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PT3233414T - Processo e dispositivo para revestimento de uma lâmpada led revestida numa massa de revestimento - Google Patents

Processo e dispositivo para revestimento de uma lâmpada led revestida numa massa de revestimento

Info

Publication number
PT3233414T
PT3233414T PT158328807T PT15832880T PT3233414T PT 3233414 T PT3233414 T PT 3233414T PT 158328807 T PT158328807 T PT 158328807T PT 15832880 T PT15832880 T PT 15832880T PT 3233414 T PT3233414 T PT 3233414T
Authority
PT
Portugal
Prior art keywords
led luminaire
potting
potted
potting compound
compound
Prior art date
Application number
PT158328807T
Other languages
English (en)
Original Assignee
Geomar Helmholtz Zentrum Fuer Ozeanforschung Kiel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102014118671.0A external-priority patent/DE102014118671A1/de
Priority claimed from DE102014118672.9A external-priority patent/DE102014118672B3/de
Application filed by Geomar Helmholtz Zentrum Fuer Ozeanforschung Kiel filed Critical Geomar Helmholtz Zentrum Fuer Ozeanforschung Kiel
Publication of PT3233414T publication Critical patent/PT3233414T/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/768—Detecting defective moulding conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76003—Measured parameter
    • B29C2945/76153—Optical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76177—Location of measurement
    • B29C2945/76287—Moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76494—Controlled parameter
    • B29C2945/76498—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76494—Controlled parameter
    • B29C2945/76568—Position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76655—Location of control
    • B29C2945/76792—Auxiliary devices
    • B29C2945/76795—Auxiliary devices robots, grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76655—Location of control
    • B29C2945/76792—Auxiliary devices
    • B29C2945/76812—Auxiliary fluid supplying devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
PT158328807T 2014-12-15 2015-12-09 Processo e dispositivo para revestimento de uma lâmpada led revestida numa massa de revestimento PT3233414T (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014118671.0A DE102014118671A1 (de) 2014-12-15 2014-12-15 Verfahren zum Verguss von einer LED-Leuchte für den Einsatz in der Tiefsee und LED-Leuchte
DE102014118672.9A DE102014118672B3 (de) 2014-12-15 2014-12-15 Verfahren und Vorrichtung zur Herstellung von in Vergussmasse vergossenen Leuchten

Publications (1)

Publication Number Publication Date
PT3233414T true PT3233414T (pt) 2020-02-24

Family

ID=55345620

Family Applications (1)

Application Number Title Priority Date Filing Date
PT158328807T PT3233414T (pt) 2014-12-15 2015-12-09 Processo e dispositivo para revestimento de uma lâmpada led revestida numa massa de revestimento

Country Status (8)

Country Link
US (1) US20170334114A1 (pt)
EP (1) EP3233414B1 (pt)
JP (1) JP6403890B2 (pt)
CA (1) CA2970918C (pt)
DK (1) DK3233414T3 (pt)
ES (1) ES2780026T3 (pt)
PT (1) PT3233414T (pt)
WO (1) WO2016095901A1 (pt)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2018007530A (es) * 2015-12-23 2018-09-07 Koninklijke Philips Nv Disposicion de carga y disposicion de energia electrica para energizar una carga.
US10768358B2 (en) * 2017-08-17 2020-09-08 Dura Operating, Llc Printed film with mounted light emitting diodes encapsulated in light guide
KR20210060576A (ko) 2018-09-20 2021-05-26 코닌클리케 필립스 엔.브이. 해양 물체의 표면 영역에 적용되도록 구성된 발광 유닛
US11426476B2 (en) * 2019-12-12 2022-08-30 United States Of America As Represented By The Secretary Of The Navy Internal ultraviolet LED antifouling
CN111823458B (zh) * 2020-06-29 2022-05-17 合肥市惠华电子有限公司 一种吊顶注塑设备
EP3978154A1 (en) * 2020-10-02 2022-04-06 Koninklijke Philips N.V. Anti-fouling unit configured to be arranged on a surface
JP7538029B2 (ja) 2020-12-23 2024-08-21 株式会社日立産機システム 樹脂構造物製造方法、および、樹脂構造物製造装置
CN113267566A (zh) * 2021-06-30 2021-08-17 杭州晶志康电子科技有限公司 一种aoi自动灌胶检验系统及检验方法
CN115071087A (zh) * 2022-05-10 2022-09-20 安徽陆科光电科技有限公司 一种led支架注塑成型在线检测分拣智能生产线
ES2960434A1 (es) * 2022-08-03 2024-03-04 Quality Photonic Optics S L Metodo para la fabricacion de optica embebida en componentes fotonicos

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5354537Y2 (pt) * 1972-10-31 1978-12-27
JPS55174308U (pt) * 1979-05-31 1980-12-13
JPS609416U (ja) * 1983-06-28 1985-01-23 象印マホービン株式会社 炊飯器
US4689523A (en) 1985-02-06 1987-08-25 Fowler Michael P Optical cleaning system for removing matter from underwater surfaces
TW325744U (en) * 1993-07-21 1998-01-21 Ciba Geigy Ag Two-sided contact lens mold
US7040779B2 (en) 2000-03-09 2006-05-09 Mongo Light Co. Inc LED lamp assembly
JP2002076041A (ja) * 2000-09-01 2002-03-15 Nec Corp 樹脂封入性評価方法並びに評価装置
JP4179853B2 (ja) * 2002-11-13 2008-11-12 スリーエム イノベイティブ プロパティズ カンパニー 可とう性成形型及び微細構造体の製造方法
US8533990B2 (en) 2003-02-11 2013-09-17 Eric E Aanenson Deep sea fishing lure
US7341695B1 (en) 2003-12-16 2008-03-11 Stuart Garner Anti-fouling apparatus and method
DE102004004781A1 (de) * 2004-01-30 2005-08-18 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement
WO2006091538A2 (en) * 2005-02-22 2006-08-31 Kevin Doyle An led pool or spa light having a unitary lens body
JP4781986B2 (ja) * 2005-12-15 2011-09-28 篤 坂井 イカ釣り漁船用集魚装置
US9235048B2 (en) 2012-07-13 2016-01-12 Woods Hole Oceanographic Institution Marine environment antifouling system and methods
JP4855869B2 (ja) 2006-08-25 2012-01-18 日亜化学工業株式会社 発光装置の製造方法
US8052303B2 (en) 2006-09-12 2011-11-08 Huizhou Light Engine Ltd. Integrally formed single piece light emitting diode light wire and uses thereof
JP2008077842A (ja) * 2006-09-19 2008-04-03 Fukuo Tsukamoto 照明灯
WO2008052667A1 (de) * 2006-10-31 2008-05-08 Bayer Materialscience Ag Verfahren und vorrichtung zur detektion von fehlstellen in einem transparenten festkörper
JP5192749B2 (ja) * 2007-08-10 2013-05-08 Ｔｏｗａ株式会社 光素子の樹脂封止成形方法及び装置
US7862728B2 (en) * 2007-09-27 2011-01-04 Water Of Life, Llc. Ultraviolet water purification system
JP3144139U (ja) * 2008-01-16 2008-08-21 アイソースインターナショナル有限会社 水中ライト
DE102008009808A1 (de) 2008-02-19 2009-08-27 Lighting Innovation Group Ag LED-Lichtleiste höherer Schutzart
DE202008012002U1 (de) 2008-09-09 2009-01-02 Reetec Gmbh Regenerative Energie- Und Elektrotechnik Leuchte mit LED-Einheiten
WO2010095707A1 (ja) * 2009-02-23 2010-08-26 ローム株式会社 浄水器
PH12012500357A1 (en) * 2009-09-24 2012-10-22 Asahi Glass Co Ltd Mold release film and process for producing light emitting diode
JP2010206837A (ja) * 2010-05-25 2010-09-16 Moeller Gmbh オープン化されたフィールドバスを介してバスネットワーク接続された機器を制御する方法およびスイッチング機器
WO2012014299A1 (ja) * 2010-07-28 2012-02-02 パイオニア株式会社 モールドの製造方法及びモールド用基板
DE102011001680A1 (de) 2011-03-30 2012-10-04 W. Döllken & Co. GmbH Verfahren zum Herstellen eines Beleuchtungskörpers auf LED-Basis
DE102011106252A1 (de) 2011-07-01 2013-01-03 Siteco Beleuchtungstechnik Gmbh Leuchte mit Vergussmasse
US8789988B2 (en) * 2011-07-21 2014-07-29 Dan Goldwater Flexible LED light strip for a bicycle and method for making the same
US8445864B2 (en) 2011-08-26 2013-05-21 Raytheon Company Method and apparatus for anti-biofouling of a protected surface in liquid environments
DE102012201447A1 (de) 2012-02-01 2013-08-01 Osram Gmbh LED-Modul
DE102012003284A1 (de) 2012-02-20 2013-08-22 Robert Pickardt Gerät zur Verhinderung von biologischem Bewuchs auf messtechnischen Sensoren
JP5496306B2 (ja) * 2012-10-31 2014-05-21 株式会社トクヤマ 紫外線殺菌装置

Also Published As

Publication number Publication date
EP3233414A1 (de) 2017-10-25
CA2970918C (en) 2019-03-26
EP3233414B1 (de) 2020-01-08
WO2016095901A1 (de) 2016-06-23
DK3233414T3 (da) 2020-03-23
JP2018501987A (ja) 2018-01-25
JP6403890B2 (ja) 2018-10-10
US20170334114A1 (en) 2017-11-23
CA2970918A1 (en) 2016-06-23
ES2780026T3 (es) 2020-08-21

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