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SE8405803D0 - Anordning for centrering/uppmetning av komponenter - Google Patents

Anordning for centrering/uppmetning av komponenter

Info

Publication number
SE8405803D0
SE8405803D0 SE8405803A SE8405803A SE8405803D0 SE 8405803 D0 SE8405803 D0 SE 8405803D0 SE 8405803 A SE8405803 A SE 8405803A SE 8405803 A SE8405803 A SE 8405803A SE 8405803 D0 SE8405803 D0 SE 8405803D0
Authority
SE
Sweden
Prior art keywords
pct
centering
components
component
arrangement
Prior art date
Application number
SE8405803A
Other languages
English (en)
Inventor
G Rodin
L Stridsberg
Original Assignee
Mydata Automation Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mydata Automation Ab filed Critical Mydata Automation Ab
Priority to SE8405803A priority Critical patent/SE8405803D0/sv
Publication of SE8405803D0 publication Critical patent/SE8405803D0/sv
Priority to US06/890,849 priority patent/US4727645A/en
Priority to PCT/SE1985/000468 priority patent/WO1986003367A1/en
Priority to DE8585905937T priority patent/DE3576783D1/de
Priority to EP85905937A priority patent/EP0233884B1/en
Priority to JP60505317A priority patent/JP2575643B2/ja
Priority to AT85905937T priority patent/ATE51338T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y10T29/53048—Multiple station assembly or disassembly apparatus
    • Y10T29/53052—Multiple station assembly or disassembly apparatus including position sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
SE8405803A 1984-11-19 1984-11-19 Anordning for centrering/uppmetning av komponenter SE8405803D0 (sv)

Priority Applications (7)

Application Number Priority Date Filing Date Title
SE8405803A SE8405803D0 (sv) 1984-11-19 1984-11-19 Anordning for centrering/uppmetning av komponenter
US06/890,849 US4727645A (en) 1984-11-19 1985-11-18 Device for surface mounting of components
PCT/SE1985/000468 WO1986003367A1 (en) 1984-11-19 1985-11-18 Device for surface mounting of components
DE8585905937T DE3576783D1 (de) 1984-11-19 1985-11-18 Vorrichtung zum bestuecken von komponenten.
EP85905937A EP0233884B1 (en) 1984-11-19 1985-11-18 Device for surface mounting of components
JP60505317A JP2575643B2 (ja) 1984-11-19 1985-11-18 電子素子の表面実装装置
AT85905937T ATE51338T1 (de) 1984-11-19 1985-11-18 Vorrichtung zum bestuecken von komponenten.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE8405803A SE8405803D0 (sv) 1984-11-19 1984-11-19 Anordning for centrering/uppmetning av komponenter

Publications (1)

Publication Number Publication Date
SE8405803D0 true SE8405803D0 (sv) 1984-11-19

Family

ID=20357804

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8405803A SE8405803D0 (sv) 1984-11-19 1984-11-19 Anordning for centrering/uppmetning av komponenter

Country Status (6)

Country Link
US (1) US4727645A (sv)
EP (1) EP0233884B1 (sv)
JP (1) JP2575643B2 (sv)
DE (1) DE3576783D1 (sv)
SE (1) SE8405803D0 (sv)
WO (1) WO1986003367A1 (sv)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4733462A (en) * 1986-06-24 1988-03-29 Sony Corporation Apparatus for positioning circuit components at predetermined positions and method therefor
JPH0810719B2 (ja) * 1988-11-15 1996-01-31 株式会社新川 外部リード接合方法及び装置
JPH02303100A (ja) * 1989-05-17 1990-12-17 Matsushita Electric Ind Co Ltd 部品装着方法
DE4209524A1 (de) * 1992-03-24 1993-09-30 Siemens Ag Verfahren zur Lageerkennung und/oder Teilungsprüfung und/oder Koplanaritätsprüfung der Anschlüsse von Bauelementen und Bestückkopf für die automatische Bestückung von Bauelementen
DE4239995A1 (de) * 1992-11-27 1994-06-01 Adalbert Fritsch Gerät und Verfahren zum Bedrucken eines Schaltungsträgers
US6066206A (en) 1997-02-21 2000-05-23 Speedline Technologies, Inc. Dual track stenciling system with solder gathering head
US6085407A (en) * 1997-08-21 2000-07-11 Micron Technology, Inc. Component alignment apparatuses and methods
US6866881B2 (en) 1999-02-19 2005-03-15 Speedline Technologies, Inc. Dispensing system and method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4151945A (en) * 1977-12-08 1979-05-01 Universal Instruments Corporation Automated hybrid circuit board assembly apparatus
GB2049616B (en) * 1979-05-22 1982-12-22 Marconi Co Ltd Manipulator mechanisms
US4417683A (en) * 1981-11-09 1983-11-29 Universal Instruments Corporation Centering device for electrical components
US4557043A (en) * 1983-12-05 1985-12-10 Rca Corporation Component lead processing apparatus
GB8406129D0 (en) * 1984-03-08 1984-04-11 Dyna Pert Precima Ltd Orienting electrical components

Also Published As

Publication number Publication date
JP2575643B2 (ja) 1997-01-29
JPS62501249A (ja) 1987-05-14
US4727645A (en) 1988-03-01
DE3576783D1 (de) 1990-04-26
EP0233884A1 (en) 1987-09-02
EP0233884B1 (en) 1990-03-21
WO1986003367A1 (en) 1986-06-05

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