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NL2022241B1 - Laser chip package - Google Patents

Laser chip package Download PDF

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Publication number
NL2022241B1
NL2022241B1 NL2022241A NL2022241A NL2022241B1 NL 2022241 B1 NL2022241 B1 NL 2022241B1 NL 2022241 A NL2022241 A NL 2022241A NL 2022241 A NL2022241 A NL 2022241A NL 2022241 B1 NL2022241 B1 NL 2022241B1
Authority
NL
Netherlands
Prior art keywords
laser chip
package
optical plate
laser
chip package
Prior art date
Application number
NL2022241A
Other languages
Dutch (nl)
Inventor
Josephus Van Dommelen Ignatius
Original Assignee
Sencio B V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sencio B V filed Critical Sencio B V
Priority to NL2022241A priority Critical patent/NL2022241B1/en
Application granted granted Critical
Publication of NL2022241B1 publication Critical patent/NL2022241B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/0231—Stems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/0232—Lead-frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H01S5/02234—Resin-filled housings; the housings being made of resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

A laser chip package (1) and a method of manufacturing such a laser chip package (1). A lead frame (2) is present having a die support (3) and connection elements (4), as well as a laser chip (5) having one or more side emitting laser diodes (6). Wire bonds (7) connect pads (8) on the laser chip (5) to one of the connection elements (4). An optical plate (9) is positioned on the die support (3), the optical plate (9) having a first side face (9a) positioned adjacent to a side emitter face (5a) of the laser chip (5). An overmoulding package (10) surrounds the lead frame (2), laser chip (5), wire bonds (7) and optical plate (9), and a side surface (1 Oa) ofthe overmoulding package (10) is aligned with a second side face (9b) ofthe optical plate (9) opposite to the first side face (9a).

Description

P6081146NL 1 Laser chip package Field of the invention The present invention relates to a laser chip package comprising a lead frame having a die support and a plurality of connection elements, a laser chip attached to the die support, the laser chip having one or more side emitting laser diodes, and a plurality of wire bonds, each of the wire bonds connecting a pad on the laser chip to a predetermined one of the plurality of connection elements. In a further aspect, the present invention relates to a method for manufacturing a laser chip package, comprising providing a lead frame having a die support and a plurality of connection elements, attaching a laser chip to the die support, and wire bonding a pad on the laser chip to a predetermined one of the plurality of connection elements.
Background art International patent publication WO2016/179229 discloses a multi-emitter diode laser package wherein a plurality of laser diode chips are packaged closely in a row. Each laser diode chip is attached to two sub-mounts which are attached to a cooling carrier, allowing laser radiation to be directed perpendicular to a top surface of the carrier. Embodiments are disclosed wherein one, two or more laser assemblies are mounted on a common carrier, and mirrors and an optical combiner are used to couple emitted radiation into an optical fiber. Summary of the invention The present invention seeks to provide an integrated package solution for multiple side emitting laser sources in a single integrated circuit package.
According to the present invention, a laser chip package as defined above is provided, in which an optical plate is positioned on the die support, the optical plate having a first side face positioned adjacent to a side emitter face of the laser chip. Furthermore, the laser chip package comprises an overmoulding package surrounding (encapsulating) the lead frame, laser chip, wire bonds and optical plate, wherein a side surface of the overmoulding package is aligned with a second side face of the optical plate opposite to the first side face. This allows to provide a (single) laser chip package including one or more side emitting laser diodes with a properly defined side window (second side face of the optical plate) allowing emission of all generated radiation external to the laser chip package.
In a further aspect, a method as defined above is provided, further comprising positioning an optical plate on the die support, the optical plate having a first side face which is positioned adjacent to a side emitter face of the laser chip, and providing an overmoulding package surrounding the lead frame, laser chip, wire bonds and optical plate, and aligning a side surface of the overmoulding package with a second side face of the optical plate opposite to the first side face. This method provides a very cost efficient manner of manufacturing a laser chip package with side
P6081146NL 2 emission window, as mostly process steps are used which are regularly used in integrated circuit manufacturing. Short description of drawings The present invention will be discussed in more detail below, with reference to the attached drawings, in which Fig. 1 shows a perspective view of a partly assembled laser chip package according to an embodiment of the invention; Fig. 2 shows a perspective view of a further partly assembled laser chip package according to an embodiment of the invention; Fig. 3 shows a perspective view of an assembled laser chip package according to an embodiment of the invention; and Fig. 4 shows a cross sectional view of the assembled laser chip package shown in Fig. 3.
Description of embodiments The present invention embodiments in a first aspect relate to a laser chip package 1 having one or more side emitting laser diodes 6. The present invention laser chip package 1 can conveniently be used as a component in a variety of devices, and can be manufactured economically.
Fig. 1 and 2 shows a perspective view of a partly, and a further partly assembled laser chip package 1 according to an embodiment of the invention. The laser chip package 1 comprises a lead frame 2 having a die support 3 and a plurality of connection elements 4. It is noted that the die support 3 and the plurality of connection elements 4 are positioned in the same plane of the lead frame 2. The lead frame 2 can be any type of lead frame regularly used in integrated circuit packaging, e.g. made from a heat conducting material. As shown, a laser chip 5 is attached to the die support 3, and the laser chip 5 has one or more side emitting laser diodes 6, three laser diodes 6 shown in this exemplary embodiment. In the example shown, the die support 3 has a surface larger than the laser chip 5 surface, allowing efficient cooling of the laser chip 5. The laser diodes 6 emit radiation in an angle originating from a side emitter face 5a of the laser chip 5. As shown in Fig. 1, a plurality of wire bonds 7 are present, each of the wire bonds 7 connecting a pad 8 on the laser chip 5 to a predetermined one of the plurality of connection elements 4.
According to the present invention embodiments, an optical plate 9 is positioned on the die support 3 as shown in the perspective view of Fig. 2. The optical plate 9 has a first side face 9a positioned adjacent to the side emitter face 5a of the laser chip 5, thus providing a radiation pathway for radiation emitted from the laser diodes 6 towards a second side face 9b of the optical plate 9. Note that the first side face 9a may snugly engage, e.g. contact, the side emitter face 5a, thereby leaving no discernible gap between the first side face 9a and the side emitter face 5a for keeping reflections between the optical plate 9 and the laser chip 5 to a minimum.
To form the laser chip package 1 (see Fig. 3) an overmoulding package 10 is present 40 surrounding (i.e. encapsulating) the lead frame 2, laser chip 5, wire bonds 7 and optical plate 9. A
P6081146NL 3 side surface 104 of the overmoulding package 10 is aligned (flush) with the second side face 9b of the optical plate 9 opposite to the first side face 9a.
The laser chip package 1 is e.g. moulded in a QFN panel, the second side face 9b (glass lid) will then be exposed after sawing the QFN panel into individual packages.
As shown in the perspective view of Fig.3, the external surfaces of the laser chip package 1 thus comprise the second side face 9b of the optical plate 9 in the side surface 10a of the overmoulding package 10. On a second side of the overmoulding package 10 a part of the die support 3 is visible (which is also present on a bottom side of the overmoulding package 10). Not shown in the perspective view of Fig. 3 is the side of the overmoulding package 10 opposite to the side surface 104 and the underside of overmoulding package 10, where the plurality of connection elements 4 are present. In an embodiment, the second side face 9b of the optical plate 9 may protrude beyond the side surface 10a. In yet another embodiment the second side face 9b may be recessed with respect to the side surface 10a.
Fig. 4 shows a cross sectional view of an embodiment of the laser chip package 1, wherein the various components discussed above are also visible. In a further embodiment of the present invention, the optical plate 9 has a thickness substantially equal to a thickness of the laser chip 5. This allows proper alignment of the optical plate 9 with the laser chip 5, or more precisely alignment of the first side face 9a with the laser diodes 6 emitting from the side emitter face 5a of the laser chip 5. as a result, proper transmission of the radiation from the laser diodes 6 to the second side face 9b of the optical plate 9, and from there to the external environment of the laser chip package
1.
In a further embodiment, the optical plate 9 is a glass plate 9. A glass plate will allow precise manufacturing of this component, and has the proper optical characteristics associated with the radiation emitted by the side emitting laser diodes 6, such as transmission wavelength range. As an alternative, other optically transparent materials may be used to provide the optical plate 9, e.g. optically transparent plastic such as PMMA.
In order to provide a proper optical waveguide for radiation emitted during operation by the side emitting laser diodes 6, the optical plate 9 comprises a material having a refractive index between 1.1 and 1.6, e.g. about 1.5 (refractive index of borosilicate glass). In dependence of dimensions, wavelength of the radiation emitted, and further characteristics of the laser diodes 6, a proper waveguide is then provided for obtaining a good transmission of the radiation external to the laser chip package 1.
In a further embodiment, the optical plate 9 is attached to the laser chip 5 (and to the lead frame 2/ die support 3) by an optically transparent adhesive. This allows a proper (optical) matching between the side emitter surface 5a and the first side face 9a, and can prevent any unwanted inclusion of air, or optical material-air interfaces (which might cause unwanted reflections).
In an exemplary embodiment, the one or more side emitting laser diodes 6 have a radiation angle of more than 10 degrees, e.g. more than 20 degrees (as measured perpendicular to the side emitting surface 5a). It is noted that the radiation angle can be determined by selecting a proper 40 thickness of the optical plate 9. In combination with the optical plate 9 this allows to transmit a large
P6081146NL 4 as possible part of the radiation from the laser diodes 6 to the second side face 9b of the optical plate 9 (i.e. the side of laser chip package 1).
In accordance with the examples shown in Fig. 1-4, and described above in relation to the various embodiments, the laser chip package 1 can be implemented as a quad flat no-leads (QFN) package. This provides a very cost-effective laser chip package 1 which can be applied in a wide variety of applications, e.g. in (automotive) LIDAR applications. . In alternative embodiments, the lead frame 2 and overmoulding package 10 can be adapted to provide different types of chip packages.
A further aspect of the present invention relates to a method for manufacturing a laser chip package 1, e.g. a laser chip package 1 as described in any one of the exemplary embodiments above. The method in a first embodiment comprises providing a lead frame 2 having a die support 3 and a plurality of connection elements 4, attaching a laser chip 5 to the die support 3, and wire bonding a pad 8 on the laser chip 5 to a predetermined one of the plurality of connection elements
4. Furthermore, the method comprises positioning an optical plate 9 on the die support 3, the optical plate 9 having a first side face 9a which is positioned adjacent to a side emitter face 5a of the laser chip 5, and providing an overmoulding package 10 surrounding the lead frame 2, laser chip 5, wire bonds 7 and optical plate 8, and aligning a side surface 10a of the overmoulding package 10 with a second side face 9b of the optical plate 9 opposite to the first side face 9a. This method allows to provide a laser chip package 1 with a side facing optical window (second side face 9b of the optical plate 9) in a very cost-effective manner, using regular integrated circuit manufacturing techniques.
In an exemplary embodiment, a space between the first side face 9a and the side emitter face 5a is filled with a transparent material, before applying the overmoulding package 10. This may be implemented by dispensing a transparent material (e.g. a glue or gel material) to prevent moulding compound to creep in during moulding.
In a further embodiment, the method further comprises attaching the optical plate 9 to the laser chip 5 using an optically transparent adhesive. The optical plate 9 may also be attached to the lead frame 2 (die support 3) using the same optically transparent adhesive, allowing to position and attach the optical plate 9 in a single step. Alternatively, the optical plate 9 is attached to the lead frame 2 using a different adhesive.
The method may further comprise forming sides of the overmoulding package 10 by cutting. This allows precise manufacturing of side surfaces of the laser chip package 1, which is especially advantageous for the side surface 10a of the overmoulding package 10 which includes the second side surface 9b, as it allows to also add suitable optical processing of the second side surface 9b (e.g. optical polishing). This embodiment is also compatible with the quad flat no-leads (QFN) integrated circuit packages as discussed above. Note that the second side surface 9b may be obtained by a precise cutting operation through the overmoulding package 10, but is also obtainable by cutting through the combination of overmoulding package 10 and optical plate 9.
The embodiments of the present invention which have been described above with reference to the exemplary embodiments as shown in Fig. 1-4, can also be described by the following 40 numbered and interdependent embodiments:
P6081146NL Embodiment 1. A laser chip package (1) comprising a lead frame (2) having a die support (3) and a plurality of connection elements (4), a laser chip (5) attached to the die support (3), the laser chip (5) having one or more side emitting laser diodes (6), 5 a plurality of wire bonds (7), each of the wire bonds (7) connecting a pad (8) on the laser chip (5) to a predetermined one of the plurality of connection elements (4), an optical plate (9) positioned on the die support (3), the optical plate (9) having a first side face (9a) positioned adjacent to a side emitter face (5a) of the laser chip (5), an overmoulding package (10) surrounding the lead frame (2), laser chip (5), wire bonds (7) and optical plate (9), wherein a side surface (10a) of the overmoulding package (10) is aligned with a second side face (9b) of the optical plate (9) opposite to the first side face (9a). Embodiment 2. The laser chip package (1) according to embodiment 1, wherein the optical plate (9) has a thickness substantially equal to a thickness of the laser chip (5).
Embodiment 3. The laser chip package (1) according to embodiment 1 or 2, wherein the optical plate (9) is a glass plate (9).
Embodiment 4. The laser chip package (1) according to any one of embodiments 1-3, wherein the optical plate (8) comprises a material having a refractive index between 1.1 and 1.6. Embodiment 5. The laser chip package (1) according to any one of embodiments 1-4, wherein the optical plate (9) is attached to the laser chip (5) by an optically transparent adhesive.
Embodiment 6. The laser chip package (1) according to any one of embodiments 1-5, wherein the one or more side emitting laser diodes (6) have a radiation angle of more than 10 degrees, e.g. more than 20 degrees.
Embodiment 7. The laser chip package (1) according to any one of embodiments 1-6, wherein the laser chip package (1) is a quad flat no-leads (QFN) package.
Embodiment 8. Method for manufacturing a laser chip package (1), comprising providing a lead frame (2) having a die support (3) and a plurality of connection elements 4), attaching a laser chip (5) to the die support (3), wire bonding a pad (8) on the laser chip (5) to a predetermined one of the plurality of connection elements (4), positioning an optical plate (9) on the die support (3), the optical plate (9) having a first side face (9a) which is positioned adjacent to a side emitter face (5a) of the laser chip (5), providing an overmoulding package (10) surrounding the lead frame (2), laser chip (5), wire bonds (7) and optical plate (9), and aligning a side surface (10a) of the overmoulding package (10) with a second side face (9b) of the optical plate (9) opposite to the first side face (9a). Embodiment 9. Method according to embodiment 8, further comprising filling a space between the first side face (9a) and side emitter face (5a) with a transparent material, before applying the overmoulding package (10).
Embodiment 10. Method according to embodiment 8 or 9, further comprising attaching the optical 40 plate (9) to the laser chip (5) using an optically transparent adhesive.
P6081146NL 6 Embodiment 11. Method according to embodiment 8, 9 or 10, further comprising forming sides of the overmoulding package (10) by cutting.
The present invention has been described above with reference to a number of exemplaryembodiments as shown in the drawings.
Modifications and alternative implementations of some parts or elements are possible, and are included in the scope of protection as defined in theappended claims.

Claims (11)

P8081146NL 7 ConclusiesP8081146EN 7 Conclusions 1. Een laserchipverpakking (1) omvattende een leadframe (2) met een substraatdrager (3) en een veelvoud van verbindingselementen (4), een laserchip (5) die is bevestigd aan de substraatdrager (3), waarbij de laserchip (5) één of meer zijwaarts emitterende laserdioden (6) heeft, een veelvoud van draadverbindingen (7), waarbij elk van de draadverbindingen (7) een pad (8) op de laserchip (5) verbindt met een vooraf bepaald verbindingselement van het veelvoud van verbindingselementen (4), een optische plaat (9) die op de substraatdrager (3) is gepositioneerd, waarbij de optische plaat (9) een eerste zijvlak (9a) heeft dat aangrenzend is gepositioneerd langs een zijdelings emissievlak (5a) van de laserchip (5), een gietomhullingverpakking (10) dat het leadframe (2), laserchip (5), draadverbindingen (7) en de optische plaat (9) omgeeft, waarbij een zijoppervlak (10a) van de gietomhullingverpakking (10) is uitgelijnd met een tweede zijvlak (9b) van de optische plaat (9) tegenover het eerste zijvlak (9a).A laser chip package (1) comprising a lead frame (2) with a substrate carrier (3) and a plurality of connecting elements (4), a laser chip (5) attached to the substrate carrier (3), the laser chip (5) being one or more side emitting laser diodes (6), a plurality of wire connections (7), each of the wire connections (7) connecting a path (8) on the laser chip (5) to a predetermined connection element of the plurality of connection elements (4) ), an optical plate (9) positioned on the substrate carrier (3), the optical plate (9) having a first side face (9a) positioned adjacent along a lateral emission face (5a) of the laser chip (5), a mold casing package (10) surrounding the lead frame (2), laser chip (5), wire connections (7) and the optical plate (9), wherein a side surface (10a) of the mold casing package (10) is aligned with a second side surface (9b) ) of the optical plate (9) opposite the first z ice plane (9a). 2. De laserchipverpakking (1) volgens conclusie 1, waarbij de optische plaat (9) een dikte heeft die in hoofdzaak gelijk is aan een dikte van de laserchip (5).The laser chip package (1) according to claim 1, wherein the optical plate (9) has a thickness substantially equal to a thickness of the laser chip (5). 3. De laserchipverpakking (1) volgens conclusie 1 of 2, waarbij de optische plaat (9) een glasplaat is. The laser chip package (1) according to claim 1 or 2, wherein the optical plate (9) is a glass plate. 4, De laserchipverpakking (1) volgens één van de conclusies 1-3, waarbij de optische plaat (9) een materiaal omvat met een brekingsindex tussen 1.1 en 1.6.The laser chip package (1) according to any of claims 1-3, wherein the optical plate (9) comprises a material having a refractive index between 1.1 and 1.6. 5. De laserchipverpakking (1) volgens één van de conclusies 1-4, waarbij de optische plaat (9) is bevestigd aan de laserchip (5) middels een optisch transparante kleefstof.The laser chip package (1) according to any one of claims 1-4, wherein the optical plate (9) is attached to the laser chip (5) by an optically transparent adhesive. 6. De laserchipverpakking (1) volgens één van de conclusies 1-5, waarbij de éne of meer zijwaarts emitterende laserdioden (6) een stralingshoek hebben van meer dan 10 graden, bijvoorbeeld meer dan 20 graden.The laser chip package (1) according to any of claims 1 to 5, wherein the one or more side emitting laser diodes (6) have a beam angle of more than 10 degrees, for example more than 20 degrees. 7. De laserchipverpakking (1) volgens één van de conclusies 1-6, waarbij de laserchipverpakking (1) een quad flat no-leads (QFN) verpakking is. 40The laser chip package (1) according to any one of claims 1-6, wherein the laser chip package (1) is a quad flat no-leads (QFN) package. 40 P6081146NL 8P6081146EN 8 8. Een werkwijze voor het vervaardigen van een laserchipverpakking (1), omvattende het verschaffen van een leadframe (2) met een substraatdrager (3) en een veelvoud van verbindingselementen (4), het bevestigen van een laserchip (5) aan de substraatdrager (3), het draadverbinden van een pad (8) op de laserchip (5) met een vooraf bepaald verbindingselement van het veelvoud van verbindingselementen (4), het positioneren van een optische plaat (9) op de substraatdrager (3), waarbij de optische plaat (9) een eerste zijvlak (9a) heeft dat aangrenzend is gepositioneerd langs een zijdelings emissievlak (5a) van de laserchip (5), het verschaffen van een gietomhullingverpakking (10) rondom het leadframe (2), laserchip (5), draadverbindingen (7) en de optische plaat (9), en het uitlijnen van een zijoppervlak (10a) van de gietomhullingverpakking (10) met een tweede zijvlak (9b} van de optische plaat (9) tegenover het eerste zijvlak (9a).A method of manufacturing a laser chip package (1), comprising providing a lead frame (2) with a substrate carrier (3) and a plurality of connecting elements (4), attaching a laser chip (5) to the substrate carrier ( 3), wire-connecting a path (8) on the laser chip (5) to a predetermined connection element of the plurality of connection elements (4), positioning an optical plate (9) on the substrate carrier (3), whereby the optical plate (9) has a first side face (9a) positioned adjacent along a lateral emission face (5a) of the laser chip (5), providing a mold wrap package (10) around the lead frame (2), laser chip (5), wire connections (7) and the optical plate (9), and aligning a side surface (10a) of the mold casing package (10) with a second side surface (9b} of the optical plate (9) opposite the first side surface (9a). 9. De werkwijze volgens conclusie 8, verder omvattend het vullen van een ruimte tussen het eerste zijvlak (9a) en het zijdelings emissievlak (5a) met een transparant materiaal, voorafgaand aan het verschaffen van de gietomhullingverpakking (10).The method of claim 8, further comprising filling a space between the first side face (9a) and the lateral emission face (5a) with a transparent material prior to providing the pour casing package (10). 10. De werkwijze volgens conclusie 8 of 9, verder omvattend het bevestigen van de optische plaat (9) aan de laserchip (5) met behulp van een optisch transparante kleefstof.The method of claim 8 or 9, further comprising attaching the optical plate (9) to the laser chip (5) using an optically transparent adhesive. 11. De werkwijze volgens conclusie 8, 9 of 10, verder omvattend het vormen van zijden van de gietomhullingverpakking (10) door snijden.The method of claim 8, 9 or 10, further comprising forming sides of the mold casing package (10) by cutting.
NL2022241A 2018-12-18 2018-12-18 Laser chip package NL2022241B1 (en)

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US20200313400A1 (en) * 2017-12-13 2020-10-01 Sony Corporation Method of manufacturing light-emitting module, light-emitting module, and device

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