Link
US (1) US6002147A (sv)
JP (1) JP3347145B2 (sv)
KR (1) KR100412056B1 (sv)
RU (1) RU2148873C1 (sv)
SE (1) SE522106C2 (sv)
WO (1) WO1998013876A1 (sv)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW451535B (en) * 1998-09-04 2001-08-21 Sony Corp Semiconductor device and package, and fabrication method thereof
JP2001291822A (ja) * 2000-02-04 2001-10-19 Seiko Epson Corp 半導体チップの製造方法および半導体装置の製造方法、半導体チップ、半導体装置、接続用基板、電子機器
US6882042B2 (en) * 2000-12-01 2005-04-19 Broadcom Corporation Thermally and electrically enhanced ball grid array packaging
US6906414B2 (en) 2000-12-22 2005-06-14 Broadcom Corporation Ball grid array package with patterned stiffener layer
US7132744B2 (en) 2000-12-22 2006-11-07 Broadcom Corporation Enhanced die-up ball grid array packages and method for making the same
US7161239B2 (en) 2000-12-22 2007-01-09 Broadcom Corporation Ball grid array package enhanced with a thermal and electrical connector
US20020079572A1 (en) 2000-12-22 2002-06-27 Khan Reza-Ur Rahman Enhanced die-up ball grid array and method for making the same
US6853070B2 (en) * 2001-02-15 2005-02-08 Broadcom Corporation Die-down ball grid array package with die-attached heat spreader and method for making the same
US7259448B2 (en) * 2001-05-07 2007-08-21 Broadcom Corporation Die-up ball grid array package with a heat spreader and method for making the same
JP4468609B2 (ja) * 2001-05-21 2010-05-26 株式会社ルネサステクノロジ 半導体装置
TW529109B (en) * 2001-09-11 2003-04-21 Apack Comm Inc Flip chip type monolithic microwave integrated circuit package
US20030062610A1 (en) * 2001-09-28 2003-04-03 Kovacs Alan L. Multilayer thin film hydrogen getter
US6879039B2 (en) * 2001-12-18 2005-04-12 Broadcom Corporation Ball grid array package substrates and method of making the same
US7245500B2 (en) 2002-02-01 2007-07-17 Broadcom Corporation Ball grid array package with stepped stiffener layer
US6825108B2 (en) 2002-02-01 2004-11-30 Broadcom Corporation Ball grid array package fabrication with IC die support structures
US6861750B2 (en) 2002-02-01 2005-03-01 Broadcom Corporation Ball grid array package with multiple interposers
US7550845B2 (en) 2002-02-01 2009-06-23 Broadcom Corporation Ball grid array package with separated stiffener layer
US6876553B2 (en) 2002-03-21 2005-04-05 Broadcom Corporation Enhanced die-up ball grid array package with two substrates
US7196415B2 (en) 2002-03-22 2007-03-27 Broadcom Corporation Low voltage drop and high thermal performance ball grid array package
JP3539952B2 (ja) * 2002-06-13 2004-07-07 沖電気工業株式会社 レベル識別回路
KR100547709B1 (ko) * 2003-07-07 2006-01-31 삼성전자주식회사 자기 치유 파장분할다중방식 수동형 광 가입자망
US7432586B2 (en) 2004-06-21 2008-10-07 Broadcom Corporation Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages
US7411281B2 (en) 2004-06-21 2008-08-12 Broadcom Corporation Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same
US7482686B2 (en) 2004-06-21 2009-01-27 Braodcom Corporation Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same
US7786591B2 (en) 2004-09-29 2010-08-31 Broadcom Corporation Die down ball grid array package
JP2006114732A (ja) * 2004-10-15 2006-04-27 Renesas Technology Corp 半導体装置及びその製造方法、並びに半導体モジュール
JP2006202832A (ja) * 2005-01-18 2006-08-03 Nec Corp 高周波モジュール実装構造
US8183680B2 (en) 2006-05-16 2012-05-22 Broadcom Corporation No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement
JP5275859B2 (ja) * 2009-03-17 2013-08-28 古河電気工業株式会社 電子基板
RU2498455C1 (ru) * 2012-08-01 2013-11-10 Федеральное государственное унитарное предприятие "Научно-производственное предприятие "Исток" (ФГУП "НПП "Исток") Мощная гибридная интегральная схема свч-диапазона
US10269678B1 (en) * 2017-12-05 2019-04-23 Nxp Usa, Inc. Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof
RU2750860C1 (ru) * 2020-09-21 2021-07-05 Акционерное общество "Научно-производственное предприятие "Исток" имени А.И. Шокина" (АО "НПП "Исток" им. Шокина") Гибридная интегральная схема свч-диапазона

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3986196A (en) * 1975-06-30 1976-10-12 Varian Associates Through-substrate source contact for microwave FET
FR2425175A1 (fr) * 1978-05-03 1979-11-30 Thomson Csf Composant hybride d'amplification en tres haute frequence et amplificateur comportant un tel composant
GB2111312A (en) * 1981-11-04 1983-06-29 Philips Electronic Associated Substrates for electrical circuits
GB2129223A (en) * 1982-10-09 1984-05-10 Welwyn Electronics Ltd Printed circuit boards
US5248853A (en) * 1991-11-14 1993-09-28 Nippondenso Co., Ltd. Semiconductor element-mounting printed board
RU2076473C1 (ru) * 1994-07-25 1997-03-27 Государственное научно-производственное предприятие "Исток" Свч интегральная схема
JPH0897375A (ja) * 1994-07-26 1996-04-12 Toshiba Corp マイクロ波集積回路装置及びその製造方法

Also Published As

Publication number Publication date
KR100412056B1 (ko) 2004-03-30
WO1998013876A1 (en) 1998-04-02
JP3347145B2 (ja) 2002-11-20
KR19990071661A (ko) 1999-09-27
RU2148873C1 (ru) 2000-05-10
US6002147A (en) 1999-12-14
SE9801794D0 (sv) 1998-05-20
JP2000509904A (ja) 2000-08-02
SE522106C2 (sv) 2004-01-13

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