RO100614A2 - Electrolythic bath for sn-pb alloys electrodeposition, used at printed circuits manufacturing - Google Patents
Electrolythic bath for sn-pb alloys electrodeposition, used at printed circuits manufacturingInfo
- Publication number
- RO100614A2 RO100614A2 RO1988132236A RO13223688A RO100614A2 RO 100614 A2 RO100614 A2 RO 100614A2 RO 1988132236 A RO1988132236 A RO 1988132236A RO 13223688 A RO13223688 A RO 13223688A RO 100614 A2 RO100614 A2 RO 100614A2
- Authority
- RO
- Romania
- Prior art keywords
- bath
- electrolythic
- electrodeposition
- alloys
- printed circuits
- Prior art date
Links
- 229910000978 Pb alloy Inorganic materials 0.000 title 1
- 238000004070 electrodeposition Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 abstract 2
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 abstract 1
- IULJSGIJJZZUMF-UHFFFAOYSA-N 2-hydroxybenzenesulfonic acid Chemical compound OC1=CC=CC=C1S(O)(=O)=O IULJSGIJJZZUMF-UHFFFAOYSA-N 0.000 abstract 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 abstract 1
- 239000001888 Peptone Substances 0.000 abstract 1
- 108010080698 Peptones Proteins 0.000 abstract 1
- 235000019319 peptone Nutrition 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 229910052708 sodium Inorganic materials 0.000 abstract 1
- 239000011734 sodium Substances 0.000 abstract 1
- -1 tin fluoroborate form Chemical group 0.000 abstract 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The bath comprises 70 g/l of fluoroboric acid, 90 g/l of Sn(2+) in tin fluoroborate form, 35 g/l of Pb(2+) in lead fluoroborate form and 18 g/l of stabilised peptone. It also contains 19 g/l of hydroquinone and 20 g/l of salt of sodium and phenol sulphonic acid. The deposit is clear, ductile, highly weldable and stable, and thus simplifies mfr.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| RO1988132236A RO100614A2 (en) | 1988-02-17 | 1988-02-17 | Electrolythic bath for sn-pb alloys electrodeposition, used at printed circuits manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| RO1988132236A RO100614A2 (en) | 1988-02-17 | 1988-02-17 | Electrolythic bath for sn-pb alloys electrodeposition, used at printed circuits manufacturing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| RO100614B1 RO100614B1 (en) | 1991-01-31 |
| RO100614A2 true RO100614A2 (en) | 1991-08-27 |
Family
ID=20121149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RO1988132236A RO100614A2 (en) | 1988-02-17 | 1988-02-17 | Electrolythic bath for sn-pb alloys electrodeposition, used at printed circuits manufacturing |
Country Status (1)
| Country | Link |
|---|---|
| RO (1) | RO100614A2 (en) |
-
1988
- 1988-02-17 RO RO1988132236A patent/RO100614A2/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| RO100614B1 (en) | 1991-01-31 |
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