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NL6415060A - - Google Patents

Info

Publication number
NL6415060A
NL6415060A NL6415060A NL6415060A NL6415060A NL 6415060 A NL6415060 A NL 6415060A NL 6415060 A NL6415060 A NL 6415060A NL 6415060 A NL6415060 A NL 6415060A NL 6415060 A NL6415060 A NL 6415060A
Authority
NL
Netherlands
Prior art keywords
semi
conductors
conductor
dec
hard material
Prior art date
Application number
NL6415060A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL6415060A priority Critical patent/NL6415060A/xx
Priority to GB54585/65A priority patent/GB1066210A/en
Priority to BE674219D priority patent/BE674219A/xx
Priority to DE19651514078 priority patent/DE1514078B2/en
Publication of NL6415060A publication Critical patent/NL6415060A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

1,066,210. Semi-conductor devices. INTERNATIONAL STANDARD ELECTRIC CORPORATION. Dec. 23, 1965 [Dec. 24, 1964], No. 54585/65. Heading H1K. In a semi-conductor device comprising a semiconductor element 3 held between two conductors 1, 2, an arrangement comprising two discs 4, 5 or 6, 7 of a malleable material with an interposed disc 8 or 9 of a hard material is placed between each of the conductors 1, 2 and the semi-conductor element 3. The inserted arrangements ensure that the pressure applied by the conductors is uniformly spread over the area of the element. The semi-conductor element may be a silicon rectifier, the malleable material may be tin and the hard material may be molybdenum.
NL6415060A 1964-12-24 1964-12-24 NL6415060A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
NL6415060A NL6415060A (en) 1964-12-24 1964-12-24
GB54585/65A GB1066210A (en) 1964-12-24 1965-12-23 Electrical semi-conductor device
BE674219D BE674219A (en) 1964-12-24 1965-12-23
DE19651514078 DE1514078B2 (en) 1964-12-24 1965-12-23 ELECTRIC SEMICONDUCTOR COMPONENT

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6415060A NL6415060A (en) 1964-12-24 1964-12-24

Publications (1)

Publication Number Publication Date
NL6415060A true NL6415060A (en) 1966-06-27

Family

ID=19791727

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6415060A NL6415060A (en) 1964-12-24 1964-12-24

Country Status (4)

Country Link
BE (1) BE674219A (en)
DE (1) DE1514078B2 (en)
GB (1) GB1066210A (en)
NL (1) NL6415060A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3446780A1 (en) * 1984-12-21 1986-07-03 Brown, Boveri & Cie Ag, 6800 Mannheim METHOD AND JOINING MATERIAL FOR METALLICALLY CONNECTING COMPONENTS

Also Published As

Publication number Publication date
BE674219A (en) 1966-06-23
DE1514078B2 (en) 1972-12-14
GB1066210A (en) 1967-04-19
DE1514078A1 (en) 1969-07-31

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