PH12020500005A1 - Resin film forming film and resin film forming composite sheet - Google Patents
Resin film forming film and resin film forming composite sheetInfo
- Publication number
- PH12020500005A1 PH12020500005A1 PH12020500005A PH12020500005A PH12020500005A1 PH 12020500005 A1 PH12020500005 A1 PH 12020500005A1 PH 12020500005 A PH12020500005 A PH 12020500005A PH 12020500005 A PH12020500005 A PH 12020500005A PH 12020500005 A1 PH12020500005 A1 PH 12020500005A1
- Authority
- PH
- Philippines
- Prior art keywords
- film forming
- resin film
- test specimen
- pcnt
- composite sheet
- Prior art date
Links
- 239000011347 resin Substances 0.000 title abstract 6
- 229920005989 resin Polymers 0.000 title abstract 6
- 239000002131 composite material Substances 0.000 title 1
- 101100243022 Mus musculus Pcnt gene Proteins 0.000 abstract 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 238000007654 immersion Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
Abstract
This resin film forming film satisfies the following conditions (i) and (ii): (i) when a first test specimen manufactured using a first laminated body which comprises a plurality of the resin film forming films laminated together and has a size of 50 mm x 50 mm and a thickness of 200 æm is immersed in pure water for two hours, the first test specimen has a water absorption of 0.55 pcnt or less; and (ii) when a second test specimen manufactured using a second laminated body in which the resin film forming film is attached to a silicon mirror wafer has been left in an environment of 23øC and 50 pcnt RH for 30 minutes, and when the second test specimen after the elapse of the time has been immersed in pure water for two hours, an adhesive force between the resin film forming films or a cured product thereof and the silicon mirror wafer measured before and after the immersion exhibits an adhesive force change rate of 60 pcnt or less.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017132980 | 2017-07-06 | ||
| PCT/JP2018/018248 WO2019008898A1 (en) | 2017-07-06 | 2018-05-11 | Resin film forming film and resin film forming composite sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| PH12020500005A1 true PH12020500005A1 (en) | 2021-01-11 |
| PH12020500005B1 PH12020500005B1 (en) | 2023-05-17 |
Family
ID=64950807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PH1/2020/500005A PH12020500005B1 (en) | 2017-07-06 | 2018-05-11 | Resin film forming film and resin film forming composite sheet |
Country Status (8)
| Country | Link |
|---|---|
| JP (1) | JP7044780B2 (en) |
| KR (1) | KR102507152B1 (en) |
| CN (1) | CN110831766B (en) |
| MY (1) | MY194458A (en) |
| PH (1) | PH12020500005B1 (en) |
| SG (1) | SG11201913224TA (en) |
| TW (1) | TWI743361B (en) |
| WO (1) | WO2019008898A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3936330A4 (en) | 2019-03-08 | 2022-05-04 | Teijin Limited | ORGANIC POLYMERS BASED ON POLYMERS, PROCESS FOR THEIR PRODUCTION AND POLYMER ELEMENT THEREFOR |
| WO2021029620A1 (en) * | 2019-08-09 | 2021-02-18 | 에스케이씨 주식회사 | Bonding film, and light-transmitting laminate including same |
| JP7471880B2 (en) * | 2020-03-18 | 2024-04-22 | リンテック株式会社 | Film-like adhesive and dicing die bonding sheet |
| JP7471879B2 (en) * | 2020-03-18 | 2024-04-22 | リンテック株式会社 | Film-like adhesive and dicing die bonding sheet |
| JP7387510B2 (en) * | 2020-03-26 | 2023-11-28 | リンテック株式会社 | Protective film-forming film, protective film-forming composite sheet, and method for transporting workpieces with protective film-forming film |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4331047B2 (en) * | 2004-04-28 | 2009-09-16 | 信越ポリマー株式会社 | Manufacturing method of electronic component holder |
| JP4732472B2 (en) | 2007-03-01 | 2011-07-27 | 日東電工株式会社 | Thermosetting die bond film |
| MY167509A (en) * | 2007-10-25 | 2018-09-04 | Kolon Inc | Film tyoe transfer material |
| JP5390209B2 (en) | 2009-02-04 | 2014-01-15 | 日東電工株式会社 | Thermosetting die bond film |
| JP4717156B1 (en) * | 2010-11-01 | 2011-07-06 | 協和界面科学株式会社 | Peel test device |
| WO2015046529A1 (en) * | 2013-09-30 | 2015-04-02 | リンテック株式会社 | Composite sheet for resin film formation |
| JP6600872B2 (en) * | 2014-01-08 | 2019-11-06 | リンテック株式会社 | Composite sheet for protective film formation |
| WO2017010385A1 (en) * | 2015-07-10 | 2017-01-19 | 日東電工株式会社 | Solar module, solar module manufacturing method, and solar cell wiring method |
-
2018
- 2018-05-11 MY MYPI2019007673A patent/MY194458A/en unknown
- 2018-05-11 JP JP2019528382A patent/JP7044780B2/en active Active
- 2018-05-11 KR KR1020197038836A patent/KR102507152B1/en active Active
- 2018-05-11 SG SG11201913224TA patent/SG11201913224TA/en unknown
- 2018-05-11 CN CN201880042700.3A patent/CN110831766B/en active Active
- 2018-05-11 PH PH1/2020/500005A patent/PH12020500005B1/en unknown
- 2018-05-11 WO PCT/JP2018/018248 patent/WO2019008898A1/en active Application Filing
- 2018-05-16 TW TW107116627A patent/TWI743361B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI743361B (en) | 2021-10-21 |
| TW201907491A (en) | 2019-02-16 |
| JP7044780B2 (en) | 2022-03-30 |
| MY194458A (en) | 2022-11-30 |
| PH12020500005B1 (en) | 2023-05-17 |
| WO2019008898A1 (en) | 2019-01-10 |
| KR20200026833A (en) | 2020-03-11 |
| KR102507152B1 (en) | 2023-03-07 |
| SG11201913224TA (en) | 2020-01-30 |
| CN110831766A (en) | 2020-02-21 |
| CN110831766B (en) | 2021-09-21 |
| JPWO2019008898A1 (en) | 2020-05-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| PH12020500005A1 (en) | Resin film forming film and resin film forming composite sheet | |
| PH12017501228B1 (en) | Film, method for its production, and method for producing semiconductor element using the film | |
| CN109154689B (en) | Polarizing film, polarizing film with adhesive layer, and image display device | |
| ATE494344T1 (en) | USE OF ADHESIVES IN REMOVABLE ADHESIVE STRIPS | |
| Simmons et al. | Formation of composite polyacrylamide and silicone substrates for independent control of stiffness and strain | |
| MY154860A (en) | Adhesive sheet for wafer bonding and method of processing a wafer by using the same | |
| BR112019002974A2 (en) | multimodal polyethylene thin film | |
| TW201613751A (en) | Polarizing plate | |
| TW201613157A (en) | Casing material for electricity storage device and electricity storage device including same | |
| MY178423A (en) | Pressure sensitive adhesive sheet and method of manufacturing processed device-related member | |
| EP3618102A3 (en) | Method for producing thin wafer | |
| WO2011025169A3 (en) | Method for manufacturing an acrylic film, and acrylic film | |
| MX2018010899A (en) | Face films and pressure sensitive laminates for printing. | |
| PH12020551536A1 (en) | Method for manufacturing electronic device | |
| SG11201806029XA (en) | Pressure-sensitive-adhesive-layer-attached one-side-protected polarizing film, image display device, and method for continuously producing same | |
| CL2019000742A1 (en) | Structure coating film, set of coating materials to form the coating film, coating material for a first layer and coating method. | |
| MY172228A (en) | Dicing sheet and method for manufacturing device chips | |
| SG10201804761PA (en) | Dicing tape-combined adhesive sheet | |
| PH12018500851B1 (en) | First protective film forming sheet | |
| MY181578A (en) | Pressure sensitive adhesive compositons | |
| JP2018016734A (en) | Optical film adhesive sheet | |
| PH12021552721A1 (en) | Adhesive film and method for manufacturing electronic device | |
| TWI704057B (en) | Method for producing laminated optical film | |
| NZ602297A (en) | Laminate film for attaching to a window | |
| ES2572971T3 (en) | Preparation of cementitious articles with a high surface finish for use in electrical devices |