MX2017003154A - Metodo para acortar el tiempo de proceso durante la soldadura de componentes eléctricos o electrónicos mediante calentamiento inductivo electromagnético. - Google Patents
Metodo para acortar el tiempo de proceso durante la soldadura de componentes eléctricos o electrónicos mediante calentamiento inductivo electromagnético.Info
- Publication number
- MX2017003154A MX2017003154A MX2017003154A MX2017003154A MX2017003154A MX 2017003154 A MX2017003154 A MX 2017003154A MX 2017003154 A MX2017003154 A MX 2017003154A MX 2017003154 A MX2017003154 A MX 2017003154A MX 2017003154 A MX2017003154 A MX 2017003154A
- Authority
- MX
- Mexico
- Prior art keywords
- soldering
- solder
- electric
- foot
- shortening
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 4
- 238000005476 soldering Methods 0.000 title abstract 4
- 230000005674 electromagnetic induction Effects 0.000 title abstract 2
- 238000004904 shortening Methods 0.000 title abstract 2
- 229910000679 solder Inorganic materials 0.000 abstract 9
- 239000000463 material Substances 0.000 abstract 4
- 229910000599 Cr alloy Inorganic materials 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 239000000788 chromium alloy Substances 0.000 abstract 1
- UPHIPHFJVNKLMR-UHFFFAOYSA-N chromium iron Chemical compound [Cr].[Fe] UPHIPHFJVNKLMR-UHFFFAOYSA-N 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/002—Soldering by means of induction heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
- B23K2103/04—Steel or steel alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
- B23K2103/04—Steel or steel alloys
- B23K2103/05—Stainless steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/016—Heaters using particular connecting means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Induction Heating (AREA)
- Joining Of Glass To Other Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
La invención se refiere a un método para acortar el tiempo de proceso durante la soldadura de componentes eléctricos o electrónicos por medio de calentamiento inductivo electromagnético, en particular la soldadura de elementos de contacto eléctricos para soldar superficies de conexión que se aplican a un sustrato no metálico, en particular una hoja de vidrio. De conformidad con la invención primero se produce un elemento de contacto eléctrico, diseñado como un pie de soldadura, hecho de un material con una base de aleación de hierro-níquel o hierro-cromo. Subsiguientemente al pie de soldadura se le aplica un material de conexión exento de plomo. Después de que el pie de soldadura se colocó sobre la respectiva superficie de conexión de soldadura, el pie de soldadura se calienta en forma inductiva mediante energía de alta frecuencia con mayor calentamiento del material de pie de soldadura y menor calentamiento del material que contiene plata de la respectiva superficie de conexión de soldadura. La etapa de soldadura se completa después de un tiempo de < 10 s, en particular dentro de un tiempo de < 4 a 6 s. La invención también se refiere a un elemento de contacto en la forma de un pie de soldadura especial.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014013553 | 2014-09-12 | ||
| DE102015003086.8A DE102015003086A1 (de) | 2014-09-12 | 2015-03-11 | Verfahren zur Prozesszeitverkürzung beim Löten elektrischer oder elektronischer Bauteile mittels elektromagnetischer Induktionserwärmung |
| PCT/EP2015/070730 WO2016038144A1 (de) | 2014-09-12 | 2015-09-10 | Verfahren zur prozesszeitverkürzung beim löten elektrischer oder elektronischer bauteile mittels elektromagnetischer induktionserwärmung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2017003154A true MX2017003154A (es) | 2018-01-15 |
Family
ID=53185727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2017003154A MX2017003154A (es) | 2014-09-12 | 2015-09-10 | Metodo para acortar el tiempo de proceso durante la soldadura de componentes eléctricos o electrónicos mediante calentamiento inductivo electromagnético. |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20170297130A1 (es) |
| EP (1) | EP3191249A1 (es) |
| CN (1) | CN107073617A (es) |
| DE (2) | DE102015003086A1 (es) |
| MX (1) | MX2017003154A (es) |
| WO (1) | WO2016038144A1 (es) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD815042S1 (en) | 2015-03-26 | 2018-04-10 | Few Fahrzeugelektrikwerk Gmbh & Co. Kg | Mounting device |
| GB201515010D0 (en) | 2015-08-24 | 2015-10-07 | Pilkington Group Ltd | Electrical connector |
| DE102015223778A1 (de) * | 2015-11-30 | 2017-06-01 | Continental Teves Ag & Co. Ohg | Verfahren zum Ausbilden einer elektrischen Verbindung und elektrisches Verbindungselement |
| DE102016115364A1 (de) | 2016-08-18 | 2018-02-22 | Few Fahrzeugelektrik Werk Gmbh & Co. Kg | Verfahren zur Ausbildung einer stoffschlüssigen Fügeverbindung |
| USD857420S1 (en) | 2016-12-23 | 2019-08-27 | Few Fahrzeugelektrikwerk Gmbh & Co. Kg | Mounting device |
| DE102016125781A1 (de) | 2016-12-28 | 2018-06-28 | Few Fahrzeugelektrikwerk Gmbh & Co. Kg | Elektrisches Anschlusselement |
| DE102017116936B4 (de) * | 2017-07-26 | 2024-10-02 | Ledvance Gmbh | Verbindung eines elektrischen Leitelements mit einer Leiterplatte eines Leuchtmittels |
| KR102480461B1 (ko) * | 2017-11-30 | 2022-12-21 | 쌩-고벵 글래스 프랑스 | 차량용 창유리의 터미널 솔더링 장치 및 방법 |
| EP3823784B1 (de) * | 2018-07-20 | 2024-09-04 | Saint-Gobain Glass France | System und verfahren zum verlöten von kontaktelementen mit induktionswärme |
| GB201817357D0 (en) * | 2018-10-25 | 2018-12-12 | Strip Tinning Ltd | Flexible connector |
| CN110012614B (zh) * | 2019-04-19 | 2020-07-24 | 维沃移动通信有限公司 | 一种电路板、电路板组件、电子设备和焊接方法 |
| DE102019209451B4 (de) * | 2019-06-28 | 2021-04-01 | Vitesco Technologies Germany Gmbh | Elektrisches Kontaktelement, Leistungselektronikvorrichtung mit einem elektrischen Kontaktelement |
| DE102020208360B4 (de) | 2020-07-03 | 2022-03-24 | Vitesco Technologies Germany Gmbh | Formdraht, Leiterplatte, Leistungselektronik und Verfahren zur Herstellung einer Leiterplatte |
| DE102020120473A1 (de) | 2020-08-04 | 2022-02-10 | Eberspächer catem Hermsdorf GmbH & Co. KG | Verfahren zur Herstellung eines PTC-Heizelements und PTC-Heizelement |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4304788C2 (de) * | 1993-02-17 | 1996-05-15 | Ver Glaswerke Gmbh | Verfahren zur Herstellung einer Leiterstruktur mit sich kreuzenden elektrischen Leitern auf der Oberfläche einer Glasscheibe |
| DE20203202U1 (de) | 2001-12-31 | 2002-06-06 | Gilliam, Jakob, Dipl.-Ing., 82402 Seeshaupt | Elektrischer Anschluß |
| DE102004057630B3 (de) | 2004-11-30 | 2006-03-30 | Saint-Gobain Sekurit Deutschland Gmbh & Co. Kg | Verfahren und Vorrichtung zum Löten von Anschlüssen mit Induktionswärme |
| WO2007056602A2 (en) * | 2005-11-09 | 2007-05-18 | The Regents Of The University Of California | Bonding metals and non-metals using inductive heating |
| DE102006047764A1 (de) | 2006-10-06 | 2008-04-10 | W.C. Heraeus Gmbh | Bleifreies Weichlot mit verbesserten Eigenschaften bei Temperaturen >150°C |
| US8299401B2 (en) * | 2009-06-30 | 2012-10-30 | Pilkington Group Limited | Method and apparatus for forming a vehicle window assembly |
| EP2367399A1 (de) * | 2010-03-02 | 2011-09-21 | Saint-Gobain Glass France | Scheibe mit einem elektrischen Anschlusselement |
| EP2408260A1 (de) * | 2010-07-13 | 2012-01-18 | Saint-Gobain Glass France | Glasscheibe mit einem elektrischen Anschlusselement |
| DE202011100906U1 (de) | 2011-05-03 | 2011-06-09 | FEW Fahrzeugelektrikwerk GmbH & Co. KG, 04442 | Elektrisches Anschlusselement |
| EP3500063B1 (de) * | 2011-05-10 | 2020-09-16 | Saint-Gobain Glass France | Scheibe mit einem elektrischen anschlusselement |
| PT2708092T (pt) * | 2011-05-10 | 2020-02-21 | Saint Gobain | Placa de vidro com um elemento de conexão elétrica |
| ES2820427T3 (es) * | 2011-07-04 | 2021-04-21 | Saint Gobain | Procedimiento para la fabricación de una luna con un elemento de conexión eléctrico |
| DE102012007804B4 (de) * | 2012-02-24 | 2022-06-02 | Few Fahrzeugelektrikwerk Gmbh & Co. Kg | Verfahren zum technologisch optimierten Ausführen von bleifreien Lötverbindungen |
| JP2016506020A (ja) * | 2012-11-21 | 2016-02-25 | サン−ゴバン グラス フランスＳａｉｎｔ−Ｇｏｂａｉｎ Ｇｌａｓｓ Ｆｒａｎｃｅ | 電気的接続部材及びコネクションブリッジを備えた板ガラス |
-
2015
- 2015-03-11 DE DE102015003086.8A patent/DE102015003086A1/de not_active Ceased
- 2015-03-11 DE DE202015002764.4U patent/DE202015002764U1/de not_active Expired - Lifetime
- 2015-09-10 WO PCT/EP2015/070730 patent/WO2016038144A1/de active Application Filing
- 2015-09-10 MX MX2017003154A patent/MX2017003154A/es unknown
- 2015-09-10 CN CN201580055265.4A patent/CN107073617A/zh active Pending
- 2015-09-10 US US15/509,534 patent/US20170297130A1/en not_active Abandoned
- 2015-09-10 EP EP15763876.8A patent/EP3191249A1/de not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| EP3191249A1 (de) | 2017-07-19 |
| WO2016038144A1 (de) | 2016-03-17 |
| US20170297130A1 (en) | 2017-10-19 |
| DE202015002764U1 (de) | 2015-05-06 |
| DE102015003086A1 (de) | 2016-03-17 |
| CN107073617A (zh) | 2017-08-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| HH | Correction or change in general |