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MY166688A - Measuring jig, wire saw, and workpiece attachment method - Google Patents

Measuring jig, wire saw, and workpiece attachment method

Info

Publication number
MY166688A
MY166688A MYPI2012005003A MYPI2012005003A MY166688A MY 166688 A MY166688 A MY 166688A MY PI2012005003 A MYPI2012005003 A MY PI2012005003A MY PI2012005003 A MYPI2012005003 A MY PI2012005003A MY 166688 A MY166688 A MY 166688A
Authority
MY
Malaysia
Prior art keywords
workpiece
wire
workpiece support
jig
measuring jig
Prior art date
Application number
MYPI2012005003A
Inventor
Matsuda Akihiro
Tanizaki Akira
Original Assignee
Komatsu Ntc Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Ntc Ltd filed Critical Komatsu Ntc Ltd
Publication of MY166688A publication Critical patent/MY166688A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A WIRE SAW INCLUDES TWO MAIN ROLLERS, A WIRE (25) THAT RUNS BETWEEN THE TWO MAIN ROLLERS, A WORKPIECE SUPPORT (27), AND A WORKPIECE JIG ATTACHED TO AND REMOVED FROM THE WORKPIECE SUPPORT (27). A POSITION OF THE WORKPIECE SUPPORT (27) IS ADJUSTABLE ABOUT AN AXIS EXTENDING IN A VERTICAL DIRECTION. THE WORKPIECE JIG IS ATTACHED TO AND REMOVED FROM THE WORKPIECE SUPPORT (27) BY A PLURALITY OF CLAMPING FIXTURES (30) IMPLEMENTING A POSITIONING FUNCTION. A MEASURING JIG (42) CAN BE ATTACHED TO THE WORKPIECE SUPPORT (27) IN LIEU OF THE WORKPIECE JIG. A CAMERA (44), WHICH DETECTS THE POSITION OF A WIRE (25), IS ARRANGED ON THE MEASURING JIG (42). THE POSITION OF THE WORKPIECE SUPPORT (27) IS ADJUSTED BASED ON THE POSITION OF THE WIRE (25) DETECTED BY THE CAMERA (44), AND THE CLAMPING FIXTURES (30) ARE SET AT A PREDETERMINED POSITION RELATIVE TO THE WIRE (25) THE MOST ILLUSTRATIVE DRAWING:
MYPI2012005003A 2011-03-07 2012-02-27 Measuring jig, wire saw, and workpiece attachment method MY166688A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011049054A JP5016122B1 (en) 2011-03-07 2011-03-07 Measuring jig, wire saw, and workpiece mounting method

Publications (1)

Publication Number Publication Date
MY166688A true MY166688A (en) 2018-07-18

Family

ID=46798017

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2012005003A MY166688A (en) 2011-03-07 2012-02-27 Measuring jig, wire saw, and workpiece attachment method

Country Status (7)

Country Link
JP (1) JP5016122B1 (en)
KR (1) KR101257327B1 (en)
CN (1) CN102958646B (en)
MY (1) MY166688A (en)
PH (1) PH12012502384A1 (en)
TW (1) TWI469838B (en)
WO (1) WO2012121049A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5964204B2 (en) * 2012-10-31 2016-08-03 コマツＮｔｃ株式会社 Automatic wire winding method and apparatus for wire saw
JP6090624B2 (en) * 2013-03-29 2017-03-08 パナソニックＩｐマネジメント株式会社 Manufacturing method of semiconductor wafer
JP7372098B2 (en) * 2019-09-20 2023-10-31 コマツＮｔｃ株式会社 How to load and unload wire saws and wire saw workpieces
CN112720611A (en) * 2021-01-15 2021-04-30 昆山竹言薄膜特殊材料有限公司 Cutting positioning device for plastic film production
CN114043634B (en) * 2021-11-12 2024-02-20 中山市海晶电子有限公司 Wafer cutting clamping equipment
KR102740967B1 (en) * 2022-01-10 2024-12-11 에스케이실트론 주식회사 Workplate for y-axis compensation of ingot and y-axis compensation method of ingot using the same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0666520A (en) * 1992-08-14 1994-03-08 A T R Koudenpa Tsushin Kenkyusho:Kk Optical waveguide sensor equipment
JP3187295B2 (en) * 1995-08-31 2001-07-11 株式会社日平トヤマ Wire saw equipment
JP3256114B2 (en) * 1995-11-22 2002-02-12 株式会社日平トヤマ Work orientation adjustment device for wire saw
CN2378152Y (en) * 1999-05-20 2000-05-17 杨文恭 Flexible grinding wheel cutting-off machine
DE10139962C1 (en) * 2001-08-14 2003-04-17 Wacker Siltronic Halbleitermat Process for cutting disks from a brittle hard workpiece and wire saw to carry out the process
JP4308463B2 (en) * 2001-11-08 2009-08-05 株式会社Ｓｕｍｃｏ Wire saw
JP3976556B2 (en) * 2001-11-30 2007-09-19 Ｄｏｗａホールディングス株式会社 Wire saw
JP4083152B2 (en) * 2004-07-29 2008-04-30 日本碍子株式会社 Wire saw equipment
KR100667690B1 (en) * 2004-11-23 2007-01-12 주식회사 실트론 Wafer Slicing Method and Apparatus
JP2007160431A (en) * 2005-12-12 2007-06-28 Takatori Corp Cutting method using wire saw and cut work receiving member of wire saw
JP4825867B2 (en) * 2008-12-25 2011-11-30 コマツＮｔｃ株式会社 Wire saw system
JP2010207978A (en) * 2009-03-11 2010-09-24 Sumitomo Metal Mining Co Ltd Method of positioning cutting wire and workpiece, and wire saw with positioning angle detection device using the method

Also Published As

Publication number Publication date
WO2012121049A1 (en) 2012-09-13
KR20120136425A (en) 2012-12-18
KR101257327B1 (en) 2013-04-23
CN102958646B (en) 2015-04-15
JP5016122B1 (en) 2012-09-05
CN102958646A (en) 2013-03-06
JP2012183615A (en) 2012-09-27
TW201249573A (en) 2012-12-16
PH12012502384A1 (en) 2019-10-11
TWI469838B (en) 2015-01-21

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