PL2769002T3 - Rurowy target - Google Patents

Rurowy target

Info

Publication number: PL2769002T3
Authority: PL; Poland
Prior art keywords: tubular target; tubular; target
Prior art date: 2011-10-18

Application number

PL12795724T

Other languages

English (en)

Inventor

Peter Abenthung

Christian Linke

André Dronhofer

Hartmut Wolf

Tobias Will

Wolfgang Köck

Original Assignee

Plansee Se

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2011-10-18

Filing date

2012-10-17

Publication date

2016-03-31

2012-10-17 Application filed by Plansee Se filed Critical Plansee Se

2016-03-31 Publication of PL2769002T3 publication Critical patent/PL2769002T3/pl

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/342—Hollow targets
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3423—Shape
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3426—Material
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3491—Manufacturing of targets

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Plasma & Fusion (AREA)
Analytical Chemistry (AREA)
Materials Engineering (AREA)
Chemical Kinetics & Catalysis (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Powder Metallurgy (AREA)
Physical Vapour Deposition (AREA)
Electrodes Of Semiconductors (AREA)

PL12795724T 2011-10-18 2012-10-17 Rurowy target PL2769002T3 (pl)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
ATGM562/2011U AT12292U3 (de)	2011-10-18	2011-10-18	Rohrtarget
EP12795724.9A EP2769002B1 (de)	2011-10-18	2012-10-17	Rohrtarget
PCT/AT2012/000262 WO2013056286A1 (de)	2011-10-18	2012-10-17	Rohrtarget

Publications (1)

Publication Number	Publication Date
PL2769002T3 true PL2769002T3 (pl)	2016-03-31

Family

ID=45463107

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
PL12795724T PL2769002T3 (pl)	2011-10-18	2012-10-17	Rurowy target

Country Status (10)

Country	Link
US (1)	US20140238850A1 (pl)
EP (1)	EP2769002B1 (pl)
JP (1)	JP2015501376A (pl)
KR (1)	KR20140091677A (pl)
CN (1)	CN104040019B (pl)
AT (1)	AT12292U3 (pl)
ES (1)	ES2555876T3 (pl)
PL (1)	PL2769002T3 (pl)
TW (1)	TWI550115B (pl)
WO (1)	WO2013056286A1 (pl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
AT14912U1 (de) *	2015-05-06	2016-08-15	Plansee Se	Anschlussstück für Rohrtarget

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE68924095T2 (de) *	1988-05-16	1996-04-04	Tosoh Corp	Verfahren zur Herstellung eines Sputtertargets zur Erzeugung einer elektrisch leitenden, durchsichtigen Schicht.
CA2089149C (en) *	1990-08-10	2002-11-26	Eric R. Dickey	Shielding for arc suppression in rotating magnetron sputtering systems
BE1007067A3 (nl)	1992-07-15	1995-03-07	Emiel Vanderstraeten Besloten	Sputterkathode en werkwijze voor het vervaardigen van deze kathode.
JPH06172991A (ja) *	1992-11-30	1994-06-21	Mitsui Mining & Smelting Co Ltd	マグネトロンスパッタリング用セラミックスターゲット
JP3863204B2 (ja) *	1995-08-25	2006-12-27	株式会社アライドマテリアル	スパッタリングターゲット材及びその製造方法
JP2002302762A (ja) *	2001-04-04	2002-10-18	Tosoh Corp	Ｉｔｏスパッタリングターゲット
JP4014982B2 (ja) *	2002-09-19	2007-11-28	株式会社神戸製鋼所	アーク蒸発源用のロッドターゲット、その製造方法及びアーク蒸着装置
US20070172378A1 (en) *	2004-01-30	2007-07-26	Nippon Tungsten Co., Ltd.	Tungsten based sintered compact and method for production thereof
US20050279630A1 (en) *	2004-06-16	2005-12-22	Dynamic Machine Works, Inc.	Tubular sputtering targets and methods of flowforming the same
KR101147941B1 (ko) *	2004-07-16	2012-05-24	베카에르트 어드벤스드 코팅스	열간 등방압 처리에 의해 얻어진 원통형 타겟
AT8697U1 (de) *	2005-10-14	2006-11-15	Plansee Se	Rohrtarget
WO2007049761A1 (ja) *	2005-10-27	2007-05-03	Kabushiki Kaisha Toshiba	モリブデン合金およびそれを用いたｘ線管回転陽極ターゲット、ｘ線管並びに溶融るつぼ
WO2007141173A1 (en) *	2006-06-02	2007-12-13	Bekaert Advanced Coatings	A rotatable sputter target
US8043488B2 (en) *	2006-06-02	2011-10-25	Bekaert Advanced Coatings	Rotatable sputter target
FR2944295B1 (fr) *	2009-04-10	2014-08-15	Saint Gobain Coating Solutions	Cible a base de molybdene et procede d'elaboration par projection thermique d'une cible

2011
- 2011-10-18 AT ATGM562/2011U patent/AT12292U3/de not_active IP Right Cessation
2012
- 2012-09-18 TW TW101134109A patent/TWI550115B/zh active
- 2012-10-17 KR KR1020147009935A patent/KR20140091677A/ko not_active Ceased
- 2012-10-17 PL PL12795724T patent/PL2769002T3/pl unknown
- 2012-10-17 ES ES12795724.9T patent/ES2555876T3/es active Active
- 2012-10-17 US US14/352,725 patent/US20140238850A1/en not_active Abandoned
- 2012-10-17 EP EP12795724.9A patent/EP2769002B1/de active Active
- 2012-10-17 WO PCT/AT2012/000262 patent/WO2013056286A1/de active Application Filing
- 2012-10-17 JP JP2014536061A patent/JP2015501376A/ja active Pending
- 2012-10-17 CN CN201280051077.0A patent/CN104040019B/zh active Active

Also Published As

Publication number	Publication date
EP2769002B1 (de)	2015-09-30
JP2015501376A (ja)	2015-01-15
KR20140091677A (ko)	2014-07-22
US20140238850A1 (en)	2014-08-28
TW201329265A (zh)	2013-07-16
TWI550115B (zh)	2016-09-21
ES2555876T3 (es)	2016-01-11
WO2013056286A1 (de)	2013-04-25
CN104040019B (zh)	2016-06-29
AT12292U3 (de)	2013-03-15
CN104040019A (zh)	2014-09-10
AT12292U2 (de)	2012-03-15
EP2769002A1 (de)	2014-08-27

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