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NL7411645A - ETCHING LIQUID FOR ALUMINUM. - Google Patents

ETCHING LIQUID FOR ALUMINUM.

Info

Publication number
NL7411645A
NL7411645A NL7411645A NL7411645A NL7411645A NL 7411645 A NL7411645 A NL 7411645A NL 7411645 A NL7411645 A NL 7411645A NL 7411645 A NL7411645 A NL 7411645A NL 7411645 A NL7411645 A NL 7411645A
Authority
NL
Netherlands
Prior art keywords
aluminum
etching liquid
etching
liquid
Prior art date
Application number
NL7411645A
Other languages
Dutch (nl)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL7411645A priority Critical patent/NL7411645A/en
Priority to DE19752537154 priority patent/DE2537154A1/en
Priority to GB35733/75A priority patent/GB1499037A/en
Priority to CA234,469A priority patent/CA1055823A/en
Priority to IT26749/75A priority patent/IT1042185B/en
Priority to JP50105568A priority patent/JPS5150834A/ja
Priority to BE159656A priority patent/BE832966A/en
Priority to AT672375A priority patent/AT336974B/en
Priority to SE7509691A priority patent/SE7509691L/en
Priority to CH1127575A priority patent/CH616708A5/en
Priority to FR7526841A priority patent/FR2283943A1/en
Publication of NL7411645A publication Critical patent/NL7411645A/en
Priority to US05/792,641 priority patent/US4097394A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321After treatment
    • H01L21/3213Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32134Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/10Etching compositions
    • C23F1/14Aqueous compositions
    • C23F1/32Alkaline compositions
    • C23F1/36Alkaline compositions for etching aluminium or alloys thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
NL7411645A 1974-09-03 1974-09-03 ETCHING LIQUID FOR ALUMINUM. NL7411645A (en)

Priority Applications (12)

Application Number Priority Date Filing Date Title
NL7411645A NL7411645A (en) 1974-09-03 1974-09-03 ETCHING LIQUID FOR ALUMINUM.
DE19752537154 DE2537154A1 (en) 1974-09-03 1975-08-21 CORROSIVE LIQUID FOR ALUMINUM.
GB35733/75A GB1499037A (en) 1974-09-03 1975-08-29 Etchant suitable for etching aluminium
CA234,469A CA1055823A (en) 1974-09-03 1975-08-29 Etching liquid for etching aluminium
IT26749/75A IT1042185B (en) 1974-09-03 1975-08-29 ATTACK LIQUID FOR THE CHEMICAL ALUMINUM ATTACK
JP50105568A JPS5150834A (en) 1974-09-03 1975-08-30
BE159656A BE832966A (en) 1974-09-03 1975-09-01 PICKLING LIQUID FOR ALUMINUM
AT672375A AT336974B (en) 1974-09-03 1975-09-01 RESET LIQUID FOR ALUMINUM
SE7509691A SE7509691L (en) 1974-09-03 1975-09-01 ENGAGING SWEET FOR ENGAGING ALUMINUM
CH1127575A CH616708A5 (en) 1974-09-03 1975-09-01 Etching fluid for aluminium or aluminium alloys.
FR7526841A FR2283943A1 (en) 1974-09-03 1975-09-02 PICKLING LIQUID FOR ALUMINUM
US05/792,641 US4097394A (en) 1974-09-03 1977-05-02 Etching liquid for etching aluminum

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7411645A NL7411645A (en) 1974-09-03 1974-09-03 ETCHING LIQUID FOR ALUMINUM.

Publications (1)

Publication Number Publication Date
NL7411645A true NL7411645A (en) 1976-03-05

Family

ID=19822017

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7411645A NL7411645A (en) 1974-09-03 1974-09-03 ETCHING LIQUID FOR ALUMINUM.

Country Status (11)

Country Link
JP (1) JPS5150834A (en)
AT (1) AT336974B (en)
BE (1) BE832966A (en)
CA (1) CA1055823A (en)
CH (1) CH616708A5 (en)
DE (1) DE2537154A1 (en)
FR (1) FR2283943A1 (en)
GB (1) GB1499037A (en)
IT (1) IT1042185B (en)
NL (1) NL7411645A (en)
SE (1) SE7509691L (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3047588C2 (en) * 1980-12-17 1984-07-12 Siemens AG, 1000 Berlin und 8000 München Etching liquid for vapor deposition layers and processes for etching thin-film structures
US4425183A (en) * 1983-08-08 1984-01-10 Ncr Corporation Metal bevel process for multi-level metal semiconductor applications

Also Published As

Publication number Publication date
AT336974B (en) 1977-06-10
JPS5150834A (en) 1976-05-04
BE832966A (en) 1976-03-01
GB1499037A (en) 1978-01-25
FR2283943A1 (en) 1976-04-02
IT1042185B (en) 1980-01-30
CA1055823A (en) 1979-06-05
SE7509691L (en) 1976-03-04
FR2283943B1 (en) 1980-09-12
CH616708A5 (en) 1980-04-15
ATA672375A (en) 1976-09-15
DE2537154A1 (en) 1976-03-18

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Legal Events

Date Code Title Description
BV The patent application has lapsed