NL149639B - Huis met een halfgeleiderinrichting. - Google Patents
Huis met een halfgeleiderinrichting.Info
- Publication number
- NL149639B NL149639B NL686803754A NL6803754A NL149639B NL 149639 B NL149639 B NL 149639B NL 686803754 A NL686803754 A NL 686803754A NL 6803754 A NL6803754 A NL 6803754A NL 149639 B NL149639 B NL 149639B
- Authority
- NL
- Netherlands
- Prior art keywords
- house
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US62428267A | 1967-03-20 | 1967-03-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
NL6803754A NL6803754A (nl) | 1968-09-23 |
NL149639B true NL149639B (nl) | 1976-05-17 |
Family
ID=24501370
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL686803754A NL149639B (nl) | 1967-03-20 | 1968-03-15 | Huis met een halfgeleiderinrichting. |
Country Status (3)
Country | Link |
---|---|
US (1) | US3452254A (nl) |
GB (1) | GB1177031A (nl) |
NL (1) | NL149639B (nl) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3746947A (en) * | 1969-03-15 | 1973-07-17 | Mitsubishi Electric Corp | Semiconductor device |
US3688163A (en) * | 1970-08-04 | 1972-08-29 | Gen Motors Corp | Cold welded semiconductor package having integral cold welding oil |
US4327370A (en) * | 1979-06-28 | 1982-04-27 | Rca Corporation | Resilient contact ring for providing a low impedance connection to the base region of a semiconductor device |
JPS5871633A (ja) * | 1981-10-23 | 1983-04-28 | Toshiba Corp | 圧接型半導体装置 |
GB8410847D0 (en) * | 1984-04-27 | 1984-06-06 | Westinghouse Brake & Signal | Semiconductor housings |
FR2633452B1 (fr) * | 1988-06-28 | 1990-11-02 | Doue Julien | Dispositif de support pour un substrat mince, notamment en un materiau semiconducteur |
US6081039A (en) * | 1997-12-05 | 2000-06-27 | International Rectifier Corporation | Pressure assembled motor cube |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL101591C (nl) * | 1956-03-22 | |||
US3225416A (en) * | 1958-11-20 | 1965-12-28 | Int Rectifier Corp | Method of making a transistor containing a multiplicity of depressions |
GB1001269A (nl) * | 1960-09-30 | 1900-01-01 | ||
GB1054422A (nl) * | 1963-03-16 | 1900-01-01 | ||
NL302170A (nl) * | 1963-06-15 | |||
US3280388A (en) * | 1964-03-09 | 1966-10-18 | Int Rectifier Corp | Housing for multi-lead semiconductor device including crimping connection means for one lead |
US3293508A (en) * | 1964-04-21 | 1966-12-20 | Int Rectifier Corp | Compression connected semiconductor device |
-
1967
- 1967-03-20 US US624282A patent/US3452254A/en not_active Expired - Lifetime
-
1968
- 1968-03-06 GB GB00935/68A patent/GB1177031A/en not_active Expired
- 1968-03-15 NL NL686803754A patent/NL149639B/nl not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
NL6803754A (nl) | 1968-09-23 |
GB1177031A (en) | 1970-01-07 |
US3452254A (en) | 1969-06-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
V1 | Lapsed because of non-payment of the annual fee | ||
NL80 | Abbreviated name of patent owner mentioned of already nullified patent |
Owner name: INT RECTIFIER |