NL7412121A - Geheugenhalfgeleiderinrichting van het draad- vormige type alsmede werkwijze voor het ver- vaardigen van deze inrichting. - Google Patents
Geheugenhalfgeleiderinrichting van het draad- vormige type alsmede werkwijze voor het ver- vaardigen van deze inrichting.Info
- Publication number
- NL7412121A NL7412121A NL7412121A NL7412121A NL7412121A NL 7412121 A NL7412121 A NL 7412121A NL 7412121 A NL7412121 A NL 7412121A NL 7412121 A NL7412121 A NL 7412121A NL 7412121 A NL7412121 A NL 7412121A
- Authority
- NL
- Netherlands
- Prior art keywords
- wire
- manufacturing
- memory semiconductor
- shaped type
- semiconductor device
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5614—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using conductive bridging RAM [CBRAM] or programming metallization cells [PMC]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5678—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using amorphous/crystalline phase transition storage elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0004—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0009—RRAM elements whose operation depends upon chemical change
- G11C13/0011—RRAM elements whose operation depends upon chemical change comprising conductive bridging RAM [CBRAM] or programming metallization cells [PMCs]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/20—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/165—Tunnel injectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/041—Modification of switching materials after formation, e.g. doping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/24—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies
- H10N70/245—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies the species being metal cations, e.g. programmable metallization cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8828—Tellurides, e.g. GeSbTe
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/10—Resistive cells; Technology aspects
- G11C2213/15—Current-voltage curve
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Computer Hardware Design (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Semiconductor Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US396497A US3886577A (en) | 1973-09-12 | 1973-09-12 | Filament-type memory semiconductor device and method of making the same |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7412121A true NL7412121A (nl) | 1975-03-14 |
Family
ID=23567428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7412121A NL7412121A (nl) | 1973-09-12 | 1974-09-12 | Geheugenhalfgeleiderinrichting van het draad- vormige type alsmede werkwijze voor het ver- vaardigen van deze inrichting. |
Country Status (8)
Country | Link |
---|---|
US (1) | US3886577A (nl) |
JP (1) | JPS5758786B2 (nl) |
CA (1) | CA1041211A (nl) |
DE (1) | DE2443178C2 (nl) |
FR (1) | FR2243526B1 (nl) |
GB (2) | GB1480401A (nl) |
IT (1) | IT1021283B (nl) |
NL (1) | NL7412121A (nl) |
Families Citing this family (99)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4115872A (en) * | 1977-05-31 | 1978-09-19 | Burroughs Corporation | Amorphous semiconductor memory device for employment in an electrically alterable read-only memory |
US4180866A (en) * | 1977-08-01 | 1979-12-25 | Burroughs Corporation | Single transistor memory cell employing an amorphous semiconductor threshold device |
US4177475A (en) * | 1977-10-31 | 1979-12-04 | Burroughs Corporation | High temperature amorphous memory device for an electrically alterable read-only memory |
US4203123A (en) * | 1977-12-12 | 1980-05-13 | Burroughs Corporation | Thin film memory device employing amorphous semiconductor materials |
US4225946A (en) * | 1979-01-24 | 1980-09-30 | Harris Corporation | Multilevel erase pulse for amorphous memory devices |
US4228524A (en) * | 1979-01-24 | 1980-10-14 | Harris Corporation | Multilevel sequence of erase pulses for amorphous memory devices |
US4350994A (en) * | 1979-10-04 | 1982-09-21 | Wisconsin Alumni Research Foundation | Semiconductor device having an amorphous metal layer contact |
US4494136A (en) * | 1979-10-04 | 1985-01-15 | Wisconsin Alumni Research Foundation | Semiconductor device having an amorphous metal layer contact |
JPS5713777A (en) | 1980-06-30 | 1982-01-23 | Shunpei Yamazaki | Semiconductor device and manufacture thereof |
FR2478879A1 (fr) * | 1980-03-24 | 1981-09-25 | Commissariat Energie Atomique | Procede de realisation de dispositifs a effet memoire a semi-conducteurs amorphes |
US5262350A (en) * | 1980-06-30 | 1993-11-16 | Semiconductor Energy Laboratory Co., Ltd. | Forming a non single crystal semiconductor layer by using an electric current |
USRE34658E (en) * | 1980-06-30 | 1994-07-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device of non-single crystal-structure |
US5859443A (en) * | 1980-06-30 | 1999-01-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US6900463B1 (en) | 1980-06-30 | 2005-05-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
WO1982000794A1 (en) * | 1980-08-28 | 1982-03-18 | Alumni Res Found Wisconsin | Use of metallic glasses for fabrication of structures with submicron dimensions |
EP0095283A3 (en) * | 1982-05-15 | 1984-12-27 | The British Petroleum Company p.l.c. | Memory device |
US4677742A (en) * | 1983-01-18 | 1987-07-07 | Energy Conversion Devices, Inc. | Electronic matrix arrays and method for making the same |
US4700465A (en) * | 1984-01-27 | 1987-10-20 | Zoran Corporation | Method of selectively making contact structures both with barrier metal and without barrier metal in a single process flow |
US4906987A (en) * | 1985-10-29 | 1990-03-06 | Ohio Associated Enterprises, Inc. | Printed circuit board system and method |
JPH084124B2 (ja) * | 1986-05-14 | 1996-01-17 | レイセオン カンパニ− | メモリ・セル |
US4809044A (en) * | 1986-08-22 | 1989-02-28 | Energy Conversion Devices, Inc. | Thin film overvoltage protection devices |
US4845533A (en) * | 1986-08-22 | 1989-07-04 | Energy Conversion Devices, Inc. | Thin film electrical devices with amorphous carbon electrodes and method of making same |
US6420725B1 (en) | 1995-06-07 | 2002-07-16 | Micron Technology, Inc. | Method and apparatus for forming an integrated circuit electrode having a reduced contact area |
US5879955A (en) * | 1995-06-07 | 1999-03-09 | Micron Technology, Inc. | Method for fabricating an array of ultra-small pores for chalcogenide memory cells |
US6653733B1 (en) | 1996-02-23 | 2003-11-25 | Micron Technology, Inc. | Conductors in semiconductor devices |
US5761115A (en) * | 1996-05-30 | 1998-06-02 | Axon Technologies Corporation | Programmable metallization cell structure and method of making same |
US6337266B1 (en) * | 1996-07-22 | 2002-01-08 | Micron Technology, Inc. | Small electrode for chalcogenide memories |
US5998244A (en) * | 1996-08-22 | 1999-12-07 | Micron Technology, Inc. | Memory cell incorporating a chalcogenide element and method of making same |
US6015977A (en) | 1997-01-28 | 2000-01-18 | Micron Technology, Inc. | Integrated circuit memory cell having a small active area and method of forming same |
US5952671A (en) * | 1997-05-09 | 1999-09-14 | Micron Technology, Inc. | Small electrode for a chalcogenide switching device and method for fabricating same |
CN1260734C (zh) | 1997-12-04 | 2006-06-21 | 爱克逊技术有限公司 | 可编程子表面集聚金属化器件及其制造方法 |
US6487106B1 (en) | 1999-01-12 | 2002-11-26 | Arizona Board Of Regents | Programmable microelectronic devices and method of forming and programming same |
US7385219B2 (en) * | 2000-02-11 | 2008-06-10 | A{umlaut over (x)}on Technologies Corporation | Optimized solid electrolyte for programmable metallization cell devices and structures |
US8218350B2 (en) * | 2000-02-11 | 2012-07-10 | Axon Technologies Corporation | Programmable metallization cell structure including an integrated diode, device including the structure, and method of forming same |
US6888750B2 (en) * | 2000-04-28 | 2005-05-03 | Matrix Semiconductor, Inc. | Nonvolatile memory on SOI and compound semiconductor substrates and method of fabrication |
US6563156B2 (en) * | 2001-03-15 | 2003-05-13 | Micron Technology, Inc. | Memory elements and methods for making same |
EP2988331B1 (en) | 2000-08-14 | 2019-01-09 | SanDisk Technologies LLC | Semiconductor memory device |
US6580124B1 (en) | 2000-08-14 | 2003-06-17 | Matrix Semiconductor Inc. | Multigate semiconductor device with vertical channel current and method of fabrication |
US6897514B2 (en) * | 2001-03-28 | 2005-05-24 | Matrix Semiconductor, Inc. | Two mask floating gate EEPROM and method of making |
US6473332B1 (en) | 2001-04-04 | 2002-10-29 | The University Of Houston System | Electrically variable multi-state resistance computing |
US6593624B2 (en) | 2001-09-25 | 2003-07-15 | Matrix Semiconductor, Inc. | Thin film transistors with vertically offset drain regions |
US6841813B2 (en) * | 2001-08-13 | 2005-01-11 | Matrix Semiconductor, Inc. | TFT mask ROM and method for making same |
US6709958B2 (en) * | 2001-08-30 | 2004-03-23 | Micron Technology, Inc. | Integrated circuit device and fabrication using metal-doped chalcogenide materials |
US6879525B2 (en) * | 2001-10-31 | 2005-04-12 | Hewlett-Packard Development Company, L.P. | Feedback write method for programmable memory |
US6853049B2 (en) | 2002-03-13 | 2005-02-08 | Matrix Semiconductor, Inc. | Silicide-silicon oxide-semiconductor antifuse device and method of making |
US6737675B2 (en) | 2002-06-27 | 2004-05-18 | Matrix Semiconductor, Inc. | High density 3D rail stack arrays |
US6970375B2 (en) * | 2002-08-02 | 2005-11-29 | Unity Semiconductor Corporation | Providing a reference voltage to a cross point memory array |
US7009235B2 (en) * | 2003-11-10 | 2006-03-07 | Unity Semiconductor Corporation | Conductive memory stack with non-uniform width |
US7158397B2 (en) * | 2002-08-02 | 2007-01-02 | Unity Semiconductor Corporation | Line drivers that fits within a specified line pitch |
US7020006B2 (en) * | 2002-08-02 | 2006-03-28 | Unity Semiconductor Corporation | Discharge of conductive array lines in fast memory |
US6917539B2 (en) * | 2002-08-02 | 2005-07-12 | Unity Semiconductor Corporation | High-density NVRAM |
US6859382B2 (en) * | 2002-08-02 | 2005-02-22 | Unity Semiconductor Corporation | Memory array of a non-volatile ram |
US7326979B2 (en) * | 2002-08-02 | 2008-02-05 | Unity Semiconductor Corporation | Resistive memory device with a treated interface |
US6753561B1 (en) | 2002-08-02 | 2004-06-22 | Unity Semiconductor Corporation | Cross point memory array using multiple thin films |
US6906939B2 (en) * | 2002-08-02 | 2005-06-14 | Unity Semiconductor Corporation | Re-writable memory with multiple memory layers |
US7057914B2 (en) * | 2002-08-02 | 2006-06-06 | Unity Semiconductor Corporation | Cross point memory array with fast access time |
US6831854B2 (en) * | 2002-08-02 | 2004-12-14 | Unity Semiconductor Corporation | Cross point memory array using distinct voltages |
US7309616B2 (en) * | 2003-03-13 | 2007-12-18 | Unity Semiconductor Corporation | Laser annealing of complex metal oxides (CMO) memory materials for non-volatile memory integrated circuits |
TWI245288B (en) * | 2003-03-20 | 2005-12-11 | Sony Corp | Semiconductor memory element and semiconductor memory device using the same |
US7106120B1 (en) | 2003-07-22 | 2006-09-12 | Sharp Laboratories Of America, Inc. | PCMO resistor trimmer |
US7099179B2 (en) * | 2003-12-22 | 2006-08-29 | Unity Semiconductor Corporation | Conductive memory array having page mode and burst mode write capability |
US20060171200A1 (en) | 2004-02-06 | 2006-08-03 | Unity Semiconductor Corporation | Memory using mixed valence conductive oxides |
US7538338B2 (en) * | 2004-09-03 | 2009-05-26 | Unity Semiconductor Corporation | Memory using variable tunnel barrier widths |
US7082052B2 (en) | 2004-02-06 | 2006-07-25 | Unity Semiconductor Corporation | Multi-resistive state element with reactive metal |
US6972985B2 (en) * | 2004-05-03 | 2005-12-06 | Unity Semiconductor Corporation | Memory element having islands |
US7330370B2 (en) * | 2004-07-20 | 2008-02-12 | Unity Semiconductor Corporation | Enhanced functionality in a two-terminal memory array |
US7075817B2 (en) | 2004-07-20 | 2006-07-11 | Unity Semiconductor Corporation | Two terminal memory array having reference cells |
US7084691B2 (en) * | 2004-07-21 | 2006-08-01 | Sharp Laboratories Of America, Inc. | Mono-polarity switchable PCMO resistor trimmer |
US7464621B2 (en) * | 2004-11-09 | 2008-12-16 | Steeda Autosports, Inc. | Longitudinally displaced shifter |
EP1677371A1 (en) | 2004-12-30 | 2006-07-05 | STMicroelectronics S.r.l. | Dual resistance heater for phase change devices and manufacturing method thereof |
US7701834B2 (en) * | 2005-01-18 | 2010-04-20 | Unity Semiconductor Corporation | Movable terminal in a two terminal memory array |
US20070032409A1 (en) * | 2005-01-26 | 2007-02-08 | Vanderbilt University | Bradykinin receptor antagonists and uses thereof |
DE102005004434A1 (de) * | 2005-01-31 | 2006-08-10 | Infineon Technologies Ag | Verfahren und Vorrichtung zur Ansteuerung von Festkörper-Elektrolytzellen |
TWI431761B (zh) * | 2005-02-10 | 2014-03-21 | Renesas Electronics Corp | 半導體積體電路裝置 |
US20130082232A1 (en) | 2011-09-30 | 2013-04-04 | Unity Semiconductor Corporation | Multi Layered Conductive Metal Oxide Structures And Methods For Facilitating Enhanced Performance Characteristics Of Two Terminal Memory Cells |
EP2249351B1 (en) * | 2005-06-03 | 2013-05-01 | STMicroelectronics Srl | Method for multilevel programming of phase change memory cells using a percolation algorithm |
US8106375B2 (en) * | 2005-11-30 | 2012-01-31 | The Trustees Of The University Of Pennsylvania | Resistance-switching memory based on semiconductor composition of perovskite conductor doped perovskite insulator |
US7666526B2 (en) * | 2005-11-30 | 2010-02-23 | The Trustees Of The University Of Pennsylvania | Non-volatile resistance-switching oxide thin film devices |
US7522468B2 (en) * | 2006-06-08 | 2009-04-21 | Unity Semiconductor Corporation | Serial memory interface |
US7747817B2 (en) * | 2006-06-28 | 2010-06-29 | Unity Semiconductor Corporation | Performing data operations using non-volatile third dimension memory |
US7619945B2 (en) * | 2006-08-18 | 2009-11-17 | Unity Semiconductor Corporation | Memory power management |
US20080073751A1 (en) * | 2006-09-21 | 2008-03-27 | Rainer Bruchhaus | Memory cell and method of manufacturing thereof |
US7539811B2 (en) | 2006-10-05 | 2009-05-26 | Unity Semiconductor Corporation | Scaleable memory systems using third dimension memory |
US7379364B2 (en) * | 2006-10-19 | 2008-05-27 | Unity Semiconductor Corporation | Sensing a signal in a two-terminal memory array having leakage current |
US7372753B1 (en) * | 2006-10-19 | 2008-05-13 | Unity Semiconductor Corporation | Two-cycle sensing in a two-terminal memory array having leakage current |
US7765380B2 (en) * | 2007-01-19 | 2010-07-27 | Unity Semiconductor Corporation | Fast data access through page manipulation |
JP2008211049A (ja) * | 2007-02-27 | 2008-09-11 | Toshiba Corp | 半導体記憶装置及びその製造方法 |
US7978507B2 (en) * | 2008-06-27 | 2011-07-12 | Sandisk 3D, Llc | Pulse reset for non-volatile storage |
US9425393B2 (en) | 2008-12-19 | 2016-08-23 | The Trustees Of The University Of Pennsylvania | Non-volatile resistance-switching thin film devices |
US9236118B2 (en) | 2008-12-19 | 2016-01-12 | The Trustees Of The University Of Pennsylvania | Non-volatile resistance-switching thin film devices |
DE102009000027A1 (de) * | 2009-01-05 | 2010-07-08 | Robert Bosch Gmbh | Verfahren zur Herstellung von feinen Strukturen in Dickschichten mittels Diffusion |
US10224481B2 (en) | 2014-10-07 | 2019-03-05 | The Trustees Of The University Of Pennsylvania | Mechanical forming of resistive memory devices |
US9627395B2 (en) | 2015-02-11 | 2017-04-18 | Sandisk Technologies Llc | Enhanced channel mobility three-dimensional memory structure and method of making thereof |
US9478495B1 (en) | 2015-10-26 | 2016-10-25 | Sandisk Technologies Llc | Three dimensional memory device containing aluminum source contact via structure and method of making thereof |
US10374009B1 (en) | 2018-07-17 | 2019-08-06 | Macronix International Co., Ltd. | Te-free AsSeGe chalcogenides for selector devices and memory devices using same |
US11289540B2 (en) | 2019-10-15 | 2022-03-29 | Macronix International Co., Ltd. | Semiconductor device and memory cell |
US11158787B2 (en) | 2019-12-17 | 2021-10-26 | Macronix International Co., Ltd. | C—As—Se—Ge ovonic materials for selector devices and memory devices using same |
US11362276B2 (en) | 2020-03-27 | 2022-06-14 | Macronix International Co., Ltd. | High thermal stability SiOx doped GeSbTe materials suitable for embedded PCM application |
US11410722B2 (en) * | 2020-10-21 | 2022-08-09 | Samsung Electronics Co., Ltd. | Phase-change memory device for improving resistance drift and dynamic resistance drift compensation method of the same |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3271591A (en) * | 1963-09-20 | 1966-09-06 | Energy Conversion Devices Inc | Symmetrical current controlling device |
DE1231824B (de) * | 1964-07-04 | 1967-01-05 | Danfoss As | Kontaktanordnung fuer ein elektronisches Festkoerperschaltelement und Verfahren zu seiner Herstellung |
US3436624A (en) * | 1965-06-01 | 1969-04-01 | Ericsson Telefon Ab L M | Semiconductor bi-directional component |
US3480843A (en) * | 1967-04-18 | 1969-11-25 | Gen Electric | Thin-film storage diode with tellurium counterelectrode |
US3699543A (en) * | 1968-11-04 | 1972-10-17 | Energy Conversion Devices Inc | Combination film deposited switch unit and integrated circuits |
-
1973
- 1973-09-12 US US396497A patent/US3886577A/en not_active Expired - Lifetime
-
1974
- 1974-08-30 GB GB38047/74A patent/GB1480401A/en not_active Expired
- 1974-08-30 GB GB6903/77A patent/GB1480402A/en not_active Expired
- 1974-09-10 DE DE2443178A patent/DE2443178C2/de not_active Expired
- 1974-09-11 FR FR7430789A patent/FR2243526B1/fr not_active Expired
- 1974-09-11 CA CA208,923A patent/CA1041211A/en not_active Expired
- 1974-09-11 IT IT27175/74A patent/IT1021283B/it active
- 1974-09-12 JP JP49105445A patent/JPS5758786B2/ja not_active Expired
- 1974-09-12 NL NL7412121A patent/NL7412121A/nl not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
DE2443178C2 (de) | 1984-12-06 |
US3886577A (en) | 1975-05-27 |
IT1021283B (it) | 1978-01-30 |
CA1041211A (en) | 1978-10-24 |
FR2243526A1 (nl) | 1975-04-04 |
DE2443178A1 (de) | 1975-03-13 |
FR2243526B1 (nl) | 1979-02-02 |
JPS5065177A (nl) | 1975-06-02 |
JPS5758786B2 (nl) | 1982-12-11 |
GB1480402A (en) | 1977-07-20 |
GB1480401A (en) | 1977-07-20 |
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