RU2370040C1 - Production method of soft wafer products - Google Patents

Abstract

FIELD: food industry.

SUBSTANCE: invention relates to food industry namely to confectionary industry and wafer products production method. According to the method, dough for wafer sheets is made. Melange and sugar are beaten up during 15 minutes. After that mixture of garbanzo and buckwheat in ratio 1:3-3:1, starch are added. The mixture is beaten up 2-3 more minutes till homogeneous mass is made. Heart-shaped sheets 4 mm thick are made, baked and cooled down. Simultaneously filing is prepared. Pumpkin puree, apple pectin and sugar are used for it. First pectin and part of sugar are taken in ratio 1:1. After that pumpkin puree is added with continious mixing to prevent flocculation. Mixture is maturated for 1-2 hours for pectin swelling. After mentioned time is up the rest of the sugar is added into swollen pumpkin-pectin mixture. Mixture is warmed up to 90°C. After that molasses warmed up to 60°C is added and mixture is boiled till 106-108°C, cooled down till 80°C and citric acid is added. Filler is put on at 50°C on a single sheet. After that wafer sheet with filler is covered with the second wafer sheet and pressed by a single try on the top. Wafer product is cooled down at 8-10°C during 1 hour and ready-made products are packed. Ratio of wafer sheets and filler makes 3:2.

EFFECT: quality, food and biological value of product is increased, range of pastry products of increased quality is extended.

1 tbl, 3 ex

Description

The invention relates to the food industry, namely the production of flour confectionery.

The closest in technical essence and the achieved effect is a confectionery product [RF Patent No. 2294104, IPC ⁷ A21D 13/08, - op. 02/27/2007. Bull. No. 6], which is a body glazed with chocolate icing, consisting of a set of wafer sheets and filling layers made between whipped candy masses located between the sheets, characterized in that the set further comprises filling layers made of fruit and berry filler containing pectin, located between the wafer sheets, the layers of the filling of the whipped candy mass and the layers of the filling of the fruit and berry filler containing pectin are arranged in alternating order, and each of the wafers GOVERNMENTAL impregnated sheet formed adjacent to eliminate the stuffing crunchy properties.

The disadvantage of the confectionery product is the multicomponent composition containing two different fillings and a traditional wafer sheet with a moisture content of 1.5-3%, as well as the complication of the product preparation technology by spreading the filling on the wafer sheet during the formation of wafer layers and cutting the filling layers.

The technical task of the invention is to improve the quality, nutritional and biological value of the product, expanding the range of flour confectionery products of improved composition.

To solve the technical problem of the invention, a method for producing soft waffle products is proposed, characterized in that dough for wafer sheets is prepared, for which they knock down melange and sugar for 15 minutes, then add a mixture of chickpea and buckwheat flour in a ratio of 1: 3-3: 1, starch and continue to churn for another 2-3 minutes until a uniform consistency of the dough is formed, then form heart-shaped sheets 4 mm thick, bake and cool, at the same time prepare the filling, for the preparation of which pumpkin puree, apple pectin and Ahar, first mix the pectin and part of the sugar, taken in a 1: 1 ratio, then add the pumpkin puree with continuous stirring to prevent the formation of lumps, leave the mixture for 1-2 hours to swell the pectin, after which time, add to the swollen pumpkin-pectin mixture the remaining sugar, with stirring, heat the mixture to 90 ° C, then make molasses heated to 60 ° C and boil to a temperature of 106-108 ° C, cool to 80 ° C and add citric acid, spread the filling by applying hot fillings so that at a temperature of 50 ° C on one wafer sheet, then cover the wafer layer with the filling of the second wafer sheet and press them by pressing once on the product obtained, cool the wafer product at a temperature of 8-10 ° C for 1 h and pack the finished products, the ratio of wafer sheets and fillings 3: 2, soft wafer products are prepared the next time the ratio of components is selected, wt.%:

wafer sheets:

chickpea flour 3.41-10.24 buckwheat flour 3.41-10.24 starch 3.60-3.64 melange 30.28-31.92 granulated sugar 10.83-12.43

filling:

pumpkin puree 15.54-16.0 granulated sugar 20.74-21.29 pectin 0.39-0.40 syrup 2.57-2.65 lemon acid 0.21

The technical result consists in improving the quality of wafers, nutritional and biological value, simplifying the method and intensifying the time of the technological process of preparing a waffle product by eliminating the reception of spreading the filling on a large surface of the wafer layer, eliminating the cutting of the wafer layer.

Chickpea is a source of complete protein and is superior in content even to animal products. Proteins of chickpea flour are mainly represented by water and salt-soluble fractions, which is a sign of good digestibility of this product. Chickpea flour is rich in phosphorus, potassium and magnesium, in addition, it has a favorable ratio of calcium and phosphorus for the human body (1: 1.5). Flour chickpea takes the first place among all leguminous crops in terms of selenium content, which enhances the body's resistance to cancer.

Buckwheat flour contains rutin, of which quercetin is a component, which prevents the formation of a cancerous tumor.

The main advantage of buckwheat flour is its low glycemic index and the complete absence of gluten protein.

Pumpkin surpasses many vegetables in the content of carbohydrates, vitamins and mineral salts. It is a rich source of potassium salts, which support the alkaline reaction of the blood of our body, reduce the acidity of gastric juice. For blood formation processes, iron is needed, which is found in large quantities in pumpkin. Its fruits also contain salts of phosphorus, silicic acid, calcium, magnesium, copper and other elements. The value of pumpkin fruits lies in the fact that it contains peptonizing enzymes that turn protein into a soluble form.

The use of a mixture of chickpea and buckwheat flour in the composition of wafer sheets and pumpkin in the composition of the filling under these conditions significantly increases their nutritional and biological value, improves the quality of the product.

A method for the production of soft wafer products with a filling is carried out as follows: melange, sugar are added to the dough mixing machine and knocked down for 15 minutes. Then add a mixture of chickpea and buckwheat flour in a ratio of 1: 3-3: 1, starch and continue to knock another 2-3 minutes until a homogeneous dough is formed.

Next, the dough is sent to the tank wafer ovens. 4 mm thick heart shaped sheets are formed.

Wafer sheets are baked at a temperature of 150-170 ° C, the baking time is 3-5 minutes.

In parallel, they are preparing the filling. First, a mixture of pectin and part of sugar is prepared in a 1: 1 ratio, then pumpkin puree is added with continuous stirring to prevent the formation of lumps. The mixture is left for 1-2 hours to swell the pectin. After this time, the remaining sugar is added to the swollen pumpkin-pectin mixture. With stirring, heat the mixture to 90 ° C. Then make molasses warmed up to 60 ° C and boil to a temperature of 106-108 ° C. Cool to 80 ° C and add citric acid.

The filling is smeared by applying hot filling with a temperature of 50 ° C on one wafer sheet, then cover the wafer sheet with the filling with the second wafer sheet and press them by pressing once on top of the product, cool the wafer product at a temperature of 8-10 ° C for 1 h and packaged finished products, the ratio of wafer sheets and toppings 3: 2, soft wafer products are prepared the next time the component ratio is selected, wt.%:

wafer sheets:

chickpea flour 3.41-10.24 buckwheat flour 3.41-10.24 starch 3.60-3.64 melange 30.28-31.92 granulated sugar 10.83-12.43

filling:

pumpkin puree 15.54-16.0 granulated sugar 20.74-21.29 pectin 0.39 - 0.40 syrup 2.57-2.65 lemon acid 0.21

Using in the recipe wafer sheets of buckwheat and chickpea flour and pumpkin puree in the filling, you can get a product of high nutritional value, containing 18 amino acids, including all essential ones, with a high content of protein, vitamins, minerals, polyunsaturated fatty acids.

The proposed method has the advantage, because it eliminates the laborious methods of spreading the filling on a large surface of the wafer layer and slicing the wafer layer. The range of waffle products is expanding.

A method for producing soft waffle products is illustrated by the following examples.

Example 1. Wafer sheets are prepared as follows: 31.92 kg melange, sugar 10.83 kg, and knock down for 15 minutes are alternately loaded into the dough mixing machine. 3.60 kg of starch and pre-mixed 3.41 kg of chickpea and 10.24 kg of buckwheat flour are added and they continue to churn for another 2-3 minutes until a homogeneous dough is formed.

Next, the dough is sent to the tank wafer ovens. Wafer sheets are baked at a temperature of 150 ° C, the duration of baking is 3 minutes

The filling is prepared as follows: 0.39 kg of pectin and a portion of sugar from a prescription amount of 0.39 kg (1: 1 ratio) are mixed, then 15.54 kg of pumpkin puree is added with continuous stirring to prevent the formation of lumps. The mixture is left for 2 hours to swell the pectin. After this time, the remaining sugar 20.9 kg is added to the swollen pumpkin-pectin mixture. With stirring, heat the mixture to 90 ° C. Then 2.57 kg of molasses, warmed up to 60 ° C, are added and boiled to a temperature of 108 ° C. Cool to 80 ° C and add 0.21 kg of citric acid.

The filling is smeared by applying hot filling with a temperature of 50 ° C on one wafer sheet, then cover the wafer sheet with the filling with the second wafer sheet and press them by pressing once on top of the product, cool the wafer product at a temperature of 8-10 ° C for 1 h and packaged finished products, the ratio of wafer sheets and toppings 3: 2, soft wafer products are prepared the next time the component ratio is selected, wt.%:

wafer sheets:

chickpea flour 3.41 buckwheat flour 10.24 starch 3.60 melange 31.92 granulated sugar 10.83

filling:

pumpkin puree 15,54 granulated sugar 21.29 pectin 0.39 syrup 2,57 lemon acid 0.21

Organoleptic indicators and nutritional value are determined in finished products. The data are presented in the table.

Example 2. Soft waffle products are prepared analogously to example 1, but the next time you select the ratio of components, wt.%:

wafer sheets:

chickpea flour 7.00 buckwheat flour 7.00 starch 3.64 melange 30,42 granulated sugar 11.94

filling:

pumpkin puree 15.94 granulated sugar 20.81 pectin 0.40 syrup 2.64 lemon acid 0.21

Organoleptic indicators and nutritional value are determined in finished products. The data are presented in the table.

Example 3. Soft waffle products are prepared analogously to example 1, but the next time you select the ratio of components, wt.%:

wafer sheets:

chickpea flour 10.24 buckwheat flour 3.41 starch 3.64 melange 30.28 granulated sugar 12,43

filling:

pumpkin puree 16.00 granulated sugar 20.74 pectin 0.40 syrup 2.65 lemon acid 0.21

Organoleptic indicators and nutritional value are determined in finished products. The data are presented in the table.

As can be seen from the table, the ratio of the components of the formulation of soft wafers allows you to get a product with high organoleptic quality indicators and higher nutritional value compared to the prototype.

When the ratio of buckwheat flour and chickpea flour is less than 1: 3, the biological value slightly increases, more than 3: 1 the color of the wafer product deteriorates, the taste of buckwheat flour is enhanced.

The proposed method of soft waffle products allows you to:

- change the structure of the wafer sheet;

- improve the quality of wafer sheets;

- improve the quality of the filling;

- increase nutritional and biological value;

- eliminate laborious methods of spreading the filling on the large surface of the wafer sheet and slicing the wafer layer;

- expand the range of flour confectionery products of improved composition.

Table - Comparative characteristics of samples of soft waffle products with the prototype Components and compositional indicators Characteristic indicators, example Prototype one 2 3 Organoleptic quality indicators Color Light yellow Bright yellow Bright yellow with a light brown tint Light brown Taste and smell Characterized as milky fruit Specific to this appellation of soft waffle products, without extraneous taste and odor Peculiar to this appellation of soft waffle products, with a slight taste of buckwheat flour Peculiar to this name of soft waffle products, with a taste of buckwheat flour Appearance Chocolate glazed confectionery Soft waffle products have the same size and regular shape, the filling in waffles does not protrude over the edges Content, g: protein 3.8 8.76 8.14 7.45 fats 12.3 5.97 5.84 5.69 carbohydrates 64.6 34.17 35.3 36.46 dietary fiber 0.28 0.39 0.46 0.51 Minerals, mg calcium 24.19 40.32 73.68 45.17 phosphorus 95.24 118.62 121.65 125.88 potassium 103.67 120.56 126.34 130.56 magnesium 9.18 16.23 16.82 17.01 gland 1.3 1,5 1.74 2.00 selenium, mcg 0.53 1,52 1.18 0.96 Vitamins mg vitamin B ₁ 0.04 0.056 0,068 0,062 vitamin b ₂ 0.14 0.176 0.182 0.194 vitamin PP 0.381 0.506 0.584 0.59 β-carotene - 187.84 187.84 187.84

Claims (1)

A method for the production of soft waffle products, characterized in that they prepare dough for wafer sheets, for which they knock down melange and sugar for 15 minutes, then add a mixture of chickpea and buckwheat flour in a ratio of 1: 3-3: 1, starch and continue to knock another 2 -3 min until a uniform consistency of the dough is formed, then 4 mm thick heart-shaped sheets are formed, baked and cooled, at the same time the filling is prepared, for the preparation of which pumpkin puree, apple pectin and sugar are used, first pectin and some sugar taken are mixed 1: 1 ratio, then pumpkin puree is added with continuous stirring to prevent lumps, the mixture is left for 1-2 hours to swell pectin, after this time, the remaining sugar is added to the swollen pumpkin-pectin mixture, and the mixture is heated to 90 ° C with stirring then make molasses heated to 60 ° C and boil to a temperature of 106-108 ° C, cool to 80 ° C and add citric acid, spread the filling by applying hot fillings with a temperature of 50 ° C on one wafer sheet, then cover the wafer a flaxen sheet stuffed with a second wafer sheet and press them by pressing once on top of the resulting product, cool the wafer product at a temperature of 8-10 ° C for 1 h and pack the finished product, the ratio of wafer sheets to the filling 3: 2, soft waffle product is prepared the next choice of the ratio of components, wt.%:
wafer sheets:
chickpea flour 3.41-10.24 buckwheat flour 3.41-10.24 starch 3.60-3.64 melange 30.28-31.92 granulated sugar 10.83-12.43
filling:
pumpkin puree 15.54-16.0 granulated sugar 20.74-21.29 pectin 0.39-0.40 syrup 2.57-2.65 lemon acid 0.21