NL7411645A - ETCHING LIQUID FOR ALUMINUM. - Google Patents
ETCHING LIQUID FOR ALUMINUM.Info
- Publication number
- NL7411645A NL7411645A NL7411645A NL7411645A NL7411645A NL 7411645 A NL7411645 A NL 7411645A NL 7411645 A NL7411645 A NL 7411645A NL 7411645 A NL7411645 A NL 7411645A NL 7411645 A NL7411645 A NL 7411645A
- Authority
- NL
- Netherlands
- Prior art keywords
- aluminum
- etching liquid
- etching
- liquid
- Prior art date
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title 1
- 229910052782 aluminium Inorganic materials 0.000 title 1
- 238000005530 etching Methods 0.000 title 1
- 239000007788 liquid Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/36—Alkaline compositions for etching aluminium or alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Priority Applications (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7411645A NL7411645A (en) | 1974-09-03 | 1974-09-03 | ETCHING LIQUID FOR ALUMINUM. |
DE19752537154 DE2537154A1 (en) | 1974-09-03 | 1975-08-21 | CORROSIVE LIQUID FOR ALUMINUM. |
GB35733/75A GB1499037A (en) | 1974-09-03 | 1975-08-29 | Etchant suitable for etching aluminium |
CA234,469A CA1055823A (en) | 1974-09-03 | 1975-08-29 | Etching liquid for etching aluminium |
IT26749/75A IT1042185B (en) | 1974-09-03 | 1975-08-29 | ATTACK LIQUID FOR THE CHEMICAL ALUMINUM ATTACK |
JP50105568A JPS5150834A (en) | 1974-09-03 | 1975-08-30 | |
BE159656A BE832966A (en) | 1974-09-03 | 1975-09-01 | PICKLING LIQUID FOR ALUMINUM |
AT672375A AT336974B (en) | 1974-09-03 | 1975-09-01 | RESET LIQUID FOR ALUMINUM |
SE7509691A SE7509691L (en) | 1974-09-03 | 1975-09-01 | ENGAGING SWEET FOR ENGAGING ALUMINUM |
CH1127575A CH616708A5 (en) | 1974-09-03 | 1975-09-01 | Etching fluid for aluminium or aluminium alloys. |
FR7526841A FR2283943A1 (en) | 1974-09-03 | 1975-09-02 | PICKLING LIQUID FOR ALUMINUM |
US05/792,641 US4097394A (en) | 1974-09-03 | 1977-05-02 | Etching liquid for etching aluminum |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7411645A NL7411645A (en) | 1974-09-03 | 1974-09-03 | ETCHING LIQUID FOR ALUMINUM. |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7411645A true NL7411645A (en) | 1976-03-05 |
Family
ID=19822017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7411645A NL7411645A (en) | 1974-09-03 | 1974-09-03 | ETCHING LIQUID FOR ALUMINUM. |
Country Status (11)
Country | Link |
---|---|
JP (1) | JPS5150834A (en) |
AT (1) | AT336974B (en) |
BE (1) | BE832966A (en) |
CA (1) | CA1055823A (en) |
CH (1) | CH616708A5 (en) |
DE (1) | DE2537154A1 (en) |
FR (1) | FR2283943A1 (en) |
GB (1) | GB1499037A (en) |
IT (1) | IT1042185B (en) |
NL (1) | NL7411645A (en) |
SE (1) | SE7509691L (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3047588C2 (en) * | 1980-12-17 | 1984-07-12 | Siemens AG, 1000 Berlin und 8000 München | Etching liquid for vapor deposition layers and processes for etching thin-film structures |
US4425183A (en) * | 1983-08-08 | 1984-01-10 | Ncr Corporation | Metal bevel process for multi-level metal semiconductor applications |
-
1974
- 1974-09-03 NL NL7411645A patent/NL7411645A/en not_active Application Discontinuation
-
1975
- 1975-08-21 DE DE19752537154 patent/DE2537154A1/en not_active Withdrawn
- 1975-08-29 CA CA234,469A patent/CA1055823A/en not_active Expired
- 1975-08-29 IT IT26749/75A patent/IT1042185B/en active
- 1975-08-29 GB GB35733/75A patent/GB1499037A/en not_active Expired
- 1975-08-30 JP JP50105568A patent/JPS5150834A/ja active Pending
- 1975-09-01 AT AT672375A patent/AT336974B/en active
- 1975-09-01 CH CH1127575A patent/CH616708A5/en not_active IP Right Cessation
- 1975-09-01 BE BE159656A patent/BE832966A/en unknown
- 1975-09-01 SE SE7509691A patent/SE7509691L/en not_active Application Discontinuation
- 1975-09-02 FR FR7526841A patent/FR2283943A1/en active Granted
Also Published As
Publication number | Publication date |
---|---|
AT336974B (en) | 1977-06-10 |
JPS5150834A (en) | 1976-05-04 |
BE832966A (en) | 1976-03-01 |
GB1499037A (en) | 1978-01-25 |
FR2283943A1 (en) | 1976-04-02 |
IT1042185B (en) | 1980-01-30 |
CA1055823A (en) | 1979-06-05 |
SE7509691L (en) | 1976-03-04 |
FR2283943B1 (en) | 1980-09-12 |
CH616708A5 (en) | 1980-04-15 |
ATA672375A (en) | 1976-09-15 |
DE2537154A1 (en) | 1976-03-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
BV | The patent application has lapsed |