NL6406528A - - Google Patents
Info
- Publication number
- NL6406528A NL6406528A NL6406528A NL6406528A NL6406528A NL 6406528 A NL6406528 A NL 6406528A NL 6406528 A NL6406528 A NL 6406528A NL 6406528 A NL6406528 A NL 6406528A NL 6406528 A NL6406528 A NL 6406528A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
- H01J5/32—Seals for leading-in conductors
- H01J5/40—End-disc seals, e.g. flat header
- H01J5/42—End-disc seals, e.g. flat header using intermediate part
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C29/00—Joining metals with the aid of glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/26—Lead-in insulators; Lead-through insulators
- H01B17/30—Sealing
- H01B17/303—Sealing of leads to lead-through insulators
- H01B17/306—Sealing of leads to lead-through insulators by embedding in material other than glass or ceramics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2893/00—Discharge tubes and lamps
- H01J2893/0033—Vacuum connection techniques applicable to discharge tubes and lamps
- H01J2893/0034—Lamp bases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US287045A US3234320A (en) | 1963-06-11 | 1963-06-11 | Integrated circuit package |
Publications (1)
Publication Number | Publication Date |
---|---|
NL6406528A true NL6406528A (xx) | 1964-12-14 |
Family
ID=23101238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL6406528A NL6406528A (xx) | 1963-06-11 | 1964-06-09 |
Country Status (3)
Country | Link |
---|---|
US (1) | US3234320A (xx) |
GB (1) | GB1038007A (xx) |
NL (1) | NL6406528A (xx) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3311791A (en) * | 1964-08-04 | 1967-03-28 | Sprague Electric Co | Micromodule |
US3423638A (en) * | 1964-09-02 | 1969-01-21 | Gti Corp | Micromodular package with compression means holding contacts engaged |
US3388301A (en) * | 1964-12-09 | 1968-06-11 | Signetics Corp | Multichip integrated circuit assembly with interconnection structure |
US3351816A (en) * | 1965-02-04 | 1967-11-07 | Bunker Ramo | Planar coaxial circuitry |
US3465284A (en) * | 1965-05-05 | 1969-09-02 | Physical Sciences Corp | Multipin connector |
US3390308A (en) * | 1966-03-31 | 1968-06-25 | Itt | Multiple chip integrated circuit assembly |
US3405324A (en) * | 1967-02-15 | 1968-10-08 | Itt | Ultracompact modular structure for low cost mounting and interconnection of electronic components |
US3436606A (en) * | 1967-04-03 | 1969-04-01 | Texas Instruments Inc | Packaged multilead semiconductor device with improved jumper connection |
JPS495597B1 (xx) * | 1969-10-17 | 1974-02-07 | ||
US3628483A (en) * | 1970-03-20 | 1971-12-21 | Amp Inc | Method of making power frame for integrated circuit |
US3721868A (en) * | 1971-11-15 | 1973-03-20 | Gen Electric | Semiconductor device with novel lead attachments |
US4644096A (en) * | 1985-03-18 | 1987-02-17 | Alpha Industries, Inc. | Surface mounting package |
US5122621A (en) * | 1990-05-07 | 1992-06-16 | Synergy Microwave Corporation | Universal surface mount package |
US5160810A (en) * | 1990-05-07 | 1992-11-03 | Synergy Microwave Corporation | Universal surface mount package |
JP3488038B2 (ja) * | 1996-10-17 | 2004-01-19 | 矢崎総業株式会社 | リレーの実装構造 |
DE102008007346A1 (de) * | 2008-02-04 | 2009-08-06 | Robert Bosch Gmbh | Metallisches Gehäuseteil und Verfahren zur Herstellung des Gehäuseteiles |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2194703A (en) * | 1938-12-20 | 1940-03-26 | Bell Telephone Labor Inc | Sealing of condensers and similar apparatus |
US2503429A (en) * | 1944-09-26 | 1950-04-11 | Bell Telephone Labor Inc | Metallic casing for electrical units |
US2498585A (en) * | 1945-01-01 | 1950-02-21 | Thomas C Flanagan | Piezoelectric crystal holder |
US2788474A (en) * | 1953-09-10 | 1957-04-09 | Westinghouse Electric Corp | Rectifier assembly |
BE563189A (xx) * | 1956-06-08 | |||
US2930904A (en) * | 1956-12-31 | 1960-03-29 | Minnesota Mining & Mfg | Temperature modifying means for semiconductor device |
US3100813A (en) * | 1959-01-12 | 1963-08-13 | Sprague Electric Co | Capacitor sealing means |
BE637603A (xx) * | 1962-09-21 |
-
1963
- 1963-06-11 US US287045A patent/US3234320A/en not_active Expired - Lifetime
-
1964
- 1964-05-26 GB GB21762/64A patent/GB1038007A/en not_active Expired
- 1964-06-09 NL NL6406528A patent/NL6406528A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
GB1038007A (en) | 1966-08-03 |
US3234320A (en) | 1966-02-08 |