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MY173863A - Resin sealing compression molding method and apparatus for semiconductor chips, and resin burr prevention tape - Google Patents

Resin sealing compression molding method and apparatus for semiconductor chips, and resin burr prevention tape

Info

Publication number
MY173863A
MY173863A MYPI2013000198A MYPI2013000198A MY173863A MY 173863 A MY173863 A MY 173863A MY PI2013000198 A MYPI2013000198 A MY PI2013000198A MY PI2013000198 A MYPI2013000198 A MY PI2013000198A MY 173863 A MY173863 A MY 173863A
Authority
MY
Malaysia
Prior art keywords
resin
lower die
sealed
cavity
molding method
Prior art date
Application number
MYPI2013000198A
Inventor
Tane Yukitomo
Takahashi Noriyuki
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2012020668A external-priority patent/JP6087507B2/en
Priority claimed from JP2012020663A external-priority patent/JP5723800B2/en
Application filed by Towa Corp filed Critical Towa Corp
Publication of MY173863A publication Critical patent/MY173863A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

A substrate to be resin-sealed (1) is placed at a cavity (7c) of a lower die (7), and upper end parts ofresin burr prevention members (10) protuberantly provided in the cavity (7c) of the lower die (7) are joined with parts of the substrate to be resin-sealed (1) set as resin non-contact areas (B) so that the resin non-contact areas (B) are coated with these members. In this state, an upper die (6) and the lower die (7) are closed to each other, and LED chip (2) mounted on the substrate to be resin-sealed (1) are dipped in a transparent resin material (R) in the cavity (7c) of the lower die (7). Further, the LED chip (2) are sealed and molded in transparent resin moldings (lenses) (21a) by compressing the transparent resin material (R) in the cavity (7c) of the lower die (7). In this manner, the adhesion of resin burrs to the resin non-contact areas (B) is prevented from happening.
MYPI2013000198A 2012-02-02 2013-01-18 Resin sealing compression molding method and apparatus for semiconductor chips, and resin burr prevention tape MY173863A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012020668A JP6087507B2 (en) 2012-02-02 2012-02-02 Compressed resin sealing molding method of semiconductor chip and production method of semiconductor chip sealed with resin
JP2012020663A JP5723800B2 (en) 2012-02-02 2012-02-02 Compressed resin sealing molding method and apparatus for semiconductor chip

Publications (1)

Publication Number Publication Date
MY173863A true MY173863A (en) 2020-02-25

Family

ID=48927092

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013000198A MY173863A (en) 2012-02-02 2013-01-18 Resin sealing compression molding method and apparatus for semiconductor chips, and resin burr prevention tape

Country Status (4)

Country Link
KR (1) KR101432423B1 (en)
CN (1) CN103247739B (en)
MY (1) MY173863A (en)
TW (1) TWI527273B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102455987B1 (en) * 2014-07-22 2022-10-18 아피쿠 야마다 가부시키가이샤 Molding die, molding device, method for manufacturing molded article and resin molding method
JP6525580B2 (en) * 2014-12-24 2019-06-05 Ｔｏｗａ株式会社 Resin molding apparatus and resin molding method
CN116504702B (en) * 2023-06-26 2023-09-05 山东联高智能科技有限公司 Semiconductor element processing equipment

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4388654B2 (en) * 2000-02-01 2009-12-24 アピックヤマダ株式会社 Resin sealing device and resin sealing method
JP2002151531A (en) * 2000-11-15 2002-05-24 Matsushita Electric Ind Co Ltd Method for manufacturing semiconductor device
JP5325933B2 (en) * 2004-08-26 2013-10-23 アピックヤマダ株式会社 Resin mold
JP4834407B2 (en) * 2006-01-17 2011-12-14 アピックヤマダ株式会社 Resin molding method and resin molding apparatus
JP2008041846A (en) 2006-08-04 2008-02-21 Towa Corp Flip-chip resin injection molding method, and metal mold
US7709853B2 (en) 2007-02-12 2010-05-04 Cree, Inc. Packaged semiconductor light emitting devices having multiple optical elements
JP2008207450A (en) * 2007-02-27 2008-09-11 Towa Corp Compression molding method of light emitting element

Also Published As

Publication number Publication date
TW201334234A (en) 2013-08-16
CN103247739A (en) 2013-08-14
CN103247739B (en) 2015-12-09
KR101432423B1 (en) 2014-08-20
KR20130089588A (en) 2013-08-12
TWI527273B (en) 2016-03-21

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