RU2383043C2 - System and method of protecting microstructure of display matrix using pads in gap inside display device - Google Patents

Abstract

FIELD: physics; optics.

SUBSTANCE: display device has a matrix of interferometric modulators formed on a substrate, a rear plate, a seal and one or more pads. The seal is placed between the substrate and the rear plate together for mounting the matrix of modulators into the housing. The pads are placed between the matrix and the plate. The pads prevent contact of the rear plate with the matrix. The pads are not in contact with the rear plate or the matrix. The method of making a display device provides a matrix of interferometric modulators on a substrate. Pads are placed between the matrix and the rear plate and the rear plate and the substrate are sealed together.

EFFECT: prevention or reduced damages due to fitting the device into a housing and using pads.

39 cl, 76 dwg, 1 ex

Description

FIELD OF THE INVENTION

This invention relates to electronic devices. More specifically, this invention relates to a housing installation system and a method for protecting a microelectromechanical device from physical damage.

State of the art

Microelectromechanical systems (MEMS) include micromechanical elements, actuators and electronics. Micromechanical elements can be created using deposition, etching and / or other microprocessing processes that etch parts of the substrates and / or deposited layers of materials or which add layers to form electrical and electromechanical devices. One type of MEMS device is called an interferometric modulator. The interferometric modulator may comprise a pair of conductive plates, one or both of which can be transparent and / or reflecting in whole or in part and capable of relative movement when a corresponding electrical signal is applied. One plate may contain a stationary layer deposited on the substrate, the other plate may contain a metal membrane separated from the stationary layer by an air gap. Such devices have a wide range of applications, and it would be advantageous in the art to use and / or modify the characteristics of devices of these types so that their features can be used to improve existing products (products) and create new products that have not yet been developed.

Disclosure of invention

One embodiment of this invention is a display device (display) comprising an array of interferometric modulators formed on a substrate. This embodiment includes a backplane and a seal sandwiched between the substrate and the backplane, the backing and backplane being tightly fastened together to mount the matrix of interferometric modulators in the housing. Between the matrix and the backplane, one or more spacers (spacers or dividers) are disposed, these one or more spacers protecting the backplane from contact with the matrix.

Another embodiment of this invention is a method of manufacturing a display device. This embodiment includes providing an array of interferometric modulators on the substrate and placing one or more spacers on this substrate. This method also includes tightly attaching the backing plate to the substrate to form the display device, these one or more spacers protecting the backing plate from contact with the matrix.

Another embodiment of this invention is a display device manufactured using a method including providing an array of interferometric modulators on a substrate and placing one or more spacers on this substrate. The manufacturing method of the display device also includes tightly attaching the backing plate to the substrate to form the display device, wherein one or more spacers protect the backing plate from contact with the matrix.

Another embodiment of this invention is a display device. In this embodiment, the display device includes transmitting means for transmitting light therethrough and modulating means for modulating light transmitted through the transmitting means. The display device also comprises coating means for coating the modulating means and sealing means arranged between the transmission means and the covering means for forming the housing. In addition, the display device includes spacer means for preventing the modulating means and the coating means from contacting each other within the display device.

Brief Description of the Drawings

These and other aspects of the present invention will become more apparent from the following description and from the accompanying drawings (not to scale), which are intended to illustrate and not limit this invention.

1 is an isometric view showing a portion of a display based on interferometric modulators according to one embodiment in which the movable reflective layer of the first interferometric modulator is in the inactive position and the movable reflective layer of the second interferometric modulator is in the activated position.

FIG. 2 is a block diagram of a system showing one embodiment of an electronic device including an interferometric modulator-based 3 × 3 matrix display.

Figure 3 is a diagram of the dependence of the positions of the movable mirror on the applied voltage for one exemplary embodiment of the interferometric modulator of Figure 1.

Figure 4 is an illustration of a set of row and column voltages that can be used to drive a display based on interferometric modulators.

FIG. 5A shows one exemplary frame of displayed data in a 3 × 3 matrix display based on interferometric modulators of FIG. 2.

FIG. 5B shows one exemplary timing diagram for row and column signals that can be used to record the frame of FIG. 5A.

6A is a cross section of the device of FIG. 1. 6B is a cross-sectional view of an alternative embodiment of an interferometric modulator. 6C is a cross section of an alternative embodiment of an interferometric modulator.

FIGS. 7A and 7B show an exploded view and cross section of one embodiment of a display housing comprising a gasket. Fig. 7C shows an embodiment of a display case comprising a recessed cover. Fig. 7D shows an embodiment of a display case that comprises a curved back plate.

Fig. 8A shows a cross-section of an embodiment of a recessed cover. Fig. 8B shows a cross-section of an embodiment of a back plate containing reinforcing ribs. Fig. 8C shows a cross-section of an embodiment of a recessed cover comprising reinforcing ribs. Fig. 8D and Fig. 8E show, in cross section, back plates containing cavities in which the desiccant is housed.

9 shows a cross section of a dual matrix device that contains two arrays of interferometric modulators.

10 shows a cross-section of an embodiment of a display case containing a desiccant.

11A shows a top view of an embodiment of a device in which the gaskets are arranged in a substantially ordered manner (with a regular structure or pattern). 11B shows a top view of an embodiment of a device in which the gaskets are arranged randomly (with an arbitrary pattern). 11C shows a top view of an embodiment of a device in which gaskets are located near the center of the matrix. 11D shows a top view of an embodiment of a device in which the gaskets are denser near the center of the matrix and less dense near the periphery. 11E shows a top view of an embodiment of a device comprising three concentric zones of gaskets.

12A to 12T show gasket embodiments.

13A shows a top view of an embodiment of a device comprising gaskets that extend over at least two columns in a matrix. 13B shows a top view of an embodiment of a device comprising disk-shaped gaskets that extend over at least two columns in a matrix.

FIG. 14 shows a top view of an embodiment of a device comprising gaskets at least as large as one interferometric modulator element in a matrix.

Figa shows a top view of a variant embodiment of a device containing gaskets, essentially centered above the columns. Figv shows a top view of a variant embodiment of the device in which some part of each gasket is located above the column. Fig. 15C shows a top view of an embodiment of a device in which no part of any gasket is located above any column.

16 shows a top view of an embodiment of a device comprising gaskets of various sizes.

17A shows a top view of an embodiment of a device comprising a grid spacer. FIG. 17B shows a top view of an embodiment of a device comprising a grid spacer that is denser in the center than in the periphery. Fig.17C shows a top view of a solid rectangular strip. Fig.17D shows a top view of a solid diagonal strip.

Fig. 18A shows a cross section of an embodiment of a device comprising a film spacer. FIG. 18B shows a cross section of an embodiment of a device comprising a film pad with a non-planar cross section. Fig. 18C shows a cross-section of an embodiment of a device comprising a bag-shaped film pad.

19 shows a cross section of an embodiment of a device comprising a plurality of film gaskets.

Figa-Fig.20D show in cross section the reaction of the gasket with a triangular cross section according to one variant embodiment of the applied force. Fig. 20E shows an embodiment of a gasket with a thinner upper part and a thicker lower part. Fig. 20F shows a cross-section of an embodiment of a gasket with two regions that respond differently to the applied force.

21A shows a cross-section of an embodiment of a device in which a spacer extends between a matrix and a backplate. FIG. 21B shows a cross section of an embodiment of a device in which the gasket is in contact with the matrix, but not with the backplane. Fig. 21C shows a cross section of an embodiment of a device in which the gasket is in contact with the backplate, but not with the matrix.

22A shows a cross section of an embodiment of a device comprising integral gaskets formed over columns of interferometric modulators. Fig. 22B shows a cross-section of an embodiment of a device comprising integral gaskets formed over columns of interferometric modulators of various heights and a second gasket placed on these integral gaskets. Fig. 22C shows a cross-section of an embodiment of a device comprising integral gaskets formed over columns of interferometric modulators and a second gasket that grips the integral gaskets.

23 is a flowchart showing an embodiment of a method of manufacturing an electronic device mounted in a housing that is resistant to physical damage.

24 is a flowchart showing an embodiment of a method for protecting an electronic device from physical damage.

25A and 25B are system block diagrams showing an embodiment of a visual display device comprising a plurality of interferometric modulators.

Detailed Description of Specific Embodiments

Electronic devices are susceptible to damage due to physical influences, such as falls, twisting, shock, compression, and the like. Some devices are more susceptible to damage than others. For example, devices with moving parts are susceptible to displacement or breakage of one or more of the moving parts. Some devices based on microelectromechanical systems (MEMS) are especially sensitive to physical influences due to the exact dimensions of their component parts. Therefore, such devices are typically mounted in a housing to reduce or prevent unwanted contacts that may cause damage to the device.

In some cases, the case itself is distorted or deformed by external forces, which cause the case parts to come into contact and in some cases damage or impair the operation of the device mounted in the case. Accordingly, there is provided a mounting system in a housing for electronic devices, including MEMS devices, which includes gaskets configured to prevent or reduce the contacts of parts in a device mounted in the housing that are likely to damage this electronic device. In some embodiments, the gaskets are configured to prevent or reduce damage resulting from contacts between the matrix of interferometric modulators and the backplane of the housing mounting system for this device. Therefore, in some embodiments, a housing-mounted display comprising one or more gaskets is thinner than an equivalent housing-mounted display made without gaskets, since the gaskets allow the backplane to be placed closer to the matrix of interferometric modulators, as discussed below.

MEMS devices based on interferometric modulators disclosed herein are applicable in the manufacture of display devices (displays). In some embodiments, the display comprises an array of interferometric modulators formed on the substrate, thereby providing a device that is relatively thin compared to its length and / or width. Some embodiments of such structures are susceptible to deflection or deformation by a force having a component normal to the surface of this device. Some embodiments of such structures are susceptible to torsional deformation. Specialists in this field should be clear that, ceteris paribus, the deviation or deformation will increase with increasing length and / or width of this device.

Efforts that are likely to cause such deviations and / or deformations are not unusual in portable electronic devices. Such efforts arise, for example, in applications related to the touch screen, or in interfaces based on the use of a pen. Moreover, it is common for users to touch or press on the surface of a display, for example, when specifying any image on a computer display. Inadvertent contact with the display also occurs, for example, on the display of a mobile phone in a user's pocket or wallet.

The following detailed description is directed to certain specific embodiments of this invention. However, the present invention can be embodied in many different ways. In this description, reference is made to the drawings, wherein like parts are denoted everywhere by like reference numerals. As will be seen from the following description, this invention can be implemented in any device that is capable of displaying an image whether in motion (e.g., video), or in static (e.g., still image, photograph), whether it is text or a picture. More specifically, it is contemplated that this invention may be practiced in or associated with a wide variety of electronic devices, such as, but not limited to, mobile phones, wireless devices (radio devices), personal digital assistants (PDAs or PDAs), handheld or laptop computers , receivers / navigators of the Global Positioning System (GPS or GPS), filming cameras, MP3 players, video cameras, game consoles (consoles), watches, wall or floor clocks, alarm clocks, calculators, television e monitors, flat-screen displays, computer monitors, car displays (e.g., odometer display (i.e. trip meter), etc.), cockpit controls and / or displays, camera display (e.g. display rear view cameras in a vehicle), electronic cameras, electronic bulletin boards, billboards or signs, road signs, projectors, architectural structures, mounting means in a case and aesthetic structures (for example, displays for displaying images on jewelry spruce). MEMS devices with a design similar to those described here can also be used in applications that do not use displays, such as, for example, in electronic switching devices.

One embodiment of a display based on interferometric modulators comprising an interferometric MEMS display element is shown in FIG. In these devices, the pixels are either in bright or dark state. In a bright (“on” or “open”) state, the display element reflects most of the incident visible light to the user. Being in a dark (“off” or “closed”) state, the display element reflects little incident light visible to the user. Depending on the embodiment, the light reflection properties of the “on” and “off” states can be reversed. MEMS pixels can be configured to reflect primarily on selected colors, making it possible to create a color display in addition to black and white.

Figure 1 is an isometric view depicting two adjacent pixels in a row of pixels of a visual display, each pixel containing an interferometric MEMS modulator. In some embodiments, the interferometric modulator display comprises a row / column matrix of these interferometric modulators. Each interferometric modulator includes a pair of reflective layers located at a variable and controlled distance from each other with the formation of a resonant optical cavity with at least one variable linear size. In one embodiment, one of the reflective layers can move between two positions. In the first position, indicated here as an inactive state, the movable layer is located at a relatively large distance from the fixed (fixed) partially reflective layer. In the second position, the movable layer is located closer to the partially reflective layer. The incident light that is reflected from these two layers interferes constructively or destructively depending on the position of the moving reflective layer, giving either a fully reflective or non-reflective state for each pixel.

The illustrated pixel matrix portion of FIG. 1 includes two adjacent interferometric modulators 12a and 12b. In the interferometric modulator 12a, on the left side, the movable and highly reflective layer 14a is shown in an inactive position at a predetermined distance from the fixed partially reflective layer 16a. In the interferometric modulator 12b on the right side, the movable highly reflective layer 14b is shown in the activated position next to the fixed partially reflective layer 16b.

The fixed layers 16a, 16b are electrically conductive, partially transparent and partially reflective and can be made, for example, by depositing one or more layers, each of chromium and indium tin oxide, on a transparent substrate 20. The layers are applied with a parallel strip pattern and can form row electrodes in a display device, as further described below. The movable layers 14a, 14b may be formed as a sequence of parallel strips of the deposited metal layer or layers (orthogonal to the electrodes 16a, 16b of the rows) deposited (s) on top of the columns 18 and an intermediate removable material deposited between the columns 18. When the material to be removed is etched, deformable metal layers are separated from the fixed metal layers by a certain defined air gap 19. For deformable layers, a highly conductive and reflective material such as like aluminum, and these strips can form column electrodes in the display device.

In the absence of an applied voltage, a cavity 19 remains between the layers 14a, 16a, and the deformable layer is in a mechanically unstressed (“relaxed”) state, as shown by the pixel 12a in FIG. 1. However, when a potential difference is applied to the selected row and column, the capacitor formed at the intersection of the row and column electrodes in the corresponding pixel becomes charged, and electrostatic forces pull the electrodes together. If the voltage is high enough, the movable layer is deformed and forcibly moved to the fixed layer (dielectric material may be deposited on the fixed layer, which is not shown in this figure to prevent shorting and control their distance separating them), as shown by the pixel 12b on the right side in figure 1. The behavior is the same regardless of the polarity of the applied potential difference. Thus, row / column activation, which can control the reflective and non-reflective states of a pixel, is in many respects similar to the activation used in standard liquid crystal displays (LCDs or LCDs) and displays based on other technologies.

In the figures of FIG. 2 to FIG. 5B, one exemplary process and system for using an array of interferometric modulators as applied to a display is shown. FIG. 2 is a block diagram of a system showing one embodiment of an electronic device, which may include aspects of this invention. In an exemplary embodiment, the electronic device includes a processor 21, which may be any general purpose single-chip or multi-chip microprocessor, such as ARM, Pentium ^® , Pentium II ^® , Pentium III ^® , Pentium IV ^® , Pentium ^® Pro, 8051st, MIPS ^® , Power PC ^® , ALPHA ^® , or any special purpose microprocessor, such as a digital signal processor, microcontroller or matrix of programmable logic elements. As is standard in the art, processor 21 may be configured to execute one or more software modules. In addition to executing the operating system, the processor may be configured to execute one or more software applications, including a Web browser, a telephone application, an email program, or any other software application.

In one embodiment, processor 21 is also configured to couple to matrix controller 22. In one embodiment, the matrix controller 22 includes a row drive circuit 24 and a column drive circuit 26 that provide signals to the pixel matrix 30. The cross section of the matrix illustrated in FIG. 1 is shown by lines 1-1 in FIG. 2. For interferometric MEMS modulators, the row / column activation protocol may take advantage of the hysteresis property of these devices shown in FIG. 3. A potential difference of 10 volts may be required, for example, in order to cause the moving layer to deform from an inactive state to an activated state. However, when the voltage decreases from this value, the movable layer retains its state as the voltage drops back below 10 volts. In the illustrative embodiment of FIG. 3, the movable layer is not completely “released” until the voltage drops below 2 volts. Thus, there is a certain voltage range of about 3 to 7 V in the example shown in FIG. 3, where there is a range (“window”) of the applied voltage, inside which the device is stable either in an inactive state or in an activated state. It is referred to herein as a “hysteresis window” or “stability window”. For a display matrix having the hysteresis characteristics of FIG. 3, a row / column activation protocol can be designed so that during gating of the row, the pixels in the gated row to be activated are exposed to a voltage difference of about 10 volts, and the pixels that should remain unexcited, are exposed to a voltage difference close to zero volts. After the strobe pulse, the pixels are exposed to the potential difference of the steady state of about 5 volts, so that they remain in the state in which the string strobe pulse placed them. After recording, each pixel is located at a potential difference inside the “stability window” of 3-7 volts in this example. This feature makes the pixel construction shown in FIG. 1 stable under the same applied voltage conditions in either an activated or non-activated pre-existing state. Since each pixel of the interferometric modulator, in the activated or non-activated state, is essentially a capacitor formed by fixed and movable reflective layers, this stable state can be maintained at a voltage inside the hysteresis window with almost complete absence of energy dissipation. If the applied potential is fixed, then essentially no current flows into the pixel.

In conventional applications, a display frame can be created by assigning a set of column electrodes in accordance with the desired set of activated pixels in the first row. Then, a line pulse is applied to the row 1 electrode, activating the pixels corresponding to the assigned column buses. The assigned set of column electrodes is then changed to match the desired set of activated pixels in the second row. Then a pulse is applied to the electrode of row 2, activating the corresponding pixels in row 2 in accordance with the designated column electrodes. The pixels of line 1 are not affected by the pulse of line 2, and remain in the state in which they were set during the pulse of line 1. This can be repeated for the entire sequence of lines in a sequential manner so as to produce a frame. In general, frames are updated and / or adjusted by new displayed data by continuously repeating this process at a desired number of frames per second. A wide variety of protocols for controlling the electrodes of rows and columns of pixel arrays to reproduce image frames in a display are also well known and can be used in conjunction with the present invention.

FIG. 4, FIG. 5A and FIG. 5B show one possible activation protocol for creating an image frame in a display based on the 3 × 3 matrix of FIG. 2. Figure 4 shows a possible set of voltage levels of columns and rows that can be used for pixels showing hysteresis curves of Figure 3. In the embodiment of FIG. 4, activating a pixel includes setting the corresponding column to -V _offsets and the corresponding row to + ∆V, which may correspond to -5 volts and +5 volts, respectively. Pixel excitation is performed by setting the corresponding column to

+ V _bias and the corresponding row by the same + ∆V, producing a potential difference per pixel of zero volts. In those rows where the voltage of the string is maintained at zero volts, the pixels are stable in the state in which they were originally, regardless of whether the column is at + V _bias or -V _bias .

FIG. 5B is a timing chart showing a sequence of row and column signals applied to the 3 × 3 matrix of FIG. 2, which result in the display configuration shown in FIG. 5A, where the activated pixels are non-reflective. Before recording the frame shown in FIG. 5A, the pixels can be in any state, and in this example, all rows are at 0 volts, and all columns are at +5 volts. With these applied voltages, all pixels are stable in their existing activated or non-activated states.

In the frame of FIG. 5A, pixels (1,1), (1,2), (2,2), (3,2), and (3,3) are activated. To achieve this, during “bus turn-on time” for row 1, columns 1 and 2 are set to -5 volts, and column 3 is set to +5 volts. This does not change the state of any pixels, since all pixels remain in the 3-7-volt stability window. Line 1 is then gated by a pulse that goes from 0 up to 5 volts and back to zero. This activates the pixels (1,1) and (1,2) and removes the excitation from the pixel (1,3). No other pixels in the matrix are affected. To set row 2 in the desired way, column 2 is set to -5 volts, and columns 1 and 3 are set to +5 volts. The same strobe pulse applied to line 2 then activates the pixel (2,2) and removes the excitation from the pixels (2,1) and (2,3). Again, no other matrix pixels are affected. Row 3 is set similarly by setting columns 2 and 3 to -5 volts and column 1 to +5 volts. The strobe of line 3 sets the pixels of line 3, as shown in FIG. 5A. After recording the frame, the row potentials are zero, and the column potentials can remain either at +5 or -5 volts, and then the display is stable in the configuration of FIG. 5A. It should be noted that the same procedure can be applied to matrices of tens or hundreds of rows and columns. You should also take into account that the synchronization, sequence and voltage levels used to perform the activation of rows and columns can vary widely within the general principles outlined above, and the above example is only illustrative, and any activation method can be used with the present invention. based on stress.

The design details of interferometric modulators that operate in accordance with the principles set forth above can vary widely. For example, FIGS. 6A-6C show three different embodiments of the design of movable mirrors. Fig. 6A is a cross-sectional view of the embodiment of Fig. 1, where the strip of metal material 14 is deposited on orthogonally extending supports 18. In Fig. 6B, the movable reflective material 14 is attached to the supports only in the corners, on ties 32. In Fig. 6C, the reflective material 14 hangs from the deformable layer 34. This embodiment has advantages since the structural arrangement and the materials used for the reflective material 14 can be optimized for optical properties, and the structural arrangement and the materials used for the deformable layer 34 can be optimized for the desired mechanical properties. The manufacture of various types of interferometric devices is described in a variety of published documents, including, for example, published patent application US 2004/0051929. A wide variety of well-known technologies can be used to produce the above structures, including a sequence of material deposition, patterning, and etching steps.

FIGS. 7A and 7B show an exploded view and cross-section of one embodiment of an electronic device 700 mounted in a housing comprising a substrate 710, an interferometric modulator array 720 720, one or more spacers 730, a seal 740, and a backplane 750. How 7B, the device 700 has a first side 702 and a second side 704. The substrate 710 has a first surface 712 and a second surface 714. On the second surface 714 of the substrate, an interference matrix 720 is formed tric modulators. In the shown embodiment, the backplane 750 is attached to the substrate 710 by a seal 740. One or more spacers 730 are placed between the matrix 720 and the backplane 750. Also, the x, y, and z axes are shown in FIG. 7A, and FIG. 7B are the y and z axes.

Substrate 710 and interferometric modulators 722 are described in more detail above. Briefly, the substrate 710 is any substrate on which an interferometric modulator 722 can be formed. In some embodiments, the device 700 displays an image visible from the first side 702, and accordingly, the substrate 710 is substantially transparent and / or translucent. For example, in some embodiments, the substrate is made of glass, silica (quartz) and / or alumina. In other embodiments, the substrate 710 is substantially not transparent and / or translucent, for example, in a device 700 that displays an image visible from the second side 704, or in a device 700 that does not display a visible image. In some embodiments, the first substrate surface 712 further comprises one or more additional structures, for example, one or more structural, protective, and / or optical films.

Interferometric modulators 722 are of any type. In some embodiments, the interferometric modulator 722 comprises a mechanical layer 724 that is remote from the substrate 710 and located close to the backplane 750. As discussed in more detail below, in some embodiments, the mechanical layer 724 is susceptible to physical damage.

In the shown embodiments, the seal 740 attaches the backplate 750 to the substrate 710. The term “perimeter bearing” is also used to refer to the seal 740. In the embodiment shown in FIG. 7B, the seal 740 also serves to maintain a predetermined distance between the backplate 750 and the substrate 710. In the embodiment shown in FIG. 7C, the seal 740 'does not have a spacing function. In some embodiments, the seal does not or does not release any volatile compound, such as hydrocarbons, acids, amines, and the like, in the form of gas. In some embodiments, the seal is partially or substantially completely impervious to liquid water and / or water vapor. In some embodiments, the seal is partially or substantially completely impervious to air and / or other gases. In some embodiments, the seal is rigid. In other embodiments, the seal is resilient or resilient. In other embodiments, the seal comprises both rigid and elastic or resilient parts. In some embodiments, the seal comprises one or more adhesives compatible with the substrate and / or backplane. Adhesive or adhesives are any suitable type known in the art. In some embodiments, one or more adhesives are pressure sensitive. In some embodiments, one or more adhesives are thermally curable. In some embodiments, one or more adhesives are UV curable. In some embodiments, the seal is thermally coupled to the substrate and / or backplane. In some embodiments, the seal is mechanically attached to the substrate and / or backplane. In some embodiments, a combination of methods is used to attach the seal to the substrate and / or backplane. In some embodiments, there is no seal, for example, where the substrate is directly attached to the backplate, for example, by heat welding.

The seal contains any suitable material such as metals, steel, stainless steel, brass, titanium, magnesium, aluminum, copper, tin, lead, zinc, solder, polymer resins, epoxies, polyamides, polyalkenes, polyesters, polysulfones, polystyrene, polyurethanes , polyacrylates, cyanoacrylates, acrylic epoxies, silicones, rubbers, polyisobutylene, neoprene, polyisoprene, butadiene-styrene copolymer, parylene, UV curable adhesives, ceramics, glass, silicon dioxide (quartz), alumina and mixtures thereof, copolymers, alloys and / or composites. In some embodiments, the seal further comprises reinforcing, for example, fibers, a mesh and / or web, for example, glass, metal, carbon, boron, carbon nanotubes, and the like. In some embodiments, the selected seal material is partially or substantially completely waterproof. Accordingly, in some embodiments, the seal is a semi-hermetic or hermetic seal. In some embodiments, the seal has a thickness of less than about 50 microns, for example, from about 10 microns to about 30 microns. In some embodiments, the seal has a width of from about 0.5 mm to about 5 mm, for example, from about 1 mm to about 2 mm.

Returning to FIG. 7A and FIG. 7B, an embodiment of a method for manufacturing the shown seal 740 using UV curable epoxy is described below. The epoxy resin is applied to the backing plate 750 and / or the substrate 710 using means known in the art, for example by printing. The type and amount of epoxy is pre-selected to provide a seal 740 with the desired width, thickness, and moisture permeability. The backplate 750 and the substrate 710 are brought together and the epoxy resin is cured by irradiation with a suitable UV source. Conventional epoxy cures using a UV power of approximately 6,000 mJ / cm ² . Some embodiments also include calcination after curing at a temperature of about 80 ° C.

The backplane 750 is also referred to herein as a “cover” or “backplane”. These terms are not intended to limit the position of the backplane 750 within the device 700 or the orientation of the device 700 itself. In some embodiments, the backplane 750 protects the matrix 720 from damage. As discussed above, some embodiments of the interferometric modulator 722 have the potential to be damaged by physical exposures. Therefore, in some embodiments, the backplane 750 protects the matrix 720 from contact with foreign objects and / or other parts in an apparatus containing the matrix 720, for example. Moreover, in some embodiments, the backplate 750 protects the matrix 720 from other environmental influences, such as humidity, moisture, dust, changes in atmospheric pressure, and the like.

In those embodiments in which the device 700 displays an image visible from the second side 704, the backplane 750 is substantially transparent and / or translucent. In other embodiments, the backplane 750 is substantially opaque and / or translucent. In some embodiments, the backplate 750 is made of a material that does not or does not release any volatile compound, such as hydrocarbons, acids, amines, and the like, in the form of gas. In some embodiments, the backplate 750 is substantially impervious to liquid water and / or water vapor. In some embodiments, the backplate 750 is substantially impervious to air and / or other gases. Suitable materials for the backplate 750 include, for example, metals, steel, stainless steel, brass, titanium, magnesium, aluminum, polymer resins, epoxies, polyamides, polyalkenes, polyesters, polysulfones, polystyrene, polyurethanes, polyacrylates, parylene, ceramics, glass, silicon dioxide (quartz), alumina, and also mixtures thereof, copolymers, alloys, composites and / or combinations. Examples of suitable composite materials include commercially available composite films from Vitex Systems (San Jose, CA, USA). In some embodiments, the backplate 750 further comprises reinforcing, for example, fibers and / or a web, for example, glass, metal, carbon, boron, carbon nanotubes and the like.

In some embodiments, the backplane 750 is substantially rigid (inflexible). In other embodiments, the backplane 750 is flexible, for example in the form of a foil or film. In some embodiments, the backplane 750 is deformed into the predetermined configuration before and / or during assembly of the structure 700 mounted in the housing. As will be discussed in more detail below, in some embodiments, the backplane 750 is an element in the system designed to prevent damage to the matrix 710.

The backplane 750 has an inner surface 752 and an outer surface 753. In some embodiments, the inner surface and / or outer surface of the backplane further comprises one or more additional structures, for example, structural, protective, mechanical, and / or optical film or films.

In the embodiment shown in FIG. 7B, the backplate 750 is substantially flat. Fig. 7C shows an embodiment of a device 700 'in which the inner surface 752' of the backplate is recessed, thereby forming a flange 754 'around the perimeter of the backplane 750'. A backplane with this configuration is referred to herein as a “recessed cover”.

Fig. 7D shows in cross section an embodiment of a device 700 "mounted in the housing, comprising a curved or bent backplane 750". In the shown embodiment, the spacers 730 "are located adjacent to the periphery of the matrix 720", which is relatively closer to the backplane 750 ", and therefore are more likely to come into contact with the backplane 750" and withstand damage. Other embodiments comprise a different configuration of one or more gaskets. Gaskets are discussed in more detail below. In some embodiments, the backplate 750 "is preformed into a curved configuration. In other embodiments, the curved backplate 750" is formed by bending or deforming a substantially flat starting material during assembly of the enclosure 700 ". For example, in in some embodiments, an interferometric modulator matrix 720 "is formed on a substrate 710 as described above. Sealing material, such as UV curable epoxy, nano it is at the periphery of a substantially flat backplane 750 ", which is wider and / or longer than the substrate 710". The backplane 750 "is deformed, for example by compression, to the desired size and placed on the substrate 710". Epoxy the resin is cured, for example, using UV radiation to form a 740 "seal.

Other embodiments of the backplane are shown in FIGS. 8A-8C. 8A shows a recessed cover 850 in which the inner surface 852 is concave. In the shown embodiment, the inner surface 852 and the outer surface 853 are not parallel. Consequently, the recessed cover 850 is thinner in the center 858 than along the edge 859. Those skilled in the art should understand that other variations are possible. The shown embodiment includes a peripheral flange 854 that defines the minimum distance between the substrate and the inner surface 852 of the backplate in the form of a recessed cover. In some embodiments, the peripheral flange 854 forms a substantially continuous structure around the periphery of the recessed cover 850. In other embodiments, the peripheral flange 854 is not continuous. Other embodiments do not contain a peripheral flange. In FIG. 8B, the backplate 850 includes reinforcing ribs 856 on its outer surface 853. In other embodiments, reinforcing ribs are located on the inner surface 852 or on both surfaces of the backplane. In some embodiments, the reinforcing structure has a different shape, such as a lattice or honeycomb. Some embodiments contain a combination of these features. For example, FIG. 8C shows an embodiment of a recessed cover 850 with a concave inner surface 852 and reinforcing ribs 856 on the outer surface 853. Some embodiments of the disclosed back plates exhibit improved properties, such as strength, weight, cost, stiffness, transparency, ease of manufacture, and the like. like that.

Fig.8D and Fig.8E show in cross section of the back plate containing one or more cavities configured to contain a desiccant. Fig. 8D shows an embodiment of a backplane 850 comprising a cavity 857 formed on the inner surface 852 of the backplane, i.e. between backplane and matrix. The desiccant 855 is housed in the cavity 857. FIG. 8E shows an embodiment of the backplate 850 in the form of a recessed cover containing two cavities 857 in which the desiccant 855 is housed. In the embodiments shown in FIGS. 8D and 8E, the desiccant 855, essentially does not protrude beyond the inner surface 852 of the backplane. Accordingly, the same gaskets discussed below can be used anywhere between the matrix and the backplane. The linear dimensions of the cavities 857 are selected in accordance with factors known in the art, for example, the properties of the desiccant, the amount of desiccant to be used, the amount of moisture to be absorbed, the volume of the device, the mechanical properties of the backplate, and the like. Suitable desiccants and methods for attaching the desiccant to the backplate are discussed below. Specialists in this field should be clear that in other embodiments, the cavity 857 have a different configuration, for example, length, width, thickness and / or shape. Cavities 857 are manufactured by any method known in the art, for example, etching, embossing, stamping, engraving, machining, grinding, milling, sandblasting, injection molding, shrinkage and the like. In some embodiments, depressions are created by making the submerged parts of the backplate 859, for example, using glue, welding, smelting, sintering, and the like. For example, in some embodiments, a glass suspension is sprayed onto or formed on a backplate, and the suspension is melted or sintered to form a cavity. Specialists in this field should understand that combinations of these methods are also suitable for the manufacture of back plates with any of the features described here, for example back plates shown in FIGS. 7A-FIG. 7D and FIG. 8A-FIG. 8E.

Referring again to FIG. 7B, a seal 740 extends between the substrate 710 and the backplane 750. In some embodiments, the substrate 710, the backplane 750 and the seal 740 together substantially completely surround (i.e. enclose in the shell or housing) the matrix 720. In some embodiments, the housing 706 formed by them is substantially impervious to liquid water, water vapor and / or particles, such as dirt or dust. In some embodiments, the housing 706 is substantially hermetically and / or semi-hermetically sealed.

In some embodiments, the inner surface 752 of the backing plate is in contact with the matrix 720. In some embodiments, the inner surface 752 is not in contact with the matrix 720. In some embodiments, the gap or free space between the inner surface 752 of the backing plate and the matrix 720 is at least approximately 10 microns. In some preferred embodiments, the gap is from about 30 microns to about 100 microns, for example, about 40 microns, 50 microns, 60 microns, 70 microns, 80 microns or 90 microns. In some embodiments, the gap is more than 100 μm, for example, 0.5 mm, 1 mm or more. In some embodiments, the gap or free space between the inner surface 752 of the backplane and the matrix 720 is not constant.

Fig. 9 shows an embodiment of a housing-mounted device 900 comprising a first substrate 910a on which a first matrix 920a of interferometric modulators 922a is formed, and a second substrate 910b on which a second matrix 920b of interferometric modulators 922b is formed. A device with this configuration is also referred to herein as a “dual matrix device”. Such a device can be considered as a device in which the backplane is replaced with a second matrix of interferometric modulators. Accordingly, the device 900 mounted in the housing is capable of simultaneously displaying a first image on a first matrix 920a and a second image on a second matrix 920b. The device 900 mounted in the housing also includes a seal 940, as described above. Between the first matrix 920a and the second matrix 920b are one or more gaskets 930 of any suitable type disclosed herein.

The embodiment 1000 shown in FIG. 10 comprises an array 1020 of interferometric modulators formed on a substrate 1010. A backplate 1050 in the form of a recessed cover and a seal 1040 together with the substrate 1010 form a cavity or enclosed space 1006 in which one or more spacers 1030 are housed In the embodiment shown, the backplate 1050 comprises one or more separate desiccant blocks 1055. The desiccant maintains reduced moisture within the enclosed space 1006. In some In other embodiments, the desiccant package 1055 is attached to the inner surface 1052 of the backplate, for example using glue, thermally and / or mechanically. Suitable packages in which the desiccant is suitably contained are known in the art, including, for example, a container with a mesh surface, a perforated container, a pouch made of a permeable web or binding material, and the like. In other embodiments, the package is a sheet of suitable material attached to a backing plate, for example using pressure-sensitive adhesive. In some embodiments, the packaging is non-dust generating, i.e. dust resistant. In some embodiments, the desiccant is embedded in an inert carrier, such as a polymer resin, and this assembly is attached to the inner surface 1052. In some embodiments, the desiccant 1055 is directly attached to the inner surface 1052 of the backing plate. In some embodiments, the material of which the backplane 1050 is made comprises a desiccant. In some embodiments, the backplane comprises a layer of applied desiccant. For example, in some embodiments, a liquid desiccant or desiccant is applied to the backplate 1050, dissolved or suspended in a suitable liquid, and then calcined, thereby forming a desiccant layer on the backplane 1050. In other embodiments, the desiccant is mixed with an uncured polymer resin, and this mixture is applied to the backplane 1050 and cured.

A desiccant is any suitable desiccant known in the art, for example, metal oxides, calcium oxide, barium oxide, boric acid anhydride, phosphorus pentoxide, metal sulfates, calcium sulfate, magnesium sulfate, sodium sulfate, metals, sodium, lead / sodium alloy , metal hydrides, sodium borohydride, sodium hydride, lithium aluminum hydride, silica gel, activated alumina, zeolites, molecular sieves, phosphorus, metal salts, magnesium perchlorate, zinc chloride, carbon nanotubes, as well as x combinations.

Returning to FIG. 7A and FIG. 7B, as discussed above, in some embodiments, device 700 is deformed by external force. Specialists in this field should understand that in some embodiments, deformation will result in relative or different movements of the matrix 720 and the backplate 750. In some embodiments, the forces that are likely to occur during normal use of the device 700, for example, in manufacturing devices 700, when installing the device 700 in any device or in the normal use of the device 700, are insufficient to cause the matrix 720 to come into contact with body plate 750. As discussed above, some details of the interferometric modulator 722, such as the mechanical layer 724, are susceptible to damage by physical contact. Therefore, in these embodiments, the backplane 750 is unlikely to damage the matrix 720 and / or interferometric modulators 722 in this matrix under normal use.

In other embodiments, the forces that are likely to occur with the normal use of device 700 are sufficient to cause the matrix 720 to come into contact with the backplane 750, typically in the center or near the center of the backplane 750 and the matrix 720. For example, it will be understood by those skilled in the art that, under all other remaining equal conditions, as the length and / or width of the device 700 increases (along the x and / or y axes, as shown in FIG. 7A), the relative displacement of the mat Ritsa 720 and backplane 750 will also increase. The length and / or width of the device 700 will increase, for example, with an increase in the size and / or number of interferometric modulators 722 in the matrix 720. At some point, the force that is likely to occur during normal use of the device 700 will cause relative movement, which will cause some a portion of the matrix 720 is in contact with the backplane 750, thereby potentially damaging one or more interferometric modulators 722 in this device. In some embodiments, the increased likelihood of contact between the matrix 720 and the backplane 750 is counteracted by increasing the distance between the matrix 720 and the backplane 750. In some embodiments, the increased likelihood of contact between the matrix 720 and the backplane 750 is counteracted by increasing the stiffness of the device 700, for example substrates 710, backplate 750 and / or seals 740. Methods for increasing stiffness are known in the art and include os, e.g., increasing the rigidity of a component, modifying the linear dimensions of a component, changing the shape or profile of a component, the introduction of the reinforcement and the like.

In some embodiments, the increased likelihood of contact between the matrix 720 and the backplane 750 is counteracted by increasing the distance between the matrix 720 and the inner surface 752 of the backplane. In some embodiments of the device, a backplane 850 is used, as shown in FIG. 8A, the inner surface 852 of which is concave, thereby increasing the distance between the center 858 of the backing plate and the matrix 820. Referring to FIG. 7B, increasing the distance between the inner surface of the backing plate 752 and a matrix 720 tends to increase the thickness of the device 700, especially if the parts in the device are also thicker to increase rigidity. In some applications, a thicker device 700 is undesirable.

Accordingly, some embodiments of the device 700 comprise one or more gaskets 730 located between the matrix 720 and the backplane 750. The gasket (s) 730 are configured (s) to prevent and / or reduce contact between the matrix 720 and the backplane 750 when the device 700 is subjected to a deforming force, thereby preventing and / or reducing damage to interferometric modulators 722. In some embodiments, the backplane 750 contains irregularities or relief elements such as reinforcing ribs and / or desiccant packaging, as described above. Gaskets 730 prevent contact of irregularities or a relief element with the mechanical layer 724 of the matrix, either directly (e.g., contact of the relief element with the gasket) or indirectly (e.g., some other part of the backplane contacts the gasket, preventing contact of the relief element with the mechanical layer 724). In some of these embodiments, the surface of the gasket 720 closest to the matrix 720 is substantially smooth. In some embodiments, the spacers 730 distribute the applied force, thereby reducing the likelihood that this force will damage any particular interferometric modulator 722. For example, in some embodiments, the spacer 730 distributes the applied force to the interferometric modulator posts 726, thereby protecting the mechanical layer 724. In some embodiments, the gasket 730 reduces or prevents damage resulting from relative lateral or tangential movement matrix 720 and backplate 750, for example, by sliding and / or rolling. For example, in some of these embodiments, the gasket 730 comprises one or more low friction surfaces. In some embodiments, the spacer has a circular cross section, for example, a sphere or a rod. As discussed in more detail below, in some embodiments, the spacer or spacers 730 are resilient, thereby absorbing and / or distributing the applied force. Moreover, even if the force was such that it would damage a plurality of interferometric modulators 722 in the matrix 720, in some embodiments, the damage distributed across the matrix 720 is less noticeable to the user than the damage concentrated in a specific area of the matrix 720. B in other embodiments, spacer 730 is designed to concentrate damage on a small number of interferometric modulators, for example, by using one or more punctures ca. 730 of a particular size and / or shape. For example, in some embodiments, the matrix 720 contains redundant pixels, so that disabling a particular pixel is invisible to the end user. Accordingly, in these embodiments, the spacer 730 concentrates damage on a single pixel rather than on a group of nearby pixels that would be visible to the end user.

11A is a plan view of an apparatus 1100 showing the relative placement of gaskets and matrix. As discussed above, in some embodiments, the gaskets are in contact with the matrix, in other embodiments, the gaskets are in contact with the back plate, and in other embodiments, the gaskets are in contact with both the matrix and the back plate. Apparatus 1100 comprises a plurality of spacers 1130 arranged in a substantially ordered manner on top of an interferometric modulator matrix 1120 formed on a substrate 1110. In the illustrated embodiment, spacers 1130 are arranged substantially above the interferometric modulator columns 1126. As shown in FIG. 11A, in which the bars 1126 are shown by the dashed line as invisible, in the shown embodiment, the gasket 1130 is not placed above each column 1126. In some embodiments, the gaskets 1130 are placed over the matrix 1120. In some embodiments, the gaskets 1130 are placed in space 110 between the matrix 1120 and the seal 1140. In some embodiments, the gaskets 1130 are placed both over the matrix 1120 and in the space 1110 between the matrix 1120 and the seal 1140. Those skilled in the art should have onyatno that other placement and / or placement of spacers 1130 drawings.

11B shows a top view of another embodiment of a device 1100 in which the spacers 1130 are arranged substantially randomly on top of the matrix 1120. In the embodiment of the device 1100 shown in FIG. 11C, the spacers 1130 are provided near the center of the matrix 1120, but not near the periphery. An embodiment of the device 1100 shown in FIG. 11D comprises a denser arrangement of spacers 1130 near the center of the matrix 1120 and a rarer arrangement near the periphery. An embodiment of the device 1100 shown in FIG. 11E comprises three concentric zones of gaskets 1130 with increasing density toward the center of the matrix 1120. Those skilled in the art will appreciate that other arrangements are possible.

Gaskets have any suitable size and shape and are made of any suitable material. In some embodiments, all gaskets are of the same type. Other embodiments include gaskets of various types, for example, various sizes, shapes and / or from different materials. The specific linear dimensions for some gasket will depend on factors known in the art, including the material from which the gasket is made, the free space between the matrix and the backplate, the intended use of the display in the housing, and the like. In some embodiments, the thickness of the gasket is similar to the free space between the matrix and the backplate. In other embodiments, the thickness of the gasket is less than the free space between the matrix and the backplate. The linear dimensions of free space are discussed above.

Suitable gasket materials include rigid materials and / or elastomeric materials. In some embodiments, the gaskets comprise a material capable of absorbing at least a portion of the force exerted thereon, for example, by deformation. In some embodiments, the spacer is resilient and substantially reverts to its original shape after the deforming force is removed. In other embodiments, the gasket is permanently deformed upon absorption of the force applied thereto. Examples of suitable materials include metals, steel, stainless steel, brass, titanium, magnesium, aluminum, polymer resins, epoxies, polyamides, polyalkenes, polyfluoroalkenes, polyesters, polysulfones, polystyrene, polyurethanes, polyacrylates, ceramics, glass, silicon dioxide (quartz), alumina, and also mixtures thereof, copolymers, alloys and / or composites. In some embodiments, the spacer is a composite, for example, comprising a core of one material and a coating of another. In some embodiments, the gasket comprises a core of rigid material, such as metal, and a coating of elastomeric material, such as polymer resin. In some embodiments, in which the image is visible through the backplane, the spacers are transparent or translucent. In some embodiments, the gaskets are electrically conductive.

In some embodiments, the gaskets comprise a desiccant of any type known in the art, for example, metal oxides, calcium oxide, barium oxide, boric acid anhydride, phosphorus pentoxide, metal sulfates, calcium sulfate, magnesium sulfate, sodium sulfate, metals, sodium, alloy lead / sodium, metal hydrides, sodium borohydride, sodium hydride, lithium aluminum hydride, silica gel, activated alumina, zeolites, molecular sieves, phosphorus, metal salts, magnesium perchlorate, zinc chloride, carbon nanotubes and as well as combinations thereof. In some embodiments, the pad substantially comprises a desiccant. In other embodiments, the pad comprises a composite in which the desiccant is a component. In some embodiments, the desiccant is distributed throughout the composite. In other embodiments, the desiccant is concentrated in one part of the pad, for example, in the core. The other component or components in this composite are any suitable material, for example materials disclosed above as being suitable for laying. In some embodiments, for example in embodiments in which the pad comprises a desiccant core, another material, for example a coating over the desiccant, is a material that is permeable to water and / or water vapor, thereby facilitating the absorption of water by the desiccant. In some embodiments, the coating comprises one or more holes, for example, made by abrading the coating or during the gasket manufacturing process, to allow contact between the desiccant in the core and the surrounding atmosphere.

Gaskets are made using methods known in the art that will depend on factors known in the art, including the material or materials from which the gaskets are made, the size and shape of the gaskets, tolerances for the size of the gaskets. In some embodiments, the pads are applied in the form of a fluid, such as a liquid, gel and / or paste, which are then cured to form pads. Examples of suitable fluid materials include, for example, adhesives and photoresists. Specialists in this field should be clear that the curing conditions depend on the specific material and include thermal curing, light curing, curing by UV radiation and / or radiation curing.

In other embodiments, the pads are made in advance. Embodiments of prefabricated gaskets are shown in FIG. 12E-FIG. 12T. Specialists in this field should be clear that the forms shown are illustrative and that other forms are possible. For example, in some embodiments, the gaskets are irregular in shape. In some embodiments, the gaskets are substantially continuous. In other embodiments, the gaskets comprise one or more voids. For example, in some embodiments, the gasket comprises one or more hollow regions. In some embodiments, the spacer comprises a plurality of voids, such as open cell or closed cell foam. Spherical and rod-shaped gaskets shown in Fig. 12D and Fig. 12I, respectively, are commercially available in glass, quartz and / or polystyrene. For example, rod-shaped glass pads are commercially available from Nippon Electric Glass Co. (Otsu, Shiga, Japan) in diameters from about 1.5 microns to about 60 microns. Plastic spherical gaskets are commercially available, for example, from Sekisui Chemical Co. (Osaka, Japan) in diameters from about 5 microns to about 350 microns. In some embodiments, such gaskets are used for reasons of affordability, uniformity and / or value. Other shapes, such as squares and circles, are also easily manufactured and used in other embodiments.

In some embodiments, the gasket comprises one or more protrusions and / or recesses, for example, as shown in FIG. 12N-FIG. 12T. In some embodiments, the protrusions and / or recesses capture a structure or a relief element on the matrix and / or backplane, as discussed in more detail below. In some embodiments, the protrusions and / or recesses are designed to absorb at least some of the force exerted on the device. For example, some embodiments include springs, as shown in FIG. 12P-FIG. 12S. Some embodiments include protrusions, as shown in FIG. 12N, FIG. 12O, and FIG. 12T, which are discussed in more detail below. The embodiment shown in FIG. 12T includes both protrusions 1232 and recesses 1234.

In the embodiment shown in a plan view in FIG. 13A, the spacer 1330 extends over at least two columns 1326 of the interferometric modulator array 1320. In the shown embodiment, the shortest diameter D of the gasket 1330 is equal to at least about two distances d between the columns 1326, and this ensures that the gasket always extends to at least two columns 1326. In some embodiments, the distance d is from about 30 microns to about 80 microns, for example, about 30 microns, 40 microns, 50 microns, 60 microns or 80 microns. In other embodiments, the distance d is large, for example, up to 1 mm or up to 5 mm. As discussed above, in some embodiments, the matrix 1320 contains interferometric modulators 1322 with different linear dimensions, for example, widths, and therefore, the distance between the columns 1326 for adjacent interferometric modulators 1322 is not uniform. Therefore, in some embodiments, the linear dimension D is equal to at least the largest distance between the outer posts 1326 of adjacent interferometric modulators 1322. One embodiment of such an arrangement is shown in FIG. 13B, in which the posts 1326 'have a different design than the posts, shown in Fig. 13A, and the gaskets 1330 'are disk-shaped.

In the embodiment shown in FIG. 14, the spacer 1430 is at least as large as the interferometric modulator 1422 and therefore is placed at least on top of one column 1426. In the shown embodiment, the spacer 1430 is perforated square. The sizes of interferometric modulators are discussed above.

In the embodiment shown in FIG. 15A, each spacer 1530 is essentially centered on top of the column 1526. In the embodiment shown in FIG. 15B, at least a portion of each gasket 1530 is located on top of the column 1526. In the embodiments shown in FIG. 15C, no portion of each gasket 1530 is located above any column 1526. Other embodiments not shown are any combination of these arrangements.

An embodiment of the device 1600 shown in FIG. 16 comprises gaskets 1630 of various sizes placed substantially over the entire matrix 1620.

Some embodiments comprise one or more integral gaskets, either used alone or in combination with other gaskets disclosed herein. FIG. 17A shows an embodiment of a device 1700 that includes a spacer 1730 in the form of a grid placed above the central portion of the matrix 1720. FIG. 17B shows an embodiment of a device 1700 that contains a spacer 1730 that is denser near the center than near the peripheral portion . FIG. 17C shows an embodiment of a device 1700 in which the gasket 1730 is roughly an open rectangle substantially centered on top of the matrix 1720. FIG. 17D shows an embodiment of the device 1700 in which the gasket 1730 is substantially defined by the diagonals of the matrix 1720 In some embodiments, the pad is thicker in one or more regions and thinner in one or more regions. For example, in some embodiments, the pad is thicker in the central region and thinner on the periphery. In some embodiments, the pad 1730 comprises a desiccant, as discussed above. For example, in some embodiments, the gasket 1730 comprises a desiccant core surrounded by an outer layer, for example, a polymer resin. In other embodiments, a desiccant is incorporated into the liner material.

The embodiment 1800 shown in FIG. 18A includes a spacer 1830 in the form of a film placed between the matrix 1820 and the backplate 1850. In the shown embodiment, the spacer 1830 extends beyond the matrix 1820. In other embodiments, the spacer 1830 does not extend beyond the matrix 1820 In some embodiments, the spacer 1830 has substantially the same extent with the matrix 1820. In other embodiments, the spacer 1830 does not cover the entire matrix 1820.

In some embodiments, the film is a substantially flat film. In some embodiments, the film has a thickness of from about 5 microns to about 50 microns, for example, from about 10 microns to about 20 microns. In other embodiments, the film is thicker. In some embodiments, the film is thick enough to substantially fill the space between the matrix and the backing plate. In some embodiments, the film comprises an elastic material, such as foam. In some embodiments, the foam has a coating, for example an impermeable polymer, which in some embodiments contains perforated holes. In other embodiments, the film has a different shape. Fig. 18B shows a gasket 1830 'in the form of a film with a non-planar cross section, for example, wavy or in the form of a "container with egg cells", which when compressed absorbs at least some of the deforming force between the matrix 1820' and the backplate 1850 '. Specialists in this field should be clear that the non-planar film is thicker than the corresponding flat film. In some embodiments, the film pad comprises regions with varying properties, such as thickness, composition (e.g., composites), protrusions, recesses, and the like. In other embodiments, one or both of the faces of the film further comprises additional spacers, as described above, for example, the spacers shown in FIGS. 12A-12T. In some embodiments, the film and gaskets are formed as a single unit (at the same time). In other embodiments, the spacers and film are manufactured separately and combined in a separate step. In some embodiments, the film is perforated. For example, some of the gasket embodiments shown in FIG. 17A and FIG. 17B are perforated films. Fig. 18C shows an embodiment in which the gasket 1830 "is a sealed bag containing a certain amount of gas and placed between the matrix 1820" and the backplate 1850 ". Those skilled in the art will understand that a particular film selected for application, it will depend on factors including the thickness of this film, its mechanical properties, its shape and configuration, the free space between the matrix and the backplane, and the expected use of the display in such a case.

In some embodiments, the film comprises a desiccant. In some embodiments, the film is a desiccant. In other embodiments, a film, for example a polymer resin film, is impregnated with a desiccant. In still other embodiments, the film comprises a thin layer of desiccant that is encapsulated, for example, using a polymer resin.

Some embodiments comprise a flat film pad in contact with the matrix or part thereof to distribute forces over a larger area. In some embodiments, one or more other spacers, as disclosed herein, is placed between the film and the backing plate and / or between the film and the matrix, for example, any of the spacers described above.

FIG. 19 shows an embodiment 1900 comprising a plurality of film spacers 1930 disposed between the die 1920 and the back plate 1950. The film spacers are as described above. Some embodiments comprise a combination of a flat film pad and a non-flat film pad, for example, with a flat film pad in contact with the die 1920, as described above. Some embodiments include at least two non-planar film gaskets arranged so that the gaskets do not fit into each other, for example, a pair of wavy films placed with corrugations at right angles. Some embodiments include at least two non-planar film gaskets with a flat film gasket placed between them, thereby preventing non-planar gaskets from being inserted into each other.

In some embodiments, the gasket, or some portion thereof, is shaped to provide a differentiated response to the applied force, for example, the gasket or part thereof with a triangular cross section. An example of a gasket portion is shown in FIG. 12T as a protrusion 1232. A triangular gasket portion is shown in FIG. 20A. The triangular portion is relatively susceptible to small deformations, as shown in FIG. 20B, but is becoming increasingly difficult to deform, as shown in FIG. 20C and FIG. 20D. 20E shows another embodiment in which the gasket 2032 has two regions, each of which has a different response to the applied force: a thinner upper portion 2032a and a thicker lower portion 2034b. In the embodiment shown in FIG. 20F, the gasket 2030 ′ also has two reaction regions: an upper region 2032 ′ that has a relatively larger pore volume, and a lower region 2034 ′ that has a relatively smaller pore volume. In some embodiments, the gasket comprises a composite that provides a differentiated reaction.

In some embodiments, one or more shims are attached to the matrix. In other embodiments, one or more shims are attached to the backplate. In other embodiments, one or more spacers are attached to both the matrix and the backplane. In other embodiments, the first plurality of one or more spacers is attached to the matrix, and the second plurality of one or more spacers is attached to the backplane. In other embodiments, one or more spacers are not attached to either the matrix or the backplane. In embodiments in which the gasket is attached to the matrix and / or backplane, this gasket is attached using any method known in the art, for example using glue, mechanically and / or by welding.

In embodiments using glue, one or more adhesives is applied to the matrix and / or backplane using any method known in the art, for example, lithography, inkjet printing, contact printing and the like. Then a gasket or gaskets are applied to this adhesive. In some embodiments, the adhesive is applied to a gasket, which is then applied to the matrix and / or backplane, for example, by spraying, rolling, individual application, and the like. In other embodiments, the spacers are suspended in a liquid containing glue. A pad suspension is applied to the matrix, and the liquid is removed, for example, by evaporation. Examples of suitable liquids include lower alcohols, for example, methanol, ethanol and isopropanol, as well as other volatile liquids, for example, acetone, methyl t-butyl ether and ethyl acetate. As discussed above, in some embodiments, the spacers are applied to the film, which is then applied to the matrix and / or backplane. In some embodiments, the spacer is integral with the matrix or backplane, as described in more detail below. The gaskets are attached to the backplane using essentially the same methods.

In some embodiments, one or more of the spacers is not attached to the matrix or backplane. For example, in some embodiments using large spacers, such as the grid spacers shown in FIG. 17A and FIG. 17B, the spacers shown in FIG. 17C and FIG. 17D, and / or the film spacers shown in FIG. 18A-FIG. 18C and FIG. 19, gaskets are simply placed on the matrix and / or backplane when assembling the device mounted in the housing.

In those embodiments in which the gaskets are smaller, for example, with sizes ranging from micrometers to hundreds of micrometers, the gaskets are easily placed by dispersing them in a fluid carrier and applying these dispersed gaskets to the matrix and / or backplane, for example, by spraying and / or coating by centrifugation. In some embodiments, the fluid carrier is a liquid that is easily removed, for example, in vacuum and / or by heating. Examples of suitable liquids are known in the art and include lower alcohols (e.g., methanol, ethanol, isopropanol), hydrocarbons (e.g., propane, butane, pentane), halogenated (halogen-substituted) compounds (e.g., fluorocarbons, chlorofluorocarbons, hydrochlorofluorocarbons, chlorocarbons , hydrochlorocarbons), ethers (e.g. methyl tert-butyl ether, diethyl ether, tetrahydrofuran), esters (e.g. ethyl acetate), ketones (e.g. acetone), and combinations thereof. In other embodiments, the fluid is a gas, for example, air or nitrogen. In some embodiments, the pads tend to remain in place after the solvent has been removed, even in the absence of added glue.

In some embodiments, the pads are applied essentially only over the matrix, for example, by masking (i.e. masking) the area on which the seal is formed during the application of the pads. In other embodiments, the spacers are applied over the matrix, as well as other parts of the device, for example over the area on which the seal is formed. In some of these embodiments, the gaskets also determine the thickness of the seal, thereby ensuring a uniform thickness of the seal. For example, inserting 20 microns spacers into the seal and contacting the substrate and the backplate with these spacers provide a thickness of 20 microns.

As shown in FIG. 21A, in some embodiments, one or more gaskets 2130 extends between the matrix 2120 and the backplane 2150. In the embodiment shown in FIG. 21B, the gasket 2130 'is in contact with the matrix 2120' but not in contact with the backplane 2150 '. In the embodiment shown in FIG. 21C, the gasket 2130 "is in contact with the backplane 2150" but not in contact with the matrix 2120 ". Some embodiments include a combination of these configurations.

The embodiment shown in FIG. 22A is similar to the device shown in FIG. 6C. In an embodiment 2200, spacers 2230 are integrally formed with an interferometric modulator array 2220. In the illustrated embodiment, spacers 2230 are formed on top of columns 2226 of interferometric modulators 2222. In some embodiments, the process of forming spacers 2230 is a thin-film process and combined with the process of forming interferometric modulators 2222, for example, as disclosed above and in US Pat. No. 5,835,255. In some embodiments, the gasket material is deposited on the mechanical layer 2224 before removing the “consumable” (removed) material (not shown) during the production of interferometric modulators 2222. The gaskets 2230 are applied with a pattern and etched from the gasket material using methods known in the art . Those skilled in the art will appreciate that the particular method will depend on factors including the particular gasket material used, other materials used in the manufacture of interferometric modulators 2222, the geometry of interferometric modulators 2222, and the like.

In some embodiments, the formation of gaskets 2230 is combined with the process flow of a process for forming interferometric modulators, for example, the process disclosed in US Pat. No. 5,835,255. For example, a layer (not shown) of gasket material is deposited on a mechanical layer 2224 before removing the material to be removed (not shown) occupying the cavity between the mirrors. The gasket layer is then etched to form individual gaskets 2230. In some embodiments, the gasket layer is applied with a pattern and etched so that a passage is formed that provides gas communication with each cavity in the matrix 2220 of interferometric modulators. Then, by removing the material to be removed through this passage, a cavity is formed.

In some embodiments, the integral gaskets are made from a solid material with good shape maintenance that is not easy to compress. In some embodiments, this material is selected from the group consisting of metals, oxides, nitrides, photoresists, other organic materials, applied by centrifugation of glass, and combinations thereof. In some embodiments, the gaskets are electrically conductive. Specialists in this field should be clear that similar processes are applicable in the manufacture of solid gaskets on the inner surface of the backplane.

As shown in FIG. 22B, in some embodiments, the array 2220 'comprises interferometric modulators 2222' of varying heights. In the shown embodiment, the first gaskets 2230 'compensate for height differences, thereby providing a uniform platform supporting the second gaskets 2260' of any type disclosed above. In some embodiments, second spacers 2260 'are attached to the first spacers. In other embodiments, the second gaskets 2260 'are not attached to the first gaskets. In the embodiment shown in FIG. 22C, the second gasket 2260 "comprises recesses 2234" that grip the first gaskets 2230 ".

FIG. 23 is a flowchart showing a manufacturing method of a body-mounted electronic device with reference to the structure shown in FIG. 7A and FIG. 7B. At step 2310, a substrate 710 is formed on which an interferometric modulator 722 has been formed. In some embodiments, the interferometric modulator 722 is part of the matrix 720 of interferometric modulators 722. At step 2220, a backplane 750 is obtained. At step 2230, an interferometric modulator 722 and a backplane 750 are placed one or more gaskets 730. At step 2240, a seal 740 is formed between the substrate 710 and the backplate 750.

In some embodiments, the product of such a manufacturing process is a panel comprising a plurality of mounted displays. Then, individual displays mounted in the housing are cut from this panel. In the manufacturing process, many interferometric modulator matrices are formed on a single substrate (“mother glass”), as discussed above. A sheet is obtained containing a plurality of back plates (usually equal in number to the matrices of interferometric modulators) having such dimensions and so arranged in space to coincide with the interferometric matrices. Between the substrate and the backing plate, spacers are placed as discussed above. Seals are formed between each matrix and the backplane, as discussed above, thereby forming a panel containing a plurality of matrices of interferometric modulators. Individual displays mounted in the housing are cut from this panel using any method known in the art, for example, by scribing.

Fig. 24 is a flowchart showing a method of protecting an electronic device with reference to the structure shown in Fig. 7A and Fig. 7B. At 2410, an apparatus is obtained comprising an interferometric modulator 722 formed on a substrate 710 and a backplane 750. At 2420, one or more spacers are placed between the interferometric modulator 722 and the backplane 750.

EXAMPLE 1

Six matrices of interferometric modulators with dimensions of 250 mm × 300 mm are made on a glass substrate with dimensions of 680 mm × 880 mm. The glass sheet of six recessed covers is cleaned and dried, 7 mm thick, 252 mm × 302 mm, recess 0.3 mm. A thin film with a CaO desiccant (Hi Cap 2800, Cookson, London, UK) is applied to the recesses, completely cured and prepared. A suspension of gaskets in the form of rods of polystyrene with a diameter of 10 μm (Sekisui Chemical Co., Osaka, Japan) in isopropanol with a concentration of 1% by volume is uniformly sprayed over the backing plate to provide a 2% coverage of the surface gaskets. The seal areas between the recesses are not masked. Isopropanol is removed by heating at 100 ° C for 5 seconds. A recessed UV curable epoxy resin layer (H5516, Nagase, Tokyo, Japan) is applied to the periphery of the backing plates in the form of recessed covers, and the sheet is aligned over the substrate. Pressure is applied to the sheet so as to provide an epoxy layer with an average thickness of 15 μm. The epoxy resin is cured by irradiation with a power of 6000 mJ / cm ² at a wavelength of 350 nm (approximately 2 minutes), then calcined at 80 ° C for 30 minutes. Six cases with interferometric modulators are cut from the resulting panel.

25A and 25B are system block diagrams showing one embodiment of a display device 2040. The display device 2040 may be, for example, a cell or mobile phone. However, the same details of the display device 2040, or minor changes thereof, also illustrate various types of display devices, such as televisions and portable media players.

A display device 2040 includes a housing 2041, a display 2030, an antenna 2043, a speaker 2045, an input device 2048, and a microphone 2046. The housing 2041 is typically formed using any of a variety of manufacturing processes that are well known to those skilled in the art, including injection molding and vacuum molding. In addition to this, the housing 2041 may be made of any of a variety of materials, including, but not limited to, plastic, metal, glass, rubber and ceramics, or any combination thereof. In one embodiment, the housing 2041 includes removable parts (not shown) that can be replaced with other removable parts of a different color, or containing various logos (brand names), images or symbols.

The display 2030 of an exemplary display device 2040 may be any of a wide variety of displays, including a bistable display (i.e., a display with two stable states), which is described herein. In other embodiments, the display 2030 includes a flat screen display such as a plasma, electroluminescent (EL), organic light emitting diode (OLED), nematic strongly twisted liquid crystal (STN LCD) or thin film transistor (TFT LCD) LCD as described above, or a display with a non-flat screen, such as a cathode ray tube (CRT or CRT) or other electrovacuum device, as is well known to specialists in this field. However, for the purpose of describing the present embodiment, the display 2030 includes an interferometric modulator-based display, which is described herein.

The components of an exemplary display device 2040 according to one embodiment are shown schematically in FIG. 25B. The illustrated exemplary display device 2040 includes a housing 2041 and may include additional components at least partially enclosed therein. For example, in one embodiment, the illustrative display device 2040 includes a network interface 2027 that includes an antenna 2043 that is coupled to a transceiver 2047. A transceiver 2047 is connected to a processor 2021 that is coupled to a signal conditioning instrument 2052. This pre-signal conditioning hardware 2052 may be configured to pre-generate the signal (e.g., filter some signal). Pre-signal conditioning hardware 2052 is connected to a speaker 2045 and a microphone 2046. A processor 2021 is also connected to an input device 2048 and an excitation controller 2029. The drive controller 2029 is connected to a frame buffer 2028 and to a matrix drive circuit 2022, which in turn is connected to the display matrix 2030. A power supply 2050 provides power to all components as required by the construction of a particular illustrative display device 2040.

The network interface 2027 includes an antenna 2043 and a transceiver 2047, so that an exemplary display device 2040 can communicate with one or more devices via a network. In one embodiment, the network interface 2027 may also have some processing functionality in order to make the requirements for processor 2021 less stringent. Antenna 2043 is any antenna known to those skilled in the art for transmitting and receiving signals. In one embodiment, the antenna transmits and receives RF signals according to the IEEE 802.11 standard, including IEEE 802.11 (a), (b) or (g). In another embodiment, the antenna transmits and receives RF signals according to the BLUETOOTH standard. In the case of a cell phone, the antenna is designed to receive signals in accordance with code division multiple access (CDMA), global cellular digital radio communication (GSM), advanced mobile telephone (AMPS), or other known signals that are used for communication within a wireless cellular telephone network. The transceiver 2047 pre-processes the signals received from the antenna 2043 so that they can be received and further processed by the processor 2021. The transceiver 2047 also processes the signals received from the processor 2021 so that they can be transmitted from the exemplary device 2040 with a display through the antenna 2043.

In an alternative embodiment, transceiver 2047 may be replaced by a receiver. In yet another alternative embodiment, the network interface 2027 may be replaced by an image source that can store or generate image data for sending to the processor 2021. For example, the image source may be a digital video disc (DVD) or a hard disk drive that contains image data, or a software module that generates image data.

The processor 2021 generally controls the entire operation of the exemplary display device 2040. The processor 2021 receives data, such as compressed image data, from a network interface 2027 or an image source, and processes this data into the original image data or into some format that is easily processed into the original image data. Processor 2021 then sends the processed data to drive controller 2029 or frame buffer 2028 for storage. The source data is usually called information that identifies the characteristics of the image at each place (point) within the image. For example, such image characteristics may include color, saturation, and gray level.

In one embodiment, the processor 2021 includes a microcontroller, a central processing unit (CPU) or logic device to control the operation of an exemplary display device 2040. Pre-signal conditioning hardware 2052 typically includes amplifiers and filters for transmitting signals to speaker 2045 and for receiving signals from microphone 2046. Pre-signal conditioning hardware 2052 can be discrete components within an exemplary display device 2040 or can be integrated into processor 2021 or other components.

The excitation controller 2029 takes the original image data generated by the processor 2021, either directly from the processor 2021 or from the frame buffer 2028, and reformatts the original image data in an appropriate manner for high-speed transmission to the matrix excitation circuit 2022. In particular, the drive controller 2029 reformatts the original image data into a data stream having a raster-like format so that it has a time order suitable for scanning on the display matrix 2030. Then, the drive controller 2029 sends the formatted information to the matrix drive circuit 2022. Although an excitation controller 2029, such as an LCD controller, is often associated with the system processor 2021 as a stand-alone integrated circuit (IC), such controllers can be implemented in many ways. They can be embedded in the processor 2021 in the form of hardware, embedded in the processor 2021 in the form of software, or fully integrated in hardware with the matrix drive circuit 2022.

Typically, the matrix drive circuit 2022 receives formatted information from the drive controller 2029 and reformatts this video data into a parallel set of signals that are applied many hundreds of seconds to hundreds, and sometimes thousands of conductors coming from the x-y coordinates of the display pixel matrix.

In one embodiment, the drive controller 2029, the matrix drive circuit 2022, and the display matrix 2030 are suitable for any of the types of displays described herein. For example, in one embodiment, the drive controller 2029 is a standard display controller or a bistable display controller (e.g., an interferometric modulator controller). In another embodiment, the matrix drive circuit 2022 is a standard circuit or drive circuit for a bistable display (e.g., an interferometric modulator display). In one embodiment, the drive controller 2029 is integrated with the matrix drive circuit 2022. Such an embodiment is common in highly integrated systems such as cell phones, watches and other small area displays. In yet another embodiment, the display matrix 2030 is a conventional display matrix or a bistable display matrix (eg, a display including an interferometric modulator matrix).

An input device 2048 allows a user to control the operation of an exemplary display device 2040. In one embodiment, the input device 2048 includes a keyboard, such as a QWERTY keyboard or telephone keypad, button, switch, touch (i.e., touch-sensitive) screen, pressure or heat sensitive membrane. In one embodiment, the microphone 2046 is an input device for an exemplary display device 2040. When the microphone 2046 is used to enter data into the device, voice (speech) commands may be issued by the user to control the operations of the exemplary device 2040 with a display.

Power supply 2050 may include many different energy storage devices that are well known in the art. For example, in one embodiment, the power source 2050 is a rechargeable (rechargeable) battery, such as a nickel-cadmium battery or a lithium-ion battery. In another embodiment, the power source 2050 is a renewable energy source, a capacitor, or a solar cell, including a plastic solar cell and a paint with the function of a solar cell. In another embodiment, the power source 2050 is configured to receive energy from a wall outlet.

In some embodiments, the control programmability functionality is constantly located, as described above, in the drive controller, which may be located at several places in the electronic display system. In some cases, the control programmability functionality is constantly located in the matrix drive circuit 2022. Specialists in this field should be clear that the above optimization can be implemented in any number of hardware and / or software components and in various configurations.

The embodiments shown and described above are provided by way of example only. Various changes and modifications of the embodiments presented herein can be made by those skilled in the art without departing from the spirit and scope of the present invention.

Claims (39)

1. A display device comprising: a matrix of interferometric modulators formed on a substrate; back plate; a seal disposed between the substrate and the back plate, the substrate and the back plate being sealed together to mount the matrix of interferometric modulators in the housing; and one or more gaskets disposed between the matrix and the back plate, wherein said one or more gaskets protect the back plate from contact with the matrix, and wherein said one or more gaskets do not come into contact with one of the back plate or matrix. 2. The display device according to claim 1, in which the substrate is at least partially transparent and / or translucent, and interferometric modulators are configured to reflect light through the transparent and / or translucent part of the substrate. 3. The display device according to claim 1, in which the back plate contains a recessed cover. 4. The display device according to claim 1, in which the back plate comprises a glass back plate. 5. The display device according to claim 1, in which the back plate contains a desiccant. 6. The display device according to claim 1, in which the seal contains a tight seal. 7. The display device according to claim 1, in which the seal comprises a desiccant. 8. The display device according to claim 1, wherein said one or more gaskets comprise a desiccant. 9. The display device according to claim 1, wherein said one or more gaskets are arranged in an orderly manner. 10. The display device according to claim 1, wherein said one or more gaskets are randomly arranged. 11. The display device according to claim 1, additionally containing:
a processor that is in electrical communication with said interferometric modulators, said processor being configured to process image data; and a storage device in electrical communication with said processor. 12. The display device according to claim 11, further comprising an excitation circuit configured to send at least one signal to said interferometric modulators. 13. The display device according to item 12, further comprising a controller configured to send at least a portion of said image data to said drive circuit. 14. The display device according to claim 11, further comprising an image source module configured to send said image data to said processor. 15. The display device of claim 14, wherein said image source module comprises at least one of a receiver, a transceiver, and a transmitter. 16. The display device according to claim 11, further comprising an input device configured to receive input data and transmit said input data to said processor. 17. A method of manufacturing a display device, including: providing a matrix of interferometric modulators on a substrate; placing one or more gaskets between the matrix and the back plate and sealing the back plate on the substrate to form a display device, wherein said one or more gaskets protect the back plate from contact with the matrix, while the one or more gaskets do not come into contact with one of the back plate or matrices. 18. The method according to 17, in which said substrate is at least partially transparent and / or translucent, and interferometric modulators are configured to reflect light through the transparent and / or translucent part of the substrate. 19. The method according to 17, in which the back plate contains a recessed cover. 20. The method of claim 17, wherein the back plate comprises a glass back plate. 21. The method according to 17, in which the back plate contains a desiccant. 22. The method according to 17, in which the seal of the back plate to the substrate forms a tight seal. 23. The method according to 17, in which at least one of the gaskets contains a desiccant. 24. The method of claim 17, wherein said one or more gaskets comprise a plurality of ordered gaskets. 25. The method of claim 17, wherein said one or more gaskets comprise a plurality of randomly spaced gaskets. 26. The display device manufactured by the method according to 17. 27. A display device comprising: a transmission means for transmitting light through it; modulating means for modulating light passing through said transmitting means; coating means for coating said modulating means; sealing means arranged between the transmission means and the coating means to form a housing; and spacer means for preventing the modulating means and the coating means from contacting each other inside the display device, while the spacing means does not come into contact with one of the modulating means or covering means. 28. The display device of claim 27, wherein said transmitting means comprises a transparent substrate. 29. The display device according to item 27, in which the said modulating means contains a matrix of interferometric modulators. 30. The display device according to item 27, in which said coating means comprises a back plate. 31. The display device according to item 27, in which the said sealing means contains an adhesive seal. 32. The display device according to item 27, in which the said spacer means contains a gasket made on the aforementioned transmission means or said coating agent. 33. The display device according to item 27, in which the covering means comprises a recessed cover. 34. The display device according to item 27, in which the coating means contains a desiccant. 35. The display device according to item 27, in which the spacer means contains many evenly spaced gaskets. 36. The display device according to item 27, in which the spacer means contains many randomly spaced gaskets. 37. The display device according to claim 1, in which said one or more gaskets contain at least one gasket configured to provide a differentiated response to the applied force. 38. The display device according to 17, in which the aforementioned one or more gaskets contain at least one gasket configured to provide a differentiated response to the applied force. 39. The display device according to item 27, in which the spacer means is configured to provide a differentiated response to the applied force.

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