NO168753B - PROCEDURE FOR REDUCING THE FORMAL HYDRAULIC RELEASE FROM SPONES AND FIBER PLATES FINISHED WITH PROCESSING LAYERS. - Google Patents
PROCEDURE FOR REDUCING THE FORMAL HYDRAULIC RELEASE FROM SPONES AND FIBER PLATES FINISHED WITH PROCESSING LAYERS. Download PDFInfo
- Publication number
- NO168753B NO168753B NO852265A NO852265A NO168753B NO 168753 B NO168753 B NO 168753B NO 852265 A NO852265 A NO 852265A NO 852265 A NO852265 A NO 852265A NO 168753 B NO168753 B NO 168753B
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- Prior art keywords
- formaldehyde
- urea
- reducing
- release
- chipboard
- Prior art date
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- 238000000034 method Methods 0.000 title claims description 24
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 90
- 239000011093 chipboard Substances 0.000 claims description 27
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 21
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 18
- 239000004202 carbamide Substances 0.000 claims description 11
- 229920001807 Urea-formaldehyde Polymers 0.000 claims description 10
- 229910021529 ammonia Inorganic materials 0.000 claims description 9
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 claims description 8
- 239000001099 ammonium carbonate Substances 0.000 claims description 8
- 239000007864 aqueous solution Substances 0.000 claims description 8
- 239000011094 fiberboard Substances 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 7
- 235000012501 ammonium carbonate Nutrition 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229910000013 Ammonium bicarbonate Inorganic materials 0.000 claims description 2
- 235000012538 ammonium bicarbonate Nutrition 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 235000013877 carbamide Nutrition 0.000 claims 1
- 125000005442 diisocyanate group Chemical group 0.000 claims 1
- 239000011230 binding agent Substances 0.000 description 11
- 239000000126 substance Substances 0.000 description 7
- 229920003180 amino resin Polymers 0.000 description 4
- 239000002023 wood Substances 0.000 description 4
- 241000158728 Meliaceae Species 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 3
- 241000294754 Macroptilium atropurpureum Species 0.000 description 2
- GZCGUPFRVQAUEE-SLPGGIOYSA-N aldehydo-D-glucose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O GZCGUPFRVQAUEE-SLPGGIOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- -1 ammonium carbonate Chemical compound 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
- Inorganic Fibers (AREA)
Description
Oppfinnelsen gjelder fremgangsmåte for minsking av formaldehydavgivelsen fra spon- og fiberplater som er finért med foredlingssjikt, idet spon- eller fiberplatene tilhører emisjonsklasse El. The invention relates to a method for reducing the release of formaldehyde from chipboard and fiberboard that is veneered with a finishing layer, the chipboard or fiberboard belonging to emission class El.
Med tresponplater forstås plater av trespon, som eir varmpresset med et bindemiddel av kunstharpikslim. Egen-skapene til tresponplatene kan varieres sterkt ved stør-relse, form og anordning av sponene og mengden av kunst-harpiksandelen, som i almenhet ligger i området fra 5 til 10%. Tresponplatene kan besjiktes med dekorfilmer, grunn-ingsfilmer og finér, eksempelvis med verdifulle treslag. Chipboard means boards made of wood chips, which are hot-pressed with a synthetic resin glue binder. The properties of the chipboards can be greatly varied by the size, shape and arrangement of the chips and the amount of synthetic resin, which is generally in the range from 5 to 10%. The chipboards can be coated with decorative films, primer films and veneers, for example with valuable types of wood.
I Forbundsrepublikken Tyskland er forbruket av tresponplater steget meget sterkt i de siste årene. Mens produk-sjonen av tresponplater i 1969 lå ved 3,4 millioner kubikkmeter, steg den i 1971 til 4,3 millioner kubikkmeter og gikk allerede i 1980.opp til 6,2 millioner kubikkmeter. In the Federal Republic of Germany, the consumption of chipboard has risen very strongly in recent years. While the production of chipboard in 1969 was 3.4 million cubic metres, it rose in 1971 to 4.3 million cubic meters and already in 1980 went up to 6.2 million cubic metres.
Ureaharpikser eller aminoplaster er uten sammenligning Urea resins or aminoplasts are without comparison
de mest benyttede sponplatebindemidler. De utmerker seg ved gunstig pris og høy fasthet ved limingen.og muliggjør i tillegg meget korte pressetider. Ureaharpiksene har dog den store ulempe, at de under bruken av sponplatene avgir formaldehyd, som ikke bare har en utiltalende lukt, the most used chipboard binders. They are distinguished by their favorable price and high firmness when gluing, and also enable very short press times. However, the urea resins have the major disadvantage that during the use of the chipboards they emit formaldehyde, which not only has an unpleasant smell,
men også er sunnhetsbetenkelig. Derfor gjelder det bestemte innskrenkninger for anvendelse av ureaharpikser som bindemidler. but is also a health concern. Certain restrictions therefore apply to the use of urea resins as binders.
Det er idag allerede mulig, også ifølge andre fremgangs-måter, å fremstille aminoplastbundne tresponplater med en formaldehydavgivelse, målt etter perforatorfremgangsmåten (DIN EN 120, Bestemmelse av formaldehyd i sponplater, Perforatormetode, Beuth-Verlag, Berlin, Koln), på under 10 mg/100 g "atro" plate. Byggesponplater av denne emisjons-klassen (El) kan innsettes uinnskrenket i boligrom uten planker og uten skikt (sammenlign ETB-retningslinje 1980: Retningslinje for anvendelse av sponplater når det gjelder unngåelse av utillatte formaldehydkonsentrasjoner i rom-luften, avfattelse april 1980, Beuth-Verlag, Berlin, Koln). It is already possible today, also according to other methods, to produce aminoplast-bonded chipboards with a formaldehyde release, measured according to the perforator method (DIN EN 120, Determination of formaldehyde in chipboards, Perforator method, Beuth-Verlag, Berlin, Koln), of less than 10 mg /100 g "atro" disc. Building chipboards of this emission class (El) can be used without restriction in living spaces without planks and without layers (compare ETB guidelines 1980: Guidelines for the use of chipboards in terms of avoiding impermissible formaldehyde concentrations in the room air, version April 1980, Beuth-Verlag , Berlin, Cologne).
Isocyanater har hittil bare i lite omfang vært anvendt som bindemidler for sponplater. Spesielt difenylmethandi-isocyanat har imidlertid vist seg som et utmerket bindemiddel, med hvilket det kan fremstilles plater med høy hold-barhet. Prisen på disse produkter har imidlertid hittil forhindret en bredere anvendelse. Isocyanates have so far only been used to a small extent as binders for chipboard. However, diphenylmethane diisocyanate in particular has proven to be an excellent binder, with which boards with high durability can be produced. However, the price of these products has so far prevented a wider application.
I den offentliggjorte europeiske patentsøknad 0012169 beskrives det flersjiktige, overveiende aminoplastbundne spon- eller fiberplater, som i et indre område, fortrinnsvis i midtsjiktet, som bindemiddel oppviser et klebemiddel som ikke hører til gruppen av aminoplaster, for eksempel diisocyanatj og som er kjennetegnet ved at det for dette indre område bare anvendes slike bindemidler, hvis utherding ikke påvirkes av nærværet av ytterligere formaldehydreaktive stoffer, hvorved bindemidlet er tilblandet disse tilleggs-stoffene i form av ammoniakk, ammoniumcarbonat, urea, thio-urea, melamin eller dicyandiamid, som direkte reagerer av-bindende med det formaldehyd som ennu er tilstede eller blir fri etter pressing av platen under fuktighets- og/eller varmeinnvirkning, eventuelt også indirekte via spaltnings-produkter. In the published European patent application 0012169, the multi-layered, mainly aminoplast-bonded chipboard or fiberboard is described, which in an inner area, preferably in the middle layer, as binder exhibits an adhesive which does not belong to the group of aminoplasts, for example diisocyanatej and which is characterized by the fact that for this inner area, only such binders are used, the curing of which is not affected by the presence of additional formaldehyde-reactive substances, whereby the binder is mixed with these additional substances in the form of ammonia, ammonium carbonate, urea, thio-urea, melamine or dicyandiamide, which directly react by binding with the formaldehyde that is still present or becomes free after pressing the plate under the influence of moisture and/or heat, possibly also indirectly via decomposition products.
Den offentliggjorte europeiske patentsøknad 0 006 486 gjelder en fremgangsmåte for minsking av formaldehydavgivelse fra aminoplastbundne spon- eller fiberplater, ved hvilken det på overflaten av platene i varm tilstand umiddel-bart i kort tidsavstand etter deres uttak av varmpressen påføres urea eller andre stoffer som avspalter ammoniakk i form av en vandig løsning. The published European patent application 0 006 486 relates to a method for reducing formaldehyde release from aminoplast-bonded chipboard or fiber boards, in which urea or other substances that release ammonia are applied to the surface of the boards in a hot state, immediately after their removal from the hot press in the form of an aqueous solution.
Disse El-plater finéres imidlertid i tverrtreindustrien However, these El panels are veneered in the cross-timber industry
i mange tilfeller med foredlingssjikt, for eksempel med mahogni, eksempelvis for fremstilling av paneler. I tverrtreindustrien er det vanlig for finéring å anvende urea-formaldehyd-harpikser med høyt formaldehydinnhold (molforhold urea:formaldehyd 1:1,6 til 1:1,8) som bindemiddel mellom fineren og platen. Også ved påføring av plastover-flater i møbelbygging anvendes varmherdende, formaldehyd-rike urea-formaldehyd-harpikser. in many cases with a finishing layer, for example with mahogany, for example for the production of panels. In the cross-timber industry, it is common for veneering to use urea-formaldehyde resins with a high formaldehyde content (molar ratio urea:formaldehyde 1:1.6 to 1:1.8) as a binder between the veneer and the board. Thermosetting, formaldehyde-rich urea-formaldehyde resins are also used when applying plastic surfaces in furniture construction.
Ved anvendelse av disse bindemidler kan formaldehydavgivelsen fra de finérte henholdsvis på annen måte besjiktede' plater avhengig av besjiktningstype, treart, tykkelse, snittretning og fremstillingsbetingelser øke slik, at de lovfestede kravene ikke mer oppfylles. Også den formaldehydminskende virkning av avstengningen (f.eks. av finéren) går tapt og overdekkes fullstendig (sammenlign Marutzky, R., Mehlhorn, L. og Wenzel, W., 1981: "Empfehlungen zur Verwendung von Spanplatten im Mobelbau", foredrag, holdt i anledning av symposiet til Mobil Oil AG i Grainau 18. september 1981). Dette opptrer spesielt, når formatene til de finerte plater hhv. panelene er meget små (sammenlign ETB-retningslinjene). When using these binders, the release of formaldehyde from the veneered or otherwise coated boards, depending on the coating type, wood species, thickness, cut direction and manufacturing conditions, can increase so that the statutory requirements are no longer met. Also the formaldehyde-reducing effect of the closure (e.g. of the veneer) is lost and completely covered (compare Marutzky, R., Mehlhorn, L. and Wenzel, W., 1981: "Empfehlungen zur Verwendung von Spanplatten im Mobelbau", lecture, held on the occasion of the symposium of Mobil Oil AG in Grainau on 18 September 1981). This occurs in particular, when the formats of the veneered plates or the panels are very small (compare the ETB guidelines).
Det er således en oppgave for foreliggende oppfinnelse å tilveiebringe en fremgangsmåte for minsking av formaldehydavgivelsen fra spon- og fiberplater som er finért med foredlingssjikt, idet platene tilhører emisjonsklasse El og foredlingssjiktene er påført under anvendelse av urea-formaldehyd-harpikser med høyt formaldehydinnhold. It is thus a task for the present invention to provide a method for reducing the formaldehyde release from chipboard and fiber boards that are veneered with a finishing layer, the boards belonging to emission class El and the finishing layers are applied using urea-formaldehyde resins with a high formaldehyde content.
Den fremgangsmåte som er beskrevet i den ovenfor nevnte europeiske patentsøknad 79101728.8 egner seg ikke til løsning av denne oppgave, da foredlingssjiktene ble skadet og sterkt misfarvet ved påsprøyting av urea eller andre stoffer som avspalter ammoniakk i form av en vandig løsning på de allerede finerte plater. The method described in the above-mentioned European patent application 79101728.8 is not suitable for solving this task, as the finishing layers were damaged and strongly discolored by spraying urea or other substances that release ammonia in the form of an aqueous solution onto the already veneered plates.
Overraskende ble det nå funnet at den ovenfor nevnte oppgave kan løses ved en fremgangsmåte som angitt i forbin-delse med oppgaven, som er kjennetegnet ved at platene før finéring på i og for seg kjent måte behandles med vandige løsninger av urea og/eller andre forbindelser som avspalter ammoniakk, og at foredlingssjiktene deretter påføres på i og for seg kjent måte. Surprisingly, it was now found that the above-mentioned task can be solved by a method as indicated in connection with the task, which is characterized by the fact that the plates are treated in a known manner with aqueous solutions of urea and/or other compounds before veneering which splits off ammonia, and that the finishing layers are then applied in a manner known per se.
Platene som behandles ifølge oppfinnelsen, finéres fortrinnsvis med mahognitre. The boards treated according to the invention are preferably veneered with mahogany wood.
I fremgangsmåten ifølge oppfinnelsen anvendes som formaldehydreaktive stoffer urea og/eller andre forbindelser som avspalter ammoniakk, som for eksempel ammoniumcarbonat. Slike stoffer er beskrevet i den europeiske patentsøknad 79103902.7 (tilsvarende DE-PS 2829021). Ved fremgangsmåten ifølge oppfinnelsen skal ikke formaldehydav.givelsen fra rå-platene selv forminskes, da det ved fremgangsmåten ifølge oppfinnelsen anvendes plater av emisjonsklasse Ei, for hvis anvendelse det i bygningsbransjen ikke behøves noen ytterligere minsking av deres formaldehydemisjon. Ifølge oppfinnelsen er det mulig å finére plater, som knapt avgir formaldehyd, under anvendelse av urea-formaldehyd-harpikser, uten at den ferdig finérte plate avgir utillatte mengder av formaldehyd. Sponplaten fungerer som bærer for formaldehydfangeren. Ved den romlige adskillelsen mellom urea-formaldehyd-harpiksen og formaldehydfangeren foregår herdingen av harpiksen uforstyrret, mens det frie formaldehyd i platen oppfanger (sammenlign drøfting av teknikkens stand i DE-PS 2851589) . In the method according to the invention, urea and/or other compounds which split off ammonia, such as ammonium carbonate, are used as formaldehyde-reactive substances. Such substances are described in the European patent application 79103902.7 (corresponding to DE-PS 2829021). In the method according to the invention, the formaldehyde emission from the raw boards themselves shall not be reduced, as in the method according to the invention, boards of emission class Ei are used, for whose use in the construction industry no further reduction of their formaldehyde emission is required. According to the invention, it is possible to veneer boards, which hardly emit formaldehyde, using urea-formaldehyde resins, without the finished veneered board emitting impermissible amounts of formaldehyde. The chipboard acts as a carrier for the formaldehyde trap. Due to the spatial separation between the urea-formaldehyde resin and the formaldehyde trap, the curing of the resin takes place undisturbed, while the free formaldehyde in the plate is captured (compare discussion of the state of the art in DE-PS 2851589).
Ved finéringsprosessen vandrer det fritt foreliggende formaldehyd fra overflateneav platene inn i det indre av platene,hvor formaldehydfangeren befinner seg (sammenlign i dette henseende læren i DE-PS 2851589). Der reagerer det inndiffunderende formaldehyd med formaldehydfangerne. På denne måte kan formaldehydavgivelsen fra de finérte plater drastisk minskes. Ved fremgangsmåten ifølge oppfinnelsen anvendes vandige løsninger av urea og/eller andre forbindelser som avspalter ammoniakk. De vandige løsninger kan oppvise konsentrasjoner i området fra 5-60%, fortrinnsvis fra 30 til 50%. De fremstilles på enkel måte, ved at de tilsvarende forbindelser løses i vann. Som forbindelser som avspalter ammoniakk, kan det anvendes ammoniumcarbonat og ammoniumbicarbonat. Foretrukket anvendes urea i blanding med ammoniumcarbonat. During the veneering process, the free formaldehyde migrates from the surfaces of the plates into the interior of the plates, where the formaldehyde trap is located (compare in this regard the teaching in DE-PS 2851589). There, the diffusing formaldehyde reacts with the formaldehyde traps. In this way, the release of formaldehyde from the veneered panels can be drastically reduced. In the method according to the invention, aqueous solutions of urea and/or other compounds which split off ammonia are used. The aqueous solutions can exhibit concentrations in the range from 5-60%, preferably from 30 to 50%. They are produced in a simple way, by dissolving the corresponding compounds in water. As compounds which split off ammonia, ammonium carbonate and ammonium bicarbonate can be used. Preferably, urea is used in a mixture with ammonium carbonate.
Anvendelsesområdet for. foreliggende oppfinnelse er ikke begrenset til aminoplastharpiksbundne sponplater av emisjonsklasse El, men fremgangsmåten ifølge oppfinnelsen kan også anvendes med hell på isocyanatbundne sponplater og fenol-formaldehydharpiksbundne sponplater, som i og for seg knapt eller ikke avgir formaldehyd, men øker i formaldehydav-givelsespotensial ved finéring med aminoplastharpikser som bindemiddel. Også emisjonsfattige fiberplater kan behandles ifølge fremgangsmåten. The area of application for. the present invention is not limited to aminoplast resin-bonded chipboards of emission class El, but the method according to the invention can also be used successfully on isocyanate-bonded chipboards and phenol-formaldehyde resin-bonded chipboards, which in and of themselves hardly or do not release formaldehyde, but increase in formaldehyde release potential when veneered with aminoplast resins as binder. Low-emission fiber boards can also be treated according to the method.
Følgende eksempel forklarer oppfinnelsen. The following example explains the invention.
Eksempel Example
En sponplate av emisjonsklasse El [perforatorverdi 8,0 milligram (jodometrisk) hhv. 6,1 mg (fotometrisk)/100 g "atro" plate] ble bestrøket med 220 g/m'' av en 50%-ig urea-formaldehyd - harpiksløsning (molforhold 1:1,6) og deretter besjiktet med en finer (mahogni, tykkelse 0,6 mm). A chipboard of emission class El [perforator value 8.0 milligrams (iodometric) or 6.1 mg (photometric)/100 g "atro" plate] was coated with 220 g/m'' of a 50% urea-formaldehyde resin solution (molar ratio 1:1.6) and then coated with a veneer ( mahogany, thickness 0.6 mm).
Som sammenligning ble den samme plate før finéringen under de samme betingelser besprøytet med en 30%-ig urea-løsning i en mengde på 100 g/m o og deretter finert som beskrevet. As a comparison, the same plate was sprayed under the same conditions before veneering with a 30% urea solution in an amount of 100 g/m o and then veneered as described.
I den følgende tabell gjengis formaldehydavgivelses-mengdene fra de finérte sponplater etter WKI-metoden (Roffael, E., 1975: Messung der Formaldehydabgabe. Praxis-nahe Methode zur Ermittlung der Formaldehydabgabe harnstoff-harzgebundener Spanplatten flir das Bauwesen. Holz-Zentral-blatt 101, sider 1403 til 1404). Formaldehydavgivelses-mengdene fra den ufinérte plate angis også. Fra angivelsene i tabellen fremgår det tydelig, at det inntrer en betydelig minsking av formaldehydavgivelsen ved behandlingen av sponplatene med formaldehydreaktive stoffer sammenlignet med de ubehandlede plater. Denne minsking ligger etter en prøve-varighet på 144 timer i WKI-testen på over 30%. Formalde-hydavgivelsesmengdene ble ikke bestemt etter perforatormetoden på finérte sponplater, da perforatormetoden ikke er anvendbar på besjiktede eller på annen måte overflatebe-handlede plater etter ETB- retningslinjen. The following table shows the amounts of formaldehyde released from the veneered chipboards according to the WKI method (Roffael, E., 1975: Messung der Formaldehydeabgabe. Praxis-nahe Methode zur Ermittlung der Formaldehydeabgabe harnstoff-harzgebundener Spanplatten flir das Bauwesen. Holz-Zentral-blatt 101 , pages 1403 to 1404). The formaldehyde emission amounts from the unveneered board are also indicated. From the information in the table, it is clear that there is a significant reduction in the release of formaldehyde when the chipboards are treated with formaldehyde-reactive substances compared to the untreated boards. This reduction is after a trial duration of 144 hours in the WKI test of over 30%. The formaldehyde release amounts were not determined using the perforator method on veneered chipboards, as the perforator method is not applicable to coated or otherwise surface-treated boards according to the ETB guideline.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NO852265A NO168753C (en) | 1985-06-05 | 1985-06-05 | PROCEDURE FOR REDUCING THE FORMAL HYDRAULIC RELEASE FROM SPONES AND FIBER PLATES FINISHED WITH PROCESSING LAYERS. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NO852265A NO168753C (en) | 1985-06-05 | 1985-06-05 | PROCEDURE FOR REDUCING THE FORMAL HYDRAULIC RELEASE FROM SPONES AND FIBER PLATES FINISHED WITH PROCESSING LAYERS. |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NO852265L NO852265L (en) | 1986-12-08 |
| NO168753B true NO168753B (en) | 1991-12-23 |
| NO168753C NO168753C (en) | 1992-04-01 |
Family
ID=19888322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO852265A NO168753C (en) | 1985-06-05 | 1985-06-05 | PROCEDURE FOR REDUCING THE FORMAL HYDRAULIC RELEASE FROM SPONES AND FIBER PLATES FINISHED WITH PROCESSING LAYERS. |
Country Status (1)
| Country | Link |
|---|---|
| NO (1) | NO168753C (en) |
-
1985
- 1985-06-05 NO NO852265A patent/NO168753C/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| NO852265L (en) | 1986-12-08 |
| NO168753C (en) | 1992-04-01 |
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