NO874515L - Anordning for kjoeling av halvlederbyggeelementer. - Google Patents

Anordning for kjoeling av halvlederbyggeelementer.

Info

Publication number: NO874515L
Authority: NO; Norway
Prior art keywords: cavity; cooling; building elements; heat; cooling semiconductor
Prior art date: 1986-10-29

Application number

NO874515A

Other languages

English (en)

Other versions

NO874515D0 (no

Inventor

Xaver Vogel

Original Assignee

Bbc Brown Boveri & Cie

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1986-10-29

Filing date

1987-10-29

Publication date

1988-05-02

1987-10-29 Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie

1987-10-29 Publication of NO874515D0 publication Critical patent/NO874515D0/no

1988-05-02 Publication of NO874515L publication Critical patent/NO874515L/no

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Sustainable Development (AREA)
Mechanical Engineering (AREA)
General Engineering & Computer Science (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Life Sciences & Earth Sciences (AREA)
Thermal Sciences (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Cooling Or The Like Of Electrical Apparatus (AREA)
Crystals, And After-Treatments Of Crystals (AREA)
Executing Machine-Instructions (AREA)
Dairy Products (AREA)

NO874515A 1986-10-29 1987-10-29 Anordning for kjoeling av halvlederbyggeelementer. NO874515L (no)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
CH427986		1986-10-29

Publications (2)

Publication Number	Publication Date
NO874515D0 NO874515D0 (no)	1987-10-29
NO874515L true NO874515L (no)	1988-05-02

Family

ID=4273148

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
NO874515A NO874515L (no)	1986-10-29	1987-10-29	Anordning for kjoeling av halvlederbyggeelementer.

Country Status (9)

Country	Link
EP (1)	EP0268081B1 (no)
JP (1)	JPS63116452A (no)
AT (1)	ATE75074T1 (no)
DE (1)	DE3778304D1 (no)
ES (1)	ES2030692T3 (no)
FI (1)	FI874753A (no)
IN (1)	IN170337B (no)
NO (1)	NO874515L (no)
ZA (1)	ZA878041B (no)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
NO894328L (no) *	1989-10-30	1991-05-02	Dolphin Server Technology As	Fremgangsmaate og anordning for kjoeling av elektroniske komponenter.
GB2380057A (en) *	2001-09-19	2003-03-26	Thermosonic Technology Inc	Heat dissipation structure with cavity for improved heat transfer
JP4764073B2 (ja) *	2005-06-07	2011-08-31	キヤノン株式会社	シート供給装置及び記録装置
JP5880318B2 (ja) *	2012-07-04	2016-03-09	三菱電機株式会社	半導体装置
DE102016224232B4 (de)	2016-07-19	2024-03-21	Hanon Systems Efp Deutschland Gmbh	Leiterplattenvorrichtung
DE102018006806B4 (de)	2018-08-26	2023-01-19	Hochschule Mittweida (Fh)	Verwendung wenigstens eines Lasers zur Strukturierung mindestens eines Bereichs einer Oberfläche eines Substrats mit wenigstens einem mikroelektronischen Bauelement und/oder als Träger mikroelektronischer Einheiten
DE202018003992U1 (de)	2018-08-26	2018-09-13	Hochschule Mittweida (Fh)	Siedekühlbares Substrat mit wenigstens einem mikroelektronischen Bauelement und/oder als Träger mikroelektronischer Einheiten

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2886746A (en) *	1956-01-05	1959-05-12	Gen Electric	Evaporative cooling system for electrical devices
CH342661A (de) *	1956-08-11	1959-11-30	Bbc Brown Boveri & Cie	Kühler für die Kühlung eines Halbleiterelementes
US3852806A (en) *	1973-05-02	1974-12-03	Gen Electric	Nonwicked heat-pipe cooled power semiconductor device assembly having enhanced evaporated surface heat pipes
US4145708A (en) *	1977-06-13	1979-03-20	General Electric Company	Power module with isolated substrates cooled by integral heat-energy-removal means
JPS5936827B2 (ja) *	1979-01-12	1984-09-06	日本電信電話株式会社	集積回路素子の冷却装置
DE3302840C2 (de) *	1983-01-28	1985-06-27	Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt	Einrichtung zur Wärmeabführung von energieelektronischen Bauelementen

1987
- 1987-10-16 AT AT87115118T patent/ATE75074T1/de not_active IP Right Cessation
- 1987-10-16 DE DE8787115118T patent/DE3778304D1/de not_active Expired - Lifetime
- 1987-10-16 ES ES198787115118T patent/ES2030692T3/es not_active Expired - Lifetime
- 1987-10-16 EP EP87115118A patent/EP0268081B1/de not_active Expired - Lifetime
- 1987-10-23 IN IN768/MAS/87A patent/IN170337B/en unknown
- 1987-10-27 ZA ZA878041A patent/ZA878041B/xx unknown
- 1987-10-28 JP JP62272894A patent/JPS63116452A/ja active Pending
- 1987-10-28 FI FI874753A patent/FI874753A/fi not_active Application Discontinuation
- 1987-10-29 NO NO874515A patent/NO874515L/no unknown

Also Published As

Publication number	Publication date
ATE75074T1 (de)	1992-05-15
IN170337B (no)	1992-03-14
FI874753A0 (fi)	1987-10-28
DE3778304D1 (de)	1992-05-21
EP0268081A1 (de)	1988-05-25
NO874515D0 (no)	1987-10-29
ZA878041B (en)	1988-04-29
JPS63116452A (ja)	1988-05-20
FI874753A (fi)	1988-04-30
EP0268081B1 (de)	1992-04-15
ES2030692T3 (es)	1992-11-16

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