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NL6406528A - - Google Patents

Info

Publication number
NL6406528A
NL6406528A NL6406528A NL6406528A NL6406528A NL 6406528 A NL6406528 A NL 6406528A NL 6406528 A NL6406528 A NL 6406528A NL 6406528 A NL6406528 A NL 6406528A NL 6406528 A NL6406528 A NL 6406528A
Authority
NL
Netherlands
Application number
NL6406528A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6406528A publication Critical patent/NL6406528A/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/32Seals for leading-in conductors
    • H01J5/40End-disc seals, e.g. flat header
    • H01J5/42End-disc seals, e.g. flat header using intermediate part
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C29/00Joining metals with the aid of glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00Insulators or insulating bodies characterised by their form
    • H01B17/26Lead-in insulators; Lead-through insulators
    • H01B17/30Sealing
    • H01B17/303Sealing of leads to lead-through insulators
    • H01B17/306Sealing of leads to lead-through insulators by embedding in material other than glass or ceramics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00Discharge tubes and lamps
    • H01J2893/0033Vacuum connection techniques applicable to discharge tubes and lamps
    • H01J2893/0034Lamp bases
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
NL6406528A 1963-06-11 1964-06-09 NL6406528A (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US287045A US3234320A (en) 1963-06-11 1963-06-11 Integrated circuit package

Publications (1)

Publication Number Publication Date
NL6406528A true NL6406528A (xx) 1964-12-14

Family

ID=23101238

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6406528A NL6406528A (xx) 1963-06-11 1964-06-09

Country Status (3)

Country Link
US (1) US3234320A (xx)
GB (1) GB1038007A (xx)
NL (1) NL6406528A (xx)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3311791A (en) * 1964-08-04 1967-03-28 Sprague Electric Co Micromodule
US3423638A (en) * 1964-09-02 1969-01-21 Gti Corp Micromodular package with compression means holding contacts engaged
US3388301A (en) * 1964-12-09 1968-06-11 Signetics Corp Multichip integrated circuit assembly with interconnection structure
US3351816A (en) * 1965-02-04 1967-11-07 Bunker Ramo Planar coaxial circuitry
US3465284A (en) * 1965-05-05 1969-09-02 Physical Sciences Corp Multipin connector
US3390308A (en) * 1966-03-31 1968-06-25 Itt Multiple chip integrated circuit assembly
US3405324A (en) * 1967-02-15 1968-10-08 Itt Ultracompact modular structure for low cost mounting and interconnection of electronic components
US3436606A (en) * 1967-04-03 1969-04-01 Texas Instruments Inc Packaged multilead semiconductor device with improved jumper connection
JPS495597B1 (xx) * 1969-10-17 1974-02-07
US3628483A (en) * 1970-03-20 1971-12-21 Amp Inc Method of making power frame for integrated circuit
US3721868A (en) * 1971-11-15 1973-03-20 Gen Electric Semiconductor device with novel lead attachments
US4644096A (en) * 1985-03-18 1987-02-17 Alpha Industries, Inc. Surface mounting package
US5122621A (en) * 1990-05-07 1992-06-16 Synergy Microwave Corporation Universal surface mount package
US5160810A (en) * 1990-05-07 1992-11-03 Synergy Microwave Corporation Universal surface mount package
JP3488038B2 (ja) * 1996-10-17 2004-01-19 矢崎総業株式会社 リレーの実装構造
DE102008007346A1 (de) * 2008-02-04 2009-08-06 Robert Bosch Gmbh Metallisches Gehäuseteil und Verfahren zur Herstellung des Gehäuseteiles

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2194703A (en) * 1938-12-20 1940-03-26 Bell Telephone Labor Inc Sealing of condensers and similar apparatus
US2503429A (en) * 1944-09-26 1950-04-11 Bell Telephone Labor Inc Metallic casing for electrical units
US2498585A (en) * 1945-01-01 1950-02-21 Thomas C Flanagan Piezoelectric crystal holder
US2788474A (en) * 1953-09-10 1957-04-09 Westinghouse Electric Corp Rectifier assembly
BE563189A (xx) * 1956-06-08
US2930904A (en) * 1956-12-31 1960-03-29 Minnesota Mining & Mfg Temperature modifying means for semiconductor device
US3100813A (en) * 1959-01-12 1963-08-13 Sprague Electric Co Capacitor sealing means
BE637603A (xx) * 1962-09-21

Also Published As

Publication number Publication date
GB1038007A (en) 1966-08-03
US3234320A (en) 1966-02-08

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