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SE457584B - REFRIGERATOR FOR SEMI-CONDUCTOR - Google Patents

REFRIGERATOR FOR SEMI-CONDUCTOR

Info

Publication number
SE457584B
SE457584B SE8103779A SE8103779A SE457584B SE 457584 B SE457584 B SE 457584B SE 8103779 A SE8103779 A SE 8103779A SE 8103779 A SE8103779 A SE 8103779A SE 457584 B SE457584 B SE 457584B
Authority
SE
Sweden
Prior art keywords
cooling
body according
cooling body
profile insert
flanges
Prior art date
Application number
SE8103779A
Other languages
Swedish (sv)
Other versions
SE8103779L (en
Inventor
U Bock
Original Assignee
Alusuisse
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alusuisse filed Critical Alusuisse
Publication of SE8103779L publication Critical patent/SE8103779L/en
Publication of SE457584B publication Critical patent/SE457584B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

457 584' ' 10 15 20 25 30 55 Tack vare åtgärderna enligt uppfinningen förbättras avsevärt strömningsförhållandena genom kylkroppens speciella utform- ning vid väsentligt reducerat fläneförhållande. 457 584 '' 10 15 20 25 30 55 Thanks to the measures according to the invention are considerably improved flow conditions due to the special design of the heat sink at significantly reduced flare ratio.

Kylkroppen enligt uppfinningen uppvisar alltså flänsar med olika höjd, varvid höjdskillnaderna utjämnas genom de på- klämda profilinsatserna, som i sin tur uppvisar tvärflänsar och således avsevärt bidrager till kylningsbeteendet. Här- igenom kan flänsförhållandet sänkas från hittills 7. 25 : 1 till ungefär 4 s l. Därutöver uppnås en avsevärd tillverk- ningsförenkling. Såväl själva kylkroppen som profilinsatsen kapae i längder från strängpressade profiler.The heat sink according to the invention thus has flanges different heights, whereby the height differences are evened out by the clamped profile inserts, which in turn have transverse flanges and thus significantly contributes to the cooling behavior. Here- through, the flange ratio can be lowered from hitherto 7. 25: 1 to about 4 s l. In addition, a considerable production simplification. Both the heat sink itself and the profile insert kapae in lengths from extruded profiles.

Hed hänvisning till bifogade ritning beskrivs nedan som exempel sn lämplig utföringsform av finningen. På ritningen visar fig. del av kylkroppen enligt upp- l ett tvärsnitt genom en en sådan utföringsform av kylkroppen enligt uppfin- ningen med profilinsats, och fig. 2 ett tvärsnitt genom profilinsatsen.The reference to the accompanying drawing is described below as example sn suitable embodiment of the finding. In the drawing, fig. portion of the heat sink according to l a cross section through a such an embodiment of the heat sink according to the invention the profile insert, and FIG. 2 a cross section through the profile insert.

En kylkropp l uppvisar enligt fig. l en grundplatta 2 med en tjocklek i på exempelvis 15 nn och med därifrån utskjutande kylflänsar 3. 4-av olika höjd a- (exempelvis 40 m) respek- tive b (70 un) och med tvärsnitt som avsmalnar mot de av- rundade flänsspetsarna 5, 6.A heat sink 1 has, according to Fig. 1, a base plate 2 with a thickness i of, for example, 15 nn and with protruding therefrom heat sinks 3. 4-of different heights a- (for example 40 m) respectively tive b (70 un) and with cross-sections tapered towards the rounded flange tips 5, 6.

De längre kylflänsarnas 3 basbredd d uppgår till 5 :mn och är obetydligt större än de kortare kylflänsarnas 4 basbredd e.The base width d of the longer heat sinks 3 amounts to 5 m and is slightly larger than the base width of the shorter heat sinks 4 e.

Profilbredden f vid de längre kylflänsarnas 3 spets 5 är med 2.5 :mn endast obetydligt större än bredden g vid de kortare kylflänsarnas 4 spets 6.The profile width f at the tip 5 of the longer heat sinks 3 is included 2.5: mn only slightly larger than the width g at the shorter ones the tip of the heat sinks 4.

De långa kylflänearnas 3 flänshöjd b förhåller sig till flänsmellanrummet m såsom 3 : l, och de korta kylflänsarnas 4 flänshöjd a. till det i fig. 1 för ökad tydlighet smala 10 15 20 25 457 584 flänsmellanrummet n till den närbelägna långa kylflänsen 3 såsom 4 :l . Basmellanrummet p mäter ungefär 7 mm.The flange height b of the long cooling fins 3 relates to the flange gap m such as 3: 1, and the short heat sinks 4 flange height a. To that in Fig. 1 for increased clarity narrow 10 15 20 25 457 584 the flange gap n to the adjacent long heat sink 3 such as 4: 1. The base gap p measures approximately 7 mm.

Flänsspetsarna 6 kan uppvisa räfflade ytor, för att ge bättre fäste åt en profilinsats 10, som medelst en klämlik- nande huvuddel 11 är pâträdbar på de korta kylflänsarna 4 och sedan medelst stödben 12, 13 stöder sig mot de långa kylflänsarnas 3 flanker 9. Således uppstår överallt i en dal mellan varandra intilliggande långa kylflänsar 3 fyra kam- mare 14, 15, vars inre kammare 14 bildas av grundplattan 2, kylflänsarna 3, 4, 3 och den klämliknande huvuddelens ll stödben 12, och de yttre kamrarna 15 av de långa kylflän- sarnas 3 spetsområden och profilinsatsen eller påträdnings- profilen 10. 0 Från profilinsatsens 10 trappstegsartade profilkropp 20 ut- skjuter tvärs dess längdaxel M på båda sidor tvärflänsar 21, som kan vara av olika höjd h eller ha samma längd. n Varje stödbenpars båda stödben 12, 13 lutar överallt med lika vinkel t resp. w mot längdaxeln M, varvid stödbenen 12 på huvuddelen ll bildar ett klämspár 22. Stödbenen 12, 13 på varje sida förlöper ungefär oarallellt med varandra. 1 Profilinsatsens 10 totala längd q mäter ungefär 35 mm.The flange tips 6 may have grooved surfaces, to give better attachment to a profile insert 10, which by means of a clamp-like the main part 11 can be found on the short heat sinks 4 and then by means of support legs 12, 13 rest against the long ones the flanks 3 of the heat sinks 9. Thus occurs everywhere in a valley adjacent long heat sinks 3 four cam- mare 14, 15, the inner chamber 14 of which is formed by the base plate 2, the heat sinks 3, 4, 3 and the clamp-like main part ll support legs 12, and the outer chambers 15 of the long heat sinks the 3 tip areas of the sars and the profile insert or profile 10. 0 From the stepped profile body 20 of the profile insert 10 protrudes transversely to its longitudinal axis M on both sides transverse flanges 21, which can be of different heights h or have the same length. n Each support leg pair's two support legs 12, 13 are inclined everywhere with equal angle t resp. w against the longitudinal axis M, the support legs 12 on the main part ll forms a clamping groove 22. The support legs 12, 13 on each side runs approximately parallel to each other. 1 The total length q of the profile insert 10 measures approximately 35 mm.

Claims (12)

10 15 20 25 30 35 457 584- Patentkrav10 15 20 25 30 35 457 584- Patent claim 1. Kylkropp för halvledare. särskilt av strângpressadefpro- filer, med på avstånd från varandra fran en grundplatta ut- skjutande kylflânsar ned stavformigt tvärsnitt. t e c k n a d av att kylflänsar (3 resp. tvâ olika höjder (b resp. anordande, k ä n n e - 4) av åtminstone a) är i detta avseende växelvis liksom att på åtminstone en del av de kortare kyl- flänsarna (4) :inst en profilinsats (10) är fästad.1. Semiconductor heat sink. especially of extruded def profiles, with cooling fins projecting down from a base plate down a rod-shaped cross-section. characterized in that cooling fins (3 or two different heights (b or arranging, jug - 4) of at least a) are in this respect alternately as well as that on at least a part of the shorter cooling fins (4): inst a profile insert (10) is attached. 2. Kylkropp enligt krav 1. k ä n n e t e c k n a d av att mellan tvâ långa kylflänsar (3) en profilinsats (10) och fastklämd på den nellan dessa kylflänsar anordnade korta kyl- flänsen (4).Cooling body according to Claim 1, characterized in that a short cooling flange (4) is arranged between two long cooling flanges (3) and a profile insert (10) and clamped on the nell between these cooling flanges. 3. Kylkropp enligt krav 2. k ä n n e t e o k n a d av att de korta kylflänsarna (4) är friktionsbefränjande utbildade i omrâdet kring sina spetsar (6).Cooling body according to Claim 2, characterized in that the short cooling flanges (4) are friction-training formed in the area around their tips (6). 4. Kylkropp enligt krav 1 eller 2, k ä n n e t e c k n a d av att profilinsatsen (10) är försedd ned minst ett klänorgan (22). ICooling body according to claim 1 or 2, characterized in that the profile insert (10) is provided down at least one clamping member (22). IN 5. Kylkropp enligt nagot av krav l-4,. k ä n n e t e c k - n a d av att profilinsatsen (10) genom från sin profilkropp (20) utstående stödben (12. 13) stöder sig på de not varandra vända flankerua (9) till de långa kylflänsarna (3).Cooling body according to any one of claims 1-4 ,. characterized in that the profile insert (10) rests on the flange row (9) facing the long cooling flanges (3) by supporting legs (12. 13) projecting from its profile body (20). 6. Kylkropp enligt krav 4 och 5. k ä n n e t e c k n a d av att profilinsatsens (10) klänorgan är utformat son ett nellan två stödben (12) anordnat klänhuvud (ll).Cooling body according to claims 4 and 5, characterized in that the clamping means of the profile insert (10) are designed as a clamping head (11) arranged between two support legs (12). 7. Kylkropp enligt ninst nagot av krav 1-6. k ä n n e - t e c k n a d av att tvâ långa kylflänsar (3) och en kort kylfläns (4) ned profilinsatsen (10) bildar åtminstone tva. företrädesvis fyra kammare (14. 15). 10 15 20 457 584Cooling body according to ninst any of claims 1-6. characterized in that two long heat sinks (3) and a short heat sink (4) down the profile insert (10) form at least two. preferably four chambers (14. 15). 10 15 20 457 584 8. Kylkropp enligt åtminstone nagot av krav 1-7. k ä n n e - t e c k n a d av att från profilinsatsens (10) profilkropp (20) tvärs för dess längdaxel (H) i och för sig kända tvär- flänsar (21) sticker ut.Cooling body according to at least one of claims 1-7. characterized by the fact that transverse flanges (21) known per se protrude from the profile body (20) of the profile insert (10) transversely to its longitudinal axis (H). 9. Kylkropp enligt krav 5 och 8, k ä n n e t e c k n a d av att tvärflänsarna (21) är ungefär av halva längden på stöd- benen (12, 13).Cooling body according to claims 5 and 8, characterized in that the transverse flanges (21) are approximately half the length of the support legs (12, 13). 10. Kylkropp enligt krav 8 eller 9. k ä n n e t e c k n a d av att tvärflänsarnas längd (h) är olika på en profilinsats- sida.Cooling body according to Claim 8 or 9, characterized in that the length (h) of the transverse flanges is different on a profile insert side. ll. Kylkropp enligt-åtminstone något av krav 1-7, k ä n - n e t e c k n a d av att den korta kylflänsens (4) höjd (a) mäter ungefär 1/3 till hälften av höjden (b) på den långa kylflänsen (3).ll. Cooling body according to at least one of Claims 1 to 7, characterized in that the height (a) of the short cooling flange (4) measures approximately 1/3 to half the height (b) of the long cooling flange (3). 12. Kylkropp enligt åtminstone något av krav 1-7 eller ll. k ä n n e t e c k n a d av.att den långa kylflänsens (3) höjd (b) förhåller sig till öppna bredden (I) lellan dessa kylflänsar son 3:1 och/eller den korta kylflänsens (4) höjd (a) förhåller sig till öppna bredden (n) nellan den och in- tilliggande ianga xylnäns (a) son 4:1.Cooling body according to at least one of Claims 1 to 7 or 11. characterized in that the height (b) of the long heat sink (3) relates to the open width (I) between these heat sinks 3: 1 and / or the height (a) of the short heat sink (4) relates to the open width ( n) nellan den and in- adjacent ianga xylnäns (a) son 4: 1.
SE8103779A 1980-06-30 1981-06-16 REFRIGERATOR FOR SEMI-CONDUCTOR SE457584B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3024748A DE3024748C2 (en) 1980-06-30 1980-06-30 Heat sinks for semiconductor components

Publications (2)

Publication Number Publication Date
SE8103779L SE8103779L (en) 1981-12-31
SE457584B true SE457584B (en) 1989-01-09

Family

ID=6106046

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8103779A SE457584B (en) 1980-06-30 1981-06-16 REFRIGERATOR FOR SEMI-CONDUCTOR

Country Status (4)

Country Link
DE (1) DE3024748C2 (en)
FR (1) FR2485807A1 (en)
GB (1) GB2079052B (en)
SE (1) SE457584B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3518310A1 (en) * 1985-05-22 1986-11-27 Aluminium-Walzwerke Singen Gmbh, 7700 Singen REFRIGERATOR BODY FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF
DE8703604U1 (en) * 1987-03-11 1988-07-21 Euroatlas GmbH für Umformertechnik und Optronik, 2800 Bremen Heat sink with semiconductor switch
DK0483058T3 (en) * 1990-10-24 1996-01-15 Alusuisse Lonza Services Ag Heat sink for semiconductor elements
DE9319259U1 (en) * 1993-12-15 1994-03-24 Siemens AG, 80333 München Heatsink
GB2333353A (en) * 1998-01-16 1999-07-21 Kuo Ching Sung Heat dissipating device
DE19806978B4 (en) * 1998-02-19 2008-08-21 Behr Gmbh & Co. Kg Cooling device for cooling by convection
DE102004040557A1 (en) * 2004-08-16 2006-02-23 Kern, Dietmar, Dr.-Ing. Electronics heatsink
DE102009037259B4 (en) * 2009-08-12 2012-04-19 Semikron Elektronik Gmbh & Co. Kg Arrangement with a cooling device and a power semiconductor module
US20160369995A1 (en) * 2015-06-16 2016-12-22 Posco Led Company Ltd. Optical semiconductor lighting apparatus
EP3403937B1 (en) * 2017-05-19 2021-01-13 Goodrich Lighting Systems GmbH Exterior aircraft light unit
DE102019107280A1 (en) * 2019-03-21 2020-09-24 apt Extrusions GmbH & Co. KG Cooling device for cooling a third-party object to be cooled
WO2020244727A1 (en) * 2019-06-03 2020-12-10 Huawei Technologies Co., Ltd. An apparatus for transferring heat from a heat source to air

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1959193A1 (en) * 1969-11-25 1971-05-27 Leonhard Roesch Knitting loops and courses indicator
DE7913126U1 (en) * 1979-05-07 1979-08-23 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt HEAT SINK MADE OF EXTRUDED ALUMINUM FOR PERFORMANCE SEMICONDUCTORS

Also Published As

Publication number Publication date
SE8103779L (en) 1981-12-31
FR2485807B3 (en) 1983-07-18
GB2079052A (en) 1982-01-13
DE3024748C2 (en) 1986-09-04
GB2079052B (en) 1984-10-24
DE3024748A1 (en) 1982-02-04
FR2485807A1 (en) 1981-12-31

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