SE7509065L - Sett och med medel for selektiv avlegsnande av tenn och tenn-legeringar fran underlag av koppar. - Google Patents
Sett och med medel for selektiv avlegsnande av tenn och tenn-legeringar fran underlag av koppar.Info
- Publication number
- SE7509065L SE7509065L SE7509065A SE7509065A SE7509065L SE 7509065 L SE7509065 L SE 7509065L SE 7509065 A SE7509065 A SE 7509065A SE 7509065 A SE7509065 A SE 7509065A SE 7509065 L SE7509065 L SE 7509065L
- Authority
- SE
- Sweden
- Prior art keywords
- tin
- acid
- tinn
- lead
- copper
- Prior art date
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 5
- 239000002253 acid Substances 0.000 abstract 4
- 229910001128 Sn alloy Inorganic materials 0.000 abstract 3
- 229910001174 tin-lead alloy Inorganic materials 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 abstract 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 abstract 1
- 239000003929 acidic solution Substances 0.000 abstract 1
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 150000001491 aromatic compounds Chemical class 0.000 abstract 1
- 125000001246 bromo group Chemical group Br* 0.000 abstract 1
- 125000001309 chloro group Chemical group Cl* 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 150000007522 mineralic acids Chemical class 0.000 abstract 1
- 150000007524 organic acids Chemical class 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- ing And Chemical Polishing (AREA)
- Chemically Coating (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/497,435 US4004956A (en) | 1974-08-14 | 1974-08-14 | Selectively stripping tin or tin-lead alloys from copper substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| SE7509065L true SE7509065L (sv) | 1976-02-16 |
| SE417218B SE417218B (sv) | 1981-03-02 |
Family
ID=23976859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE7509065A SE417218B (sv) | 1974-08-14 | 1975-08-13 | Sett och medel for att fran ett kopparunderlag avlegsna avsatt tenn eller tenn-blylegering |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US4004956A (sv) |
| JP (1) | JPS5420179B2 (sv) |
| AU (1) | AU8338375A (sv) |
| BE (1) | BE832477A (sv) |
| BR (1) | BR7505001A (sv) |
| CA (1) | CA1056701A (sv) |
| CH (1) | CH606488A5 (sv) |
| DE (1) | DE2536404C2 (sv) |
| ES (1) | ES440237A1 (sv) |
| FR (1) | FR2281998A1 (sv) |
| GB (1) | GB1507726A (sv) |
| SE (1) | SE417218B (sv) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4297257A (en) * | 1980-04-17 | 1981-10-27 | Dart Industries Inc. | Metal stripping composition and method |
| IT1144797B (it) * | 1981-10-14 | 1986-10-29 | Alfachimici Spa | Soluzione per l asportazione di stagno o lega stagno piombo da un substrato mediante operazione a spruzzo |
| USRE32555E (en) * | 1982-09-20 | 1987-12-08 | Circuit Chemistry Corporation | Solder stripping solution |
| US4397753A (en) * | 1982-09-20 | 1983-08-09 | Circuit Chemistry Corporation | Solder stripping solution |
| EP0157382B1 (de) * | 1984-04-02 | 1988-08-10 | PARKER CHEMICAL COMPANY (a Delaware company) | Verfahren und wässrige, saure Reinigungslösung zur Reinigung von Aluminiumoberflächen |
| US4687545A (en) * | 1986-06-18 | 1987-08-18 | Macdermid, Incorporated | Process for stripping tin or tin-lead alloy from copper |
| US4978423A (en) * | 1988-09-26 | 1990-12-18 | At&T Bell Laboratories | Selective solder formation on printed circuit boards |
| US4957653A (en) * | 1989-04-07 | 1990-09-18 | Macdermid, Incorporated | Composition containing alkane sulfonic acid and ferric nitrate for stripping tin or tin-lead alloy from copper surfaces, and method for stripping tin or tin-lead alloy |
| US4944851A (en) * | 1989-06-05 | 1990-07-31 | Macdermid, Incorporated | Electrolytic method for regenerating tin or tin-lead alloy stripping compositions |
| US4921571A (en) * | 1989-07-28 | 1990-05-01 | Macdermid, Incorporated | Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces |
| JPH0375386A (ja) * | 1989-08-18 | 1991-03-29 | Metsuku Kk | 錫又は錫‐鉛合金の剥離方法 |
| US5017267A (en) * | 1990-07-17 | 1991-05-21 | Macdermid, Incorporated | Composition and method for stripping tin or tin-lead alloy from copper surfaces |
| DE4113283C2 (de) * | 1991-04-24 | 1994-05-05 | Kernforschungsz Karlsruhe | Verwendung einer Ätzlösung zum selektiven Abätzen einer metallischen Opferschicht bei der Herstellung von Mikrostrukturen |
| US5219484A (en) * | 1991-04-25 | 1993-06-15 | Applied Electroless Concepts Inc. | Solder and tin stripper compositions |
| DE4219667C2 (de) * | 1992-06-16 | 1994-12-01 | Kernforschungsz Karlsruhe | Werkzeug und Verfahren zur Herstellung einer mikrostrukturierten Kunststoffschicht |
| US5824631A (en) * | 1994-06-03 | 1998-10-20 | Wagenknecht; John H. | Compositions for dissolution of soft metals |
| US5565039A (en) * | 1994-06-03 | 1996-10-15 | Wagenknecht; John H. | Method for dissolution of soft metals from a substrate of a harder metal |
| US6045686A (en) * | 1997-03-18 | 2000-04-04 | The University Of Connecticut | Method and apparatus for electrochemical delacquering and detinning |
| JP2001073182A (ja) * | 1999-07-15 | 2001-03-21 | Boc Group Inc:The | 改良された酸性銅電気メッキ用溶液 |
| ATE224966T1 (de) * | 2000-03-17 | 2002-10-15 | Ruvaris S R L | Verfahren und bad zur selektiven bleientfernung von sanitärkomponenten aus kupferlegierungen |
| US6833328B1 (en) * | 2000-06-09 | 2004-12-21 | General Electric Company | Method for removing a coating from a substrate, and related compositions |
| US6863738B2 (en) * | 2001-01-29 | 2005-03-08 | General Electric Company | Method for removing oxides and coatings from a substrate |
| EP1302569A3 (en) * | 2001-10-11 | 2004-03-03 | Shipley Co. L.L.C. | Stripping solution |
| US20040169013A1 (en) * | 2003-02-28 | 2004-09-02 | General Electric Company | Method for chemically removing aluminum-containing materials from a substrate |
| US6953533B2 (en) * | 2003-06-16 | 2005-10-11 | General Electric Company | Process for removing chromide coatings from metal substrates, and related compositions |
| US20100147803A1 (en) * | 2008-12-15 | 2010-06-17 | General Electric Company | Process for removing metallic material from casted substates, and related compositions |
| JP6429079B2 (ja) * | 2015-02-12 | 2018-11-28 | メック株式会社 | エッチング液及びエッチング方法 |
| ES2727075T5 (es) * | 2015-02-23 | 2022-05-27 | Macdermid Enthone Inc | Composición inhibidora para bastidores cuando se utilizan mordientes exentos de cromo en un proceso de galvanizado sobre materiales plásticos |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2652360A (en) * | 1951-05-10 | 1953-09-15 | Pure Oil Co | Acidizing siliceous earth formations |
| GB885241A (en) * | 1959-08-07 | 1961-12-20 | Charles Hill & Co Ltd | An improved chemical polishing solution for use upon zinc base alloys |
| US3061494A (en) * | 1959-10-05 | 1962-10-30 | Boeing Co | Process of chemical milling and acid aqueous bath used therefor |
| US3677949A (en) * | 1970-09-04 | 1972-07-18 | Enthone | Selectively stripping tin and/or lead from copper substrates |
| US3888778A (en) * | 1973-03-13 | 1975-06-10 | Merton Beckwith | Bright dip composition for tin/lead |
-
1974
- 1974-08-14 US US05/497,435 patent/US4004956A/en not_active Expired - Lifetime
-
1975
- 1975-07-15 CA CA231,484A patent/CA1056701A/en not_active Expired
- 1975-07-25 AU AU83383/75A patent/AU8338375A/en not_active Expired
- 1975-08-06 GB GB32913/75A patent/GB1507726A/en not_active Expired
- 1975-08-06 BR BR7505001*A patent/BR7505001A/pt unknown
- 1975-08-06 JP JP9507475A patent/JPS5420179B2/ja not_active Expired
- 1975-08-11 CH CH1045175A patent/CH606488A5/xx not_active IP Right Cessation
- 1975-08-13 SE SE7509065A patent/SE417218B/sv not_active IP Right Cessation
- 1975-08-13 FR FR7525240A patent/FR2281998A1/fr active Granted
- 1975-08-13 ES ES440237A patent/ES440237A1/es not_active Expired
- 1975-08-14 DE DE2536404A patent/DE2536404C2/de not_active Expired
- 1975-08-14 BE BE159248A patent/BE832477A/xx not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| AU477223B2 (sv) | 1976-10-21 |
| JPS5142028A (sv) | 1976-04-09 |
| US4004956A (en) | 1977-01-25 |
| DE2536404C2 (de) | 1984-05-10 |
| FR2281998A1 (fr) | 1976-03-12 |
| JPS5420179B2 (sv) | 1979-07-20 |
| BR7505001A (pt) | 1976-08-03 |
| BE832477A (fr) | 1976-02-16 |
| CA1056701A (en) | 1979-06-19 |
| GB1507726A (en) | 1978-04-19 |
| FR2281998B3 (sv) | 1978-04-07 |
| CH606488A5 (sv) | 1978-10-31 |
| ES440237A1 (es) | 1977-06-16 |
| DE2536404A1 (de) | 1976-03-04 |
| SE417218B (sv) | 1981-03-02 |
| AU8338375A (en) | 1976-10-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SE7509065L (sv) | Sett och med medel for selektiv avlegsnande av tenn och tenn-legeringar fran underlag av koppar. | |
| ES394816A1 (es) | Un procedimiento de de decapaje de un substrato de cobre. | |
| SE8206447L (sv) | Avmetalliseringskomposition och -forfarande | |
| SE8007445L (sv) | Inhibering av metallkorrosion | |
| JPS5233669A (en) | Process for preparation of 1,2-benzisooxazol derivatives | |
| GB1287854A (sv) | ||
| JPS521521A (en) | Hanging device for nozzle valve | |
| US3514408A (en) | Composition and method for etching photoengraving copper printing plates | |
| JPS5395912A (en) | New derivative of active acetic acid ulceratives | |
| JPS51133417A (en) | A slime controlling agent | |
| JPS576840A (en) | Fixing solution for photography | |
| JPS53101975A (en) | Treating method of semiconductor substrates | |
| JPS526034A (en) | Magnetic bubble drive unit | |
| JPS5239674A (en) | Imidazole derivatives and agricultural bactericides therefrom | |
| JPS51133296A (en) | Processes for preparing 7-acylamino- 3-hydroxymethyl-2-cephem-4-carbox ylic acid derivatives | |
| GB1462598A (en) | Fungicidal agent | |
| JPS5412386A (en) | Isocarbostyril derivative | |
| JPS525730A (en) | Process for preparation of 1,3,5-tri-substituted derivatives | |
| JPS5261481A (en) | Production of semiconductor device | |
| JPS51146473A (en) | A process for preparing piperidylbenzoimidazole derivatives | |
| JPS51125281A (en) | A process for preparing indazole derivatives | |
| JPS5218830A (en) | Homoisotwistylamines antiviral agents for animals | |
| JPS52154523A (en) | Agent for reducing phytotoxy of n-substituted phenylcarbamoylamino acid derivatives | |
| JPS51116834A (en) | Adhesive composition | |
| JPS5283716A (en) | Novel 16-substituted prostadienoic acid derivatives |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| NAL | Patent in force |
Ref document number: 7509065-4 Format of ref document f/p: F |
|
| NUG | Patent has lapsed |
Ref document number: 7509065-4 Format of ref document f/p: F |