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MY158267A - Release film and method of producing flexible printed circuit boards utilizing same - Google Patents

Release film and method of producing flexible printed circuit boards utilizing same

Info

Publication number
MY158267A
MY158267A MYPI20042586A MYPI20042586A MY158267A MY 158267 A MY158267 A MY 158267A MY PI20042586 A MYPI20042586 A MY PI20042586A MY PI20042586 A MYPI20042586 A MY PI20042586A MY 158267 A MY158267 A MY 158267A
Authority
MY
Malaysia
Prior art keywords
release film
printed circuit
circuit boards
flexible
release
Prior art date
Application number
MYPI20042586A
Inventor
Takahashi Yasunori
Maeda Masataka
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=33568348&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY158267(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of MY158267A publication Critical patent/MY158267A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

IN THE STEP OF ADHERING A COVER LAY TO A FLEXIBLE CIRCUIT MEMBER IN THE MANUFACTURE OF FLEXIBLE (OR RIGID FLEXIBLE) PRINTED CIRCUIT BOARDS, THE INVENTION PROVIDES THE IMPROVED RELEASABILITY AND MOLDABILITY THAT CANNOT BE OBTAINED WITH THE CONVENTIONAL RELEASE FILMS, IN THE STEP OF PRESSING, WHILE GOOD SHAPE-FOLLOWING CHARACTERISTICS, UNIFORM MOLDING CHARACTERISTICS AND PLATING CHARACTERISTICS AS WELL AS GOOD CHARACTERISTICS WITH RESPECT OF APPEARANCE WRINKLING ON FINISHED EPCs ARE RETAINED.THE INVENTION PROVIDES A RELEASE FILM WHICH COMPRISES A RELEASE LAYER COMPRISING A THERMOPLASTIC RESIN WHOSE VISCOELASTICITY MODULUS AT THE TEMPERATURE 180°C IS 50 TO 250 MPa. A POLYBUTYLENE TEREPHTHALATE-BASED RESIN IS PREFERRED AS THE THERMOPLASTIC RESIN. THE RELEASE FILM PREFERABLY HAS A CUSHION LAYER PROVIDED ON ONE SIDE OF THE RELEASE LAYER AND COMPRISING A THERMOPLASTIC RESIN OTHER THAN THAT OF THE RELEASE LAYER. PREFERABLY, THE RELEASE LAYER IS EMBOSSED WITH A SPECIFIC ROUGHNESS. THE INVENTION ALSO PROVIDES A METHOD OF MANUFACTURING FLEXIBLE AND RIGID FLEXIBLE PRINTED CIRCUIT BOARDS WHICH UNTILIZES THE RELEASE FILM SPECIFIED ABOVE.
MYPI20042586A 2003-07-01 2004-06-29 Release film and method of producing flexible printed circuit boards utilizing same MY158267A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003189646 2003-07-01
JP2004067705 2004-03-10
JP2004155780 2004-05-26

Publications (1)

Publication Number Publication Date
MY158267A true MY158267A (en) 2016-09-30

Family

ID=33568348

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20042586A MY158267A (en) 2003-07-01 2004-06-29 Release film and method of producing flexible printed circuit boards utilizing same

Country Status (6)

Country Link
JP (4) JPWO2005002850A1 (en)
KR (1) KR101256662B1 (en)
CN (1) CN101961937B (en)
MY (1) MY158267A (en)
TW (1) TWI476103B (en)
WO (1) WO2005002850A1 (en)

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* Cited by examiner, † Cited by third party
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JP2006148081A (en) * 2004-10-19 2006-06-08 Sumitomo Bakelite Co Ltd Mold release film and method of manufacturing circuit board
JP2006278688A (en) * 2005-03-29 2006-10-12 Sumitomo Bakelite Co Ltd Cushioning material, and method for manufacturing wiring plate
WO2007029979A1 (en) 2005-09-07 2007-03-15 Seong-Min Kim Release film for pcb lamination process
JP4826196B2 (en) * 2005-10-05 2011-11-30 住友ベークライト株式会社 Release film and circuit board manufacturing method
JP5014630B2 (en) * 2005-12-28 2012-08-29 三菱樹脂株式会社 Polyester film and printed circuit board coverlay film pressing sheet
JP4933893B2 (en) * 2006-12-28 2012-05-16 パナソニック株式会社 Heat press method
JP4992626B2 (en) * 2007-09-14 2012-08-08 三菱エンジニアリングプラスチックス株式会社 Release film for hot press molding
JP5272589B2 (en) * 2008-09-01 2013-08-28 住友ベークライト株式会社 Release film
JP5368054B2 (en) * 2008-10-15 2013-12-18 日本メクトロン株式会社 Method for manufacturing flexible circuit board and flexible circuit board
JP5593785B2 (en) * 2010-03-31 2014-09-24 住友ベークライト株式会社 Release film
DE102010043313B4 (en) * 2010-11-03 2022-08-25 HELLA GmbH & Co. KGaA Lighting device for vehicles
JP5685930B2 (en) * 2010-12-27 2015-03-18 住友ベークライト株式会社 Release film
JP5644791B2 (en) * 2011-10-31 2014-12-24 住友ベークライト株式会社 Release film
JP5832480B2 (en) * 2012-10-19 2015-12-16 三井化学東セロ株式会社 Release film
WO2014141512A1 (en) * 2013-03-14 2014-09-18 三井化学東セロ株式会社 Release film
CN104080264B (en) * 2013-03-29 2018-05-11 日本梅克特隆株式会社 Mould release film and flexible printed circuit substrate
KR102202907B1 (en) 2013-04-24 2021-01-14 유니띠까 가부시키가이샤 Mold release film for led production
JP5874768B2 (en) * 2013-04-30 2016-03-02 住友ベークライト株式会社 Release film and method of using release film
JP5874774B2 (en) * 2013-06-06 2016-03-02 住友ベークライト株式会社 Release film and method of using release film
JP5792904B2 (en) * 2013-06-18 2015-10-14 積水化学工業株式会社 Release film
JP6223913B2 (en) * 2013-08-05 2017-11-01 積水化学工業株式会社 Release film
JP6352034B2 (en) * 2014-04-21 2018-07-04 三井化学東セロ株式会社 Multi-layer release film
JP6500418B2 (en) * 2014-12-12 2019-04-17 住友ベークライト株式会社 Release film
JP6481396B2 (en) * 2015-02-09 2019-03-13 住友ベークライト株式会社 Release film
KR200483919Y1 (en) * 2015-03-25 2017-07-10 (주)알킨스 Embossed releasing film
KR102136542B1 (en) 2015-09-04 2020-07-22 타츠타 전선 주식회사 Printed wiring board manufacturing method and printed wiring board protective film and sheet-like laminate used in the above method
CN108235594B (en) * 2016-12-09 2019-11-05 松本涂层科技（昆山）有限公司 A kind of combined type folds structure release film and preparation method thereof
JP2018167458A (en) * 2017-03-29 2018-11-01 日本メクトロン株式会社 Release film and method for manufacturing flexible printed board
SG10202104318RA (en) * 2017-08-07 2021-05-28 X Card Holdings Llc Card having metallic core layer and systems and methods for card manufacturing
JP7352363B2 (en) * 2018-03-16 2023-09-28 日東電工株式会社 Magnetic wiring circuit board and its manufacturing method
CN110948953B (en) * 2019-12-19 2021-12-28 宁波长阳科技股份有限公司 Release film and application thereof
CN115011277B (en) * 2022-08-09 2022-11-15 宁波长阳科技股份有限公司 PBT release film and its preparation method and application
CN115972731A (en) * 2023-03-17 2023-04-18 宁波长阳科技股份有限公司 PBT release film and preparation method and application thereof

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JP2001168117A (en) * 1999-12-06 2001-06-22 Idemitsu Petrochem Co Ltd Release film for sealing semiconductor element and method for sealing semiconductor element using the same
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JP2003206366A (en) * 2002-01-11 2003-07-22 Sanwa Kako Co Ltd Method for recycling flash of crosslinking polyethylene expanded material
JP2003211602A (en) * 2002-01-24 2003-07-29 Sumitomo Bakelite Co Ltd Release multilayered film and cover-lay molding method
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JP2004002789A (en) * 2002-04-03 2004-01-08 Sekisui Chem Co Ltd Mold release sheet, laminated mold release film and method for producing board

Also Published As

Publication number Publication date
JP5424159B2 (en) 2014-02-26
CN101961937A (en) 2011-02-02
KR101256662B1 (en) 2013-04-19
JP2010149520A (en) 2010-07-08
JP2014210434A (en) 2014-11-13
CN101961937B (en) 2015-09-16
TWI476103B (en) 2015-03-11
KR20060029155A (en) 2006-04-04
TW200503892A (en) 2005-02-01
JP2009073195A (en) 2009-04-09
JPWO2005002850A1 (en) 2006-08-10
WO2005002850A1 (en) 2005-01-13

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