RU177054U1 - LASER MODULE - Google Patents

Abstract

The utility model relates to optical-electronic devices, in particular to small-sized laser light sources, and can be used in optical devices intended, for example, for making measurements. The technical result of the utility model is to increase the efficiency of heat removal from the laser module housing, which allows to increase the life of the laser semiconductor diode located in it. The result is achieved in that the laser module comprises a hollow cylindrical body in which an optical system and a laser semiconductor diode with leads connected to an electronic control circuit are located on one optical axis. In this case, the laser module differs from the prototype in that it additionally contains a heat-conducting holder, including a base and a clamp bracket, as well as a heat-removing element, on which, through a flange located perpendicular to the optical axis, the holder base is fixed, in the lodgement of which the laser module housing is mounted, mounted on top by means of a clamping bracket. The inner surfaces of the base and the clamping bracket of the holder are made of thermal paste. 4 ill.

Description

The utility model relates to optical-electronic devices, in particular to small-sized laser light sources, and can be used in optical devices intended, for example, for making measurements.

A laser module is known from the prior art (US Pat. No. 5,121,188, IPC: H01L 23/04), comprising a hollow cylindrical body in which an optical system is located on one optical axis and is mounted in a holder screwed into the housing from its front side, as well as a laser a diode with leads, an electronic control circuit of the laser diode, which is electrically connected to the leads of the laser diode, and a plug fixed to the rear end surface of the housing. The laser diode is a base on which a laser crystal is mounted, closed by a lid. In this case, the module housing is the first electrical contact for supplying power to the driver and the laser diode, and the second electrical contact is located in the plug.

The disadvantage of this device is the lack of external heat sinks and reliable thermal and mechanical contact between the base of the laser diode and the housing of the module, leading to overheating of the laser diode during operation and to shorten its operating time. In addition, the use of the module housing as one of the electrical contacts for power supply limits the scope of the laser module of this design.

A well-known laser injection emitter (certificate of the Russian Federation for utility model No. 1579, published January 16, 1996, IPC: H01S 3/025, H01S 3/18) containing a heat sink base with current leads, a contact plate with a laser diode crystal fixed to it, and control photodiode mounted on the mounting surface of the base-heat sink, as well as the housing, the sleeve and the optical fiber. An inserted fiber-optic holder is fixed on the surface of the contact plate parallel to the mounting surface of the heat sink base, and a fiber with an end lens is fixed on the surface parallel to the surface of the emitting crystal on the contact plate, which is secondly fixed in the sleeve.

The disadvantages of this device are the presence of a fiber with a fiber holder in place of the optical system, which complicates the assembly of the laser module and increases the dimensions of the module, leaky, fragile design, in which there are no elements of external heat sinks.

Closest to the claimed technical solution is a laser module (certificate of the Russian Federation for utility model No. 36570, published March 10, 2004, IPC: H01L 23/04), which is selected as a prototype. The laser module comprises a hollow cylindrical body in which an optical system and a laser diode with leads connected to an electronic control circuit are located on one optical axis. Moreover, the case is made of two parts, in one of which is an optical system and a laser diode, and in the other an electronic circuit. In this case, the diode is equipped with a clamping element that provides thermal contact between the laser diode and the housing and has an opening for the terminals of the laser diode.

The disadvantage of this device is the insufficient heat removal from the laser module housing.

The technical problem solved by the creation of a utility model is the insufficient reliability of the laser module due to overheating of the laser semiconductor diode, which reduces its service life.

The technical result of the utility model is to increase the efficiency of heat removal from the laser module housing, which allows to increase the life of the laser semiconductor diode located in it.

The technical result is achieved in that the laser module comprises a hollow cylindrical body in which an optical system and a laser semiconductor diode with leads connected to an electronic control circuit are located on one optical axis. In this case, the laser module differs from the prototype in that it additionally contains a heat-conducting holder, including a base and a clamp bracket, as well as a heat-removing element, on which, through a flange located perpendicular to the optical axis, the holder base is fixed, in the lodgement of which the laser module housing is mounted, mounted on top by means of a clamping bracket. The inner surfaces of the base and the clamping bracket of the holder are made of thermal paste.

The essence of the utility model is illustrated by the drawings of FIG. 1 - FIG. 4, where:

FIG. 1 - laser module with a heat sink element in section,

FIG. 2 is a general view of a laser module with a holder,

FIG. 3 is a General view of the base of the holder with a flange,

FIG. 4 - General view of the clamping bracket.

In the drawings, the positions indicate the following elements of the laser module:

1 - housing

2 - thermally conductive holder,

3 - heat sink element,

4 - optical system

5 - laser semiconductor diode,

6 is an electronic control circuit,

7 - base

8 - clamping bracket,

9 - the lodgement of the base,

10 - flange

11 - hole flange

12 is a longitudinal end surface of the base,

13 - holes of the base,

14 - the lodgement of the clamping bracket,

15 is a longitudinal end surface of the clamping bracket,

16 - holes clamping bracket

17 - the inner surface of the base,

18 - the inner surface of the clamping bracket.

The laser module (Fig. 1) consists of a hollow cylindrical body 1, a heat-conducting holder 2 and a heat-removing element 3.

Inside the housing 1, on one optical axis, starting from its front side, an optical system 4, a laser semiconductor diode 5 with leads, and an electronic control circuit 6 of the laser semiconductor diode 5, which is electrically connected to the terminals of the laser semiconductor diode 5 (Fig. 1), are placed.

The heat-conducting holder 2 consists of a base 7 and a clamping bracket 8 (Fig. 3, 4).

A lodgement 9 is made on the inner surface of the base 7 (Fig. 3) of the heat-conducting holder 2 to accommodate the housing 1 of the laser module, commensurate with the lower side surface of the housing 1 and repeating its shape. To fix the heat-conducting holder 2 to the heat-removing element 3, the base 7 has a flange 10. Moreover, the flange 10 of the base 7 of the heat-conducting holder 2 is perpendicular to the optical axis of the laser module. Countersink holes 11 are made on the flange 10 for fastening screws of the heat-conducting holder 2 to the heat-removing element 3. On the longitudinal end surface 12 of the base 7, threaded holes 13 are made for attaching the clamping bracket 8.

The clamping bracket 8 (Fig. 4) for placement and fastening of the housing 1 of the laser module has a lodgement 14, commensurate with the upper side surface of the housing 1 and repeating its shape. On the longitudinal end surface 15 of the clamping bracket 8, holes 16 are made for attaching the clamping bracket 8 to the base 7. To improve thermal conductivity, the inner cylindrical surfaces 17 of the base 7 and 18 of the clamping bracket 8 of the heat-conducting holder 2 are coated with a thin layer of thermal paste.

The assembly of the laser module is as follows. Inside the laser module housing 1, starting from its front side, the following elements are installed on the same optical axis: optical system 4, laser semiconductor diode 5, and electronic circuit 6. Then, housing 1 is placed horizontally in the cradle 9 of the base 7 of the heat-conducting holder 2 at the location level a laser semiconductor diode 5 and an electronic circuit 6 for controlling a laser semiconductor diode 5. On top of the housing 1 above the base 7 of the heat-conducting holder 2, a clamp bracket 8 with an inner bed is installed volume 14, combining the holes 13 on the longitudinal end surface of the base 12 and the holes 16 on the longitudinal end surface of the clamp bracket 15. Using fasteners, for example, screws, fasten the base 7 and the clamp bracket 15 of the heat-conducting holder 2 tightly covering the outer cylindrical surface of the housing 1. The base 7 and the holder 8 are made of heat-conducting material, such as aluminum alloy D16 or AMg6. In this case, the inner cylindrical surface 17 of the base 7 and the inner cylindrical surface 18 of the clamping bracket 8 of the heat-conducting holder 2 are pre-coated with a thin layer of thermal paste (for example, KPT-8), which can significantly improve the heat dissipation generated by the laser semiconductor diode 5 and the electronic circuit 6 to the housing 1 laser module. In order to ensure efficient heat removal from the laser module housing 1, the base 7 of the heat-conducting holder 2 is made with a flange 10 having fixing holes, by means of which the laser module housing 1, installed inside the heat-conducting holder 2, is attached to the heat-removing element 3, made, for example, in the form of a radiator, fasteners, for example, screws.

The flange 10 of the base 7 allows you to fix the heat-conducting holder 2 of the laser module in the perpendicular direction relative to the optical axis, which reduces the size of the device in which the laser module will be installed, as well as provide increased resistance to mechanical stress.

To implement the operation of the laser module on the electronic control circuit 6 of the laser semiconductor diode 5 serves a supply voltage. The electronic control circuit 6 controls the semiconductor laser diode 5, namely, it allows you to maintain a constant optical radiation power of the laser semiconductor diode 5, and also performs a protective function that allows you to turn off the laser semiconductor diode 5 in a situation leading to its failure. The radiation emerging from the laser semiconductor diode 5 is directed to the optical system 4. The optical system 4 forms a beam of radiation with predetermined divergence parameters. During operation of the laser module, the electronic control circuit 6 and the semiconductor laser diode 5 emit heat, which must constantly be removed from the housing 1 heated by it, eliminating overheating, which allows to increase the life of the laser semiconductor diode 5 and the reliability of the laser module.

Thus, the proposed design of the laser module allows for reliable mounting of the laser module and efficient heat removal from the housing, which significantly reduces the possibility of overheating of the laser semiconductor diode and, as a result, increases the reliability of the laser module.

The manufacture of a laser module does not require the use of special technologies and unique materials, so it can be repeatedly reproduced in industrial production.

Claims (1)

A laser module comprising a hollow cylindrical body, in which an optical circuit and a laser optical diode with leads connected to an electronic control circuit are located on one optical axis, characterized in that it further comprises a heat-conducting holder including a base and a pressure bracket, as well as a heat sink element, on which the base of the holder is fixed by means of a flange located perpendicular to the optical axis, in the lodgement of which the laser module housing is mounted, mounted on top of by means of a clamping bracket, wherein the inner surfaces of the base and clamping bracket of the holder are coated with thermal paste.

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