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MY107755A - Curable epoxy resin compositions comprising a latent hardener,an amine and a dithiol. - Google Patents

Curable epoxy resin compositions comprising a latent hardener,an amine and a dithiol.

Info

Publication number
MY107755A
MY107755A MYPI92000773A MYPI19920773A MY107755A MY 107755 A MY107755 A MY 107755A MY PI92000773 A MYPI92000773 A MY PI92000773A MY PI19920773 A MYPI19920773 A MY PI19920773A MY 107755 A MY107755 A MY 107755A
Authority
MY
Malaysia
Prior art keywords
epoxy resin
dithiol
amine
latent hardener
resin compositions
Prior art date
Application number
MYPI92000773A
Inventor
Frans Setiabudi Dr
Original Assignee
Vantico Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vantico Ag filed Critical Vantico Ag
Publication of MY107755A publication Critical patent/MY107755A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66—Mercaptans
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Compounds (AREA)

Abstract

CURABLE COMPOSITIONS COMPRISING(A) AN EPOXY RESIN,(B) A LATENT HARDENER FOR THE EPOXY RESIN WHICH DOES NOT BEGIN TO REACT UNTIL A TEMPERATURE OF AT LEAST 80 ?C (MEASURED BY DSC AT A HEATING -UP RATE OF 10?C/ MIN),(C) AN AMINE CONTAINING AT LEAST ONE ACTIVE HYDROGEN ATOM BOUND TO AMINO NITROGEN, AND (D) A DITHIOL OF FORMULA (1)HS-(C2H4-O-CH2-O-C2H4-S-S)N-C2H4-O-CH2-O-C2H4-SHWHEREIN N IS AN INTERGER FROM 2 TO 26,THE DIFFERENCE OF THE REACTION MAXIMA IN THE DSC DIAGRAM BEING AT LEAST 30?C AT A HEATING -UP RATE OF 10 ?C/MIN,ARE SUITABLE FOR THE PRODUCTION OF CROSSLINKED PRODUCTS, ESPECIALLY FOR MAKING PREPREGS WITH UNCRITICAL B-STAGE AND HAVING VERY GOOD STORAGE STABILITY.
MYPI92000773A 1991-05-17 1992-05-05 Curable epoxy resin compositions comprising a latent hardener,an amine and a dithiol. MY107755A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH147391 1991-05-17

Publications (1)

Publication Number Publication Date
MY107755A true MY107755A (en) 1996-06-15

Family

ID=4211307

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI92000773A MY107755A (en) 1991-05-17 1992-05-05 Curable epoxy resin compositions comprising a latent hardener,an amine and a dithiol.

Country Status (4)

Country Link
EP (1) EP0514335A3 (en)
KR (1) KR100204325B1 (en)
MY (1) MY107755A (en)
PL (1) PL169979B1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0659833B1 (en) * 1993-12-21 2000-08-16 Ciba SC Holding AG Compositions based on epoxy resins, impact modifiers and amines
GB9523649D0 (en) * 1995-11-18 1996-01-17 White Peter D B Hot melt reactive resin compositions
EP0877040B1 (en) * 1997-05-09 2000-04-12 Dainippon Ink And Chemicals, Inc. Phenol resin composition and method of producing phenol resin
DE19727175A1 (en) * 1997-06-26 1999-01-14 Mann & Hummel Filter Air filter
KR100923443B1 (en) 2007-12-11 2009-10-27 제일모직주식회사 Epoxy resin composition 밀봉 for semiconductor device sealing and semiconductor device using same
CN104530390A (en) * 2014-12-11 2015-04-22 广东生益科技股份有限公司 A degradable resin composition and its prepreg, laminate, copper clad laminate and its degradation method
CN108070072A (en) * 2016-11-07 2018-05-25 无锡创达新材料股份有限公司 A kind of imidazoles based epoxy resin latent curing agent based on three phosphonitrile of ring and preparation method thereof
CN106750182B (en) * 2016-12-29 2019-06-14 广东生益科技股份有限公司 A kind of degradable resin composition and its prepreg, laminate and its recovery method of preparation
CN111019580B (en) * 2019-12-26 2022-05-24 广州市白云化工实业有限公司 Epoxy resin adhesive and preparation method and application thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0303225A3 (en) * 1987-08-10 1990-01-10 Kashima Industries, Co. Epoxy resin film covered with metal foil and flexible printed wiring board
DE58909681D1 (en) * 1988-11-23 1996-06-20 Ciba Geigy Ag Curable epoxy resin mixtures containing polyoxyalkylene dithiols and polyamines
MY104771A (en) * 1989-11-21 1994-05-31 Vantico Ag Hardenable epoxide resin mixtures containing a latent hardener, an amine and a thiol.

Also Published As

Publication number Publication date
PL169979B1 (en) 1996-09-30
KR920021647A (en) 1992-12-18
KR100204325B1 (en) 1999-06-15
EP0514335A2 (en) 1992-11-19
EP0514335A3 (en) 1992-12-02
PL294544A1 (en) 1993-01-25

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