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PL2457728T3 - Sposób laminowania obrabianych przedmiotów zasadniczo w postaci płyty - Google Patents

Sposób laminowania obrabianych przedmiotów zasadniczo w postaci płyty

Info

Publication number
PL2457728T3
PL2457728T3 PL11008212T PL11008212T PL2457728T3 PL 2457728 T3 PL2457728 T3 PL 2457728T3 PL 11008212 T PL11008212 T PL 11008212T PL 11008212 T PL11008212 T PL 11008212T PL 2457728 T3 PL2457728 T3 PL 2457728T3
Authority
PL
Poland
Prior art keywords
shaped workpieces
laminating substantially
substantially board
board
laminating
Prior art date
Application number
PL11008212T
Other languages
English (en)
Inventor
Norbert Damm
Original Assignee
Buerkle Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Buerkle Gmbh Robert filed Critical Buerkle Gmbh Robert
Publication of PL2457728T3 publication Critical patent/PL2457728T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1009—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B32B2309/022—Temperature vs pressure profiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/04—Time
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/12—Photovoltaic modules
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Photovoltaic Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
PL11008212T 2010-11-30 2011-10-11 Sposób laminowania obrabianych przedmiotów zasadniczo w postaci płyty PL2457728T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010052780A DE102010052780A1 (de) 2010-11-30 2010-11-30 Verfahren zum Laminieren von im wesentlichen plattenförmigen Werkstücken
EP11008212.0A EP2457728B1 (de) 2010-11-30 2011-10-11 Verfahren zum Laminieren von im wesentlichen plattenförmigen Werkstücken

Publications (1)

Publication Number Publication Date
PL2457728T3 true PL2457728T3 (pl) 2013-10-31

Family

ID=44897591

Family Applications (1)

Application Number Title Priority Date Filing Date
PL11008212T PL2457728T3 (pl) 2010-11-30 2011-10-11 Sposób laminowania obrabianych przedmiotów zasadniczo w postaci płyty

Country Status (8)

Country Link
US (1) US9023163B2 (pl)
EP (1) EP2457728B1 (pl)
JP (1) JP5799778B2 (pl)
CN (1) CN102529288B (pl)
DE (1) DE102010052780A1 (pl)
ES (1) ES2426028T3 (pl)
PL (1) PL2457728T3 (pl)
TW (1) TWI469877B (pl)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2810004B1 (en) * 2012-02-01 2018-11-14 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US10690413B2 (en) 2012-02-01 2020-06-23 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US11713924B2 (en) 2012-02-01 2023-08-01 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US10876792B2 (en) 2012-02-01 2020-12-29 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US10240867B2 (en) 2012-02-01 2019-03-26 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US9513053B2 (en) 2013-03-14 2016-12-06 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US9644891B2 (en) 2012-02-01 2017-05-09 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US9970708B2 (en) 2012-02-01 2018-05-15 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
EP3034567B1 (de) 2014-12-19 2017-06-14 Evonik Degussa GmbH Covernetzersysteme für Verkapselungsfolien umfassend Ethylenglykoldi(meth)acrylatverbindungen
EP3034528B1 (de) 2014-12-19 2017-06-21 Evonik Degussa GmbH Covernetzersysteme für Verkapselungsfolien umfassend Harnstoffverbindungen
ES2632783T3 (es) 2014-12-19 2017-09-15 Evonik Degussa Gmbh Sistemas de redes de cubierta para láminas de encapsulación que comprenden compuestos de bis-(alquenilamidas)
EP3034568A1 (de) 2014-12-19 2016-06-22 Evonik Degussa GmbH Covernetzersysteme für Verkapselungsfolien umfassend Triallylisocyanurat und Triallylcyanurat
EP3034525A1 (de) 2014-12-19 2016-06-22 Evonik Degussa GmbH Covernetzersysteme für Verkapselungsfolien umfassend Pentaerythritolverbindungen
EP3034529B1 (de) 2014-12-19 2017-06-14 Evonik Degussa GmbH Covernetzersysteme für verkapselungsfolien umfassend (meth)acrylamidverbindungen
EP3034526B1 (de) 2014-12-19 2017-06-14 Evonik Degussa GmbH Covernetzersysteme für Verkapselungsfolien
EP3034530A1 (de) 2014-12-19 2016-06-22 Evonik Degussa GmbH Covernetzersysteme für Verkapselungsfolien umfassend Diene
EP3034531A1 (de) 2014-12-19 2016-06-22 Evonik Degussa GmbH Dispersion zum einfachen Einsatz in der Herstellung von Verkapselungsfolien
DE102015115453A1 (de) 2015-09-14 2017-03-16 Robert Bürkle GmbH Laminiervorrichtung zum Laminieren eines Schichtenstapels und Anlage zum Herstellen von Photovoltaikmodulen
CN107914453B (zh) * 2017-11-28 2020-09-04 信利光电股份有限公司 一种板材结构及其贴合方法和电子设备
DE102018101470A1 (de) 2018-01-23 2019-07-25 Robert Bürkle GmbH Laminiervorrichtung und Verfahren zum Laminieren wenigstens eines Schichtenstapels
CN111070852B (zh) * 2020-01-08 2021-09-03 中山市大自然格瑞新型材料有限公司 一种塑料板材真空覆膜装置
US12215925B2 (en) 2020-04-21 2025-02-04 Revive Electronics, LLC Methods and apparatuses for drying electronic devices

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4180426A (en) * 1969-02-17 1979-12-25 Saint-Gobain Industries Process and apparatus for making multiply sheets
FR2034169B1 (pl) * 1969-02-17 1974-02-22 Saint Gobain Pont A Mousson
IT1129885B (it) * 1979-11-27 1986-06-11 Bfg Glassgroup Procedimento per formare un laminato a piu strati
GB2119704B (en) * 1982-04-30 1985-09-11 Glaverbel Process of forming multi-ply laminates
JPH08500214A (ja) * 1993-06-11 1996-01-09 イソボルタ・エスターライヒツシエ・イゾリールシユトツフベルケ・アクチエンゲゼルシヤフト 光電池モジュールの製造方法及びこの方法を実施するための装置
US5698053A (en) * 1995-06-16 1997-12-16 Ppg Industries, Inc. Method of forming a glass and plastic laminate
JPH10273213A (ja) * 1997-03-28 1998-10-13 Shinko Electric Co Ltd ギヤ状部品の整列装置
DE19903171C2 (de) * 1999-01-27 2003-03-20 Saint Gobain Sekurit D Gmbh Verfahren und Vorrichtung zum Laminieren von Verbundscheiben
US8389850B2 (en) * 2008-03-12 2013-03-05 Kyocera Corporation Solar cell module and method of manufacturing the same
DE102008025790A1 (de) * 2008-05-29 2009-12-03 Robert Bürkle GmbH Presse und Verfahren zum Laminieren von im Wesentlichen plattenförmigen Werkstücken
DE102008030927A1 (de) * 2008-07-02 2009-10-22 Robert Bürkle GmbH Verfahren und Vorrichtung zum Laminieren von im Wesentlichen plattenförmigen Werkstücken unter Druck- und Wärmeeinwirkung
JP2010278147A (ja) * 2009-05-27 2010-12-09 Kyocera Corp 太陽電池モジュールの製造方法

Also Published As

Publication number Publication date
TWI469877B (zh) 2015-01-21
US9023163B2 (en) 2015-05-05
JP2012116190A (ja) 2012-06-21
ES2426028T3 (es) 2013-10-18
CN102529288B (zh) 2015-01-07
EP2457728B1 (de) 2013-07-31
TW201233555A (en) 2012-08-16
JP5799778B2 (ja) 2015-10-28
CN102529288A (zh) 2012-07-04
US20120132360A1 (en) 2012-05-31
DE102010052780A1 (de) 2012-05-31
EP2457728A1 (de) 2012-05-30

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