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PL3140097T3 - Korpus wielowarstwowy i sposób jego wytwarzania - Google Patents

Korpus wielowarstwowy i sposób jego wytwarzania

Info

Publication number
PL3140097T3
PL3140097T3 PL15720099T PL15720099T PL3140097T3 PL 3140097 T3 PL3140097 T3 PL 3140097T3 PL 15720099 T PL15720099 T PL 15720099T PL 15720099 T PL15720099 T PL 15720099T PL 3140097 T3 PL3140097 T3 PL 3140097T3
Authority
PL
Poland
Prior art keywords
production
multilayer body
multilayer
Prior art date
Application number
PL15720099T
Other languages
English (en)
Inventor
Klaus Ludwig
Christian Schulz
Rainer Stahl
Original Assignee
Leonhard Kurz Stiftung & Co. Kg
Polyic Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leonhard Kurz Stiftung & Co. Kg, Polyic Gmbh & Co. Kg filed Critical Leonhard Kurz Stiftung & Co. Kg
Publication of PL3140097T3 publication Critical patent/PL3140097T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • B29C45/14811—Multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14688—Coating articles provided with a decoration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2009/00—Layered products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3493—Moulded interconnect devices, i.e. moulded articles provided with integrated circuit traces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Optical Filters (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Laminated Bodies (AREA)
PL15720099T 2014-05-09 2015-05-07 Korpus wielowarstwowy i sposób jego wytwarzania PL3140097T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014106585.9A DE102014106585A1 (de) 2014-05-09 2014-05-09 Mehrschichtkörper und Verfahren zu dessen Herstellung
PCT/EP2015/060029 WO2015169890A2 (de) 2014-05-09 2015-05-07 Mehrschichtkörper und verfahren zu dessen herstellung
EP15720099.9A EP3140097B1 (de) 2014-05-09 2015-05-07 Mehrschichtkörper und verfahren zu dessen herstellung

Publications (1)

Publication Number Publication Date
PL3140097T3 true PL3140097T3 (pl) 2020-02-28

Family

ID=53039921

Family Applications (1)

Application Number Title Priority Date Filing Date
PL15720099T PL3140097T3 (pl) 2014-05-09 2015-05-07 Korpus wielowarstwowy i sposób jego wytwarzania

Country Status (9)

Country Link
US (1) US10335987B2 (pl)
EP (1) EP3140097B1 (pl)
JP (1) JP6687219B2 (pl)
KR (1) KR102314674B1 (pl)
CN (1) CN106660241B (pl)
DE (1) DE102014106585A1 (pl)
ES (1) ES2748425T3 (pl)
PL (1) PL3140097T3 (pl)
WO (1) WO2015169890A2 (pl)

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US10619808B2 (en) 2017-10-18 2020-04-14 Good Earth Lighting, Inc. Flat panel ceiling light with quick-change covers
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DE102019127108A1 (de) * 2019-10-09 2021-04-15 Leonhard Kurz Stiftung & Co. Kg Verfahren und Vorrichtung zur Herstellung eines Kunststoffbauteils sowie ein Kunststoffbauteil
CN111231217A (zh) * 2020-01-21 2020-06-05 东莞广华汽车饰件科技有限公司 一种车用控制开关的制造工艺
DE102020105361A1 (de) * 2020-02-28 2021-09-02 Leonhard Kurz Stiftung & Co. Kg Verfahren und Vorrichtung zum Dekorieren eines Spritzgussformteils sowie ein Spritzgussformteil
CN111923323A (zh) * 2020-06-23 2020-11-13 苏州斯普兰蒂电子有限公司 一种内置led灯电路的模内注塑产品的制备工艺
KR102357563B1 (ko) * 2020-12-14 2022-02-07 인탑스 주식회사 전자회로 도금 공법을 이용한 ime 구조 및 그 제조방법
DE102021104294A1 (de) * 2021-02-23 2022-08-25 Polyic Gmbh & Co. Kg Schichtkörper mit Dekorationsschicht und Verfahren zur Herstellung
CN112959647A (zh) * 2021-03-08 2021-06-15 东莞广华汽车饰件科技有限公司 一种内溅镀式胶膜汽车装饰件的制造方法
CN112936735A (zh) * 2021-03-08 2021-06-11 东莞广华汽车饰件科技有限公司 一种双色遮蔽内溅镀式车用发光装饰件的制造方法
US11175438B1 (en) * 2021-05-17 2021-11-16 Tactotek Oy Optoelectronically functional multilayer structure having embedded light-defining segments and related manufacturing method
KR102394587B1 (ko) * 2021-07-19 2022-05-06 인탑스 주식회사 다중 ime 구조 및 그 제조 방법
CN113696410A (zh) * 2021-08-26 2021-11-26 东莞广华汽车饰件科技有限公司 一种具有发光功能的汽车装饰件的制造方法
KR20230044656A (ko) * 2021-09-27 2023-04-04 삼성전자주식회사 디스플레이 모듈 및 이를 포함하는 웨어러블 전자 장치
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Also Published As

Publication number Publication date
CN106660241A (zh) 2017-05-10
KR102314674B1 (ko) 2021-10-20
US10335987B2 (en) 2019-07-02
CN106660241B (zh) 2019-08-16
JP2017522583A (ja) 2017-08-10
KR20170026353A (ko) 2017-03-08
JP6687219B2 (ja) 2020-04-22
ES2748425T3 (es) 2020-03-16
DE102014106585A1 (de) 2015-11-12
WO2015169890A3 (de) 2016-02-04
EP3140097B1 (de) 2019-09-04
WO2015169890A2 (de) 2015-11-12
US20170066168A1 (en) 2017-03-09
EP3140097A2 (de) 2017-03-15

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