[go: up one dir, main page]

MX2015016099A - Miembro de suministro de potencia, y dispositivo de platinado de alta velocidad provisto con el mismo. - Google Patents

Miembro de suministro de potencia, y dispositivo de platinado de alta velocidad provisto con el mismo.

Info

Publication number
MX2015016099A
MX2015016099A MX2015016099A MX2015016099A MX2015016099A MX 2015016099 A MX2015016099 A MX 2015016099A MX 2015016099 A MX2015016099 A MX 2015016099A MX 2015016099 A MX2015016099 A MX 2015016099A MX 2015016099 A MX2015016099 A MX 2015016099A
Authority
MX
Mexico
Prior art keywords
power
supply member
same
device provided
plating device
Prior art date
Application number
MX2015016099A
Other languages
English (en)
Inventor
mochizuki Yoshitaka
Miyazaki Toshihisa
Takamatsu Akira
Original Assignee
Kyb Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyb Corp filed Critical Kyb Corp
Publication of MX2015016099A publication Critical patent/MX2015016099A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Se provee un miembro de suministro de potencia de manera que es posible llevar a cabo favorablemente el platinado durante un largo tiempo. Un segundo miembro de suministro de potencia (30) se pone en contacto con un artículo (1) que será platinado, que se posiciona de manera que forma un espacio a través del cual fluye una solución de platinado entre el artículo y un ánodo (10), y aplica un voltaje negativo al mismo. El segundo miembro de suministro de potencia (30) comprende un miembro de núcleo de cobre (34), y un miembro de revestimiento de titanio (32) que está presente en la periferia del miembro de núcleo de cobre (31) y por lo menos cubre el área que se pone en contacto con el fluido de platinado.
MX2015016099A 2013-06-14 2014-06-06 Miembro de suministro de potencia, y dispositivo de platinado de alta velocidad provisto con el mismo. MX2015016099A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013125556A JP6189656B2 (ja) 2013-06-14 2013-06-14 給電部材及びそれを備えた高速めっき装置
PCT/JP2014/065050 WO2014199908A1 (ja) 2013-06-14 2014-06-06 給電部材及びそれを備えた高速めっき装置

Publications (1)

Publication Number Publication Date
MX2015016099A true MX2015016099A (es) 2017-08-24

Family

ID=52022204

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015016099A MX2015016099A (es) 2013-06-14 2014-06-06 Miembro de suministro de potencia, y dispositivo de platinado de alta velocidad provisto con el mismo.

Country Status (8)

Country Link
US (1) US10006143B2 (es)
EP (1) EP3009536A4 (es)
JP (1) JP6189656B2 (es)
CN (1) CN105308222B (es)
BR (1) BR112015029937A8 (es)
MX (1) MX2015016099A (es)
TW (1) TWI646224B (es)
WO (1) WO2014199908A1 (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6193005B2 (ja) 2013-06-14 2017-09-06 Ｋｙｂ株式会社 保持装置及びそれを備えた高速めっき装置
JP7101229B2 (ja) * 2019-12-10 2022-07-14 エスケー ネクシリス カンパニー リミテッド メッキ設備用陰極アセンブリ
JP7394678B2 (ja) * 2020-03-26 2023-12-08 日立Astemo株式会社 ロッドの製造方法および陰極部材
JP7528508B2 (ja) * 2020-04-08 2024-08-06 オムロン株式会社 部分めっき装置

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3649477A (en) 1968-05-14 1972-03-14 Bart Mfg Co Electroplating large cylindrical tanks
US3960675A (en) * 1975-04-17 1976-06-01 Motter Printing Press Co. Method for deplating and replating rotogravure cylinders
JPS6046195B2 (ja) 1979-04-13 1985-10-15 ヤマハ発動機株式会社 高速メツキ装置
DE3011643A1 (de) * 1980-03-26 1981-10-01 Metallgesellschaft Ag, 6000 Frankfurt Elektrolysezelle
JPS57145999A (en) 1981-03-03 1982-09-09 Yamaha Motor Co Ltd Plating device
EP0059481A1 (en) 1981-03-03 1982-09-08 Yamaha Motor Co., Ltd. High speed plating apparatus
JPS57158396A (en) * 1981-03-24 1982-09-30 Riken Corp Simultaneous plating method for inside and outside circumference of ring
CH666697A5 (de) * 1985-12-16 1988-08-15 Daetwyler Ag Vorrichtung zur galvanischen behandlung von druckzylindern.
JPS62164899A (ja) * 1986-01-14 1987-07-21 Tanaka Kikinzoku Kogyo Kk 導電用複合ブスバ−
EP0365767B1 (de) 1988-09-01 1993-05-19 Siemens Nixdorf Informationssysteme Aktiengesellschaft Galvanisiereinrichtung für plattenförmige Werkstücke, insbesondere Leiterplatten
DE3938160A1 (de) 1989-11-16 1991-05-23 Peroxid Chemie Gmbh Elektrolysezelle zur herstellung von peroxo- und perhalogenatverbindungen
DE69312636T2 (de) 1992-11-09 1998-02-05 Canon Kk Anodisierungsapparat mit einer Trägervorrichtung für das zu behandelnde Substrat
US5516415A (en) 1993-11-16 1996-05-14 Ontario Hydro Process and apparatus for in situ electroforming a structural layer of metal bonded to an internal wall of a metal tube
US5476578A (en) 1994-01-10 1995-12-19 Electroplating Technologies, Ltd. Apparatus for electroplating
JP3606932B2 (ja) * 1994-12-30 2005-01-05 石福金属興業株式会社 電解用複合電極
JPH0931686A (ja) * 1995-07-21 1997-02-04 Toshiba Corp 電気メッキ装置および電気メッキ方法
US6547936B1 (en) * 1996-11-22 2003-04-15 Chema Technology, Inc. Electroplating apparatus having a non-dissolvable anode
JP2000073197A (ja) 1998-08-31 2000-03-07 Dainippon Screen Mfg Co Ltd 基板メッキ装置
IT1303889B1 (it) * 1998-12-01 2001-03-01 Giovanna Angelini Procedimento ed apparecchiatura per la cromatura in continuo di barree relativa struttura di anodo
EP1031647A3 (en) 1999-02-19 2002-03-06 Solid State Equipment Corporation Apparatus and method for plating a wafer
JP3409003B2 (ja) * 1999-12-10 2003-05-19 新日本製鐵株式会社 電極及びそれを用いたＳｎメッキ装置
DE10102145B4 (de) 2000-01-19 2008-04-03 Suzuki Motor Corp., Hamamatsu Galvanisiervorbehandlungsvorrichtung und Galvanisierbehandlungsvorrichtung
US20020003092A1 (en) 2000-06-16 2002-01-10 Thomas Engert Process for the production of refractory metal plates and expanded metal grids platinized on one side
DE10029837B4 (de) 2000-06-16 2005-02-17 Degussa Galvanotechnik Gmbh Verfahren zur Herstellung von einseitig platinierten Platten und Streckmetallgittern aus Refraktärmetallen
US6547945B2 (en) * 2000-07-31 2003-04-15 United Technologies Corporation Method and apparatuses for electrochemically treating an article
JP3513657B2 (ja) 2001-03-05 2004-03-31 ダイソー株式会社 不溶性陽極
JP4595046B2 (ja) * 2001-03-27 2010-12-08 日本パーカライジング株式会社 りん酸塩皮膜処理装置及び化成皮膜処理装置
JP4038194B2 (ja) * 2004-03-03 2008-01-23 野▲崎▼工業株式会社 不溶性電極及びそれに使用される電極板並びにその使用方法
JP2006016651A (ja) 2004-06-30 2006-01-19 Shinko Electric Ind Co Ltd ウエハめっき用治具
JP2006131969A (ja) 2004-11-08 2006-05-25 Toshiba Ceramics Co Ltd 陽極化成方法及びその装置
ITMI20050373A1 (it) 2005-03-09 2006-09-10 Nora Elettrodi S P A Elettrodo cilindrico
JP4873695B2 (ja) 2006-04-14 2012-02-08 ダイソー株式会社 電着塗装用膜付き中空電極
CN201495306U (zh) 2009-04-10 2010-06-02 竞铭机械股份有限公司 电镀槽阴极导电铜板改进结构
CN201473614U (zh) 2009-04-29 2010-05-19 张国庆 生箔机阴极辊新型结构
IT1393960B1 (it) * 2009-05-05 2012-05-17 Plating Innovations S R L Finitura superficiale elettrolitica di barre in continuo.
JP5768995B2 (ja) 2010-03-26 2015-08-26 アイシン精機株式会社 部分表面処理装置
JP5467374B2 (ja) 2011-08-25 2014-04-09 ユケン工業株式会社 軸体に電気めっきを形成するための装置、めっき皮膜を有する軸体の製造方法および軸体上に亜鉛系めっき皮膜を形成するためのめっき液
JP6193005B2 (ja) 2013-06-14 2017-09-06 Ｋｙｂ株式会社 保持装置及びそれを備えた高速めっき装置
JP6189655B2 (ja) 2013-06-14 2017-08-30 Ｋｙｂ株式会社 アノードの製造方法

Also Published As

Publication number Publication date
WO2014199908A1 (ja) 2014-12-18
JP2015001006A (ja) 2015-01-05
BR112015029937A8 (pt) 2019-12-31
EP3009536A4 (en) 2017-03-22
US20160108540A1 (en) 2016-04-21
EP3009536A1 (en) 2016-04-20
TW201510289A (zh) 2015-03-16
CN105308222A (zh) 2016-02-03
JP6189656B2 (ja) 2017-08-30
US10006143B2 (en) 2018-06-26
TWI646224B (zh) 2019-01-01
CN105308222B (zh) 2018-03-13
BR112015029937A2 (pt) 2017-07-25

Similar Documents

Publication Publication Date Title
PL3067199T3 (pl) Miedź osadzana elektrolitycznie oraz element elektryczny i bateria ją zawierająca
GB2530675A (en) Integrated thermoelectric cooling
SG11201807416YA (en) Substrate holder and plating apparatus
EP2931938A4 (en) ALLOY-COATED WORKPIECES
IL246035A0 (en) A bath for electrochemical bonding of copper containing an electrochemically inert cation
PT2852698T (pt) Banho de galvanoplastia de níquel ou liga de níquel galvânico para depositar um níquel ou liga de níquel semibrilhante, método para a galvanoplastia e utilização de um tal banho e compostos para o mesmo
EP3117027A4 (en) Electroplating of metals on conductive oxide substrates
MX2015016099A (es) Miembro de suministro de potencia, y dispositivo de platinado de alta velocidad provisto con el mismo.
TWD166713S (zh) 用於基板托盤的封接件
PT3356579T (pt) Banho de galvanoplastia para deposição eletroquímica de uma camada de liga de cu-sn-zn-pd, método para a deposição eletroquímica da referida camada de liga, substrato que compreende a referida camada de liga e utilizações do substrato revestido
EP3212823A4 (en) Plating bath solutions
EP3009535A4 (en) Holding device, and high-speed plating device provided with same
GB2516258B (en) High thermal conductivity insulated metal substrates produced by plasma electrolytic oxidation
GB201602653D0 (en) An arrangement for the electro-deposition of metal on carbon nanotube fibre
EP3578692A4 (en) TIN ALLOY PLATING SOLUTION
EP3464684A4 (en) TERNARY ZINC-NICKEL-IRON ALLOYS AND ALKALINE ELECTROLYTE FOR PLATING SUCH ALLOYS
PL2796593T3 (pl) Galwanizacja elementu wewnętrznego płata
MX2015016094A (es) Anodo y dispositivo de platinado de alta velocidad provisto con el mismo.
HK1232261A1 (zh) 銅-錫合金鍍敷浴
PL2972272T3 (pl) Styk elektryczny o małej sile działania na metalizowanych, odkształcalnych podłożach
PL2978877T3 (pl) Kąpiel galwaniczna dla stopów cynk-żelazo, sposób osadzania stopu cynk-żelazo na urządzeniu i takie urządzenie
SG10202001548PA (en) Electrical discharge machining electrode holder
SI2878411T1 (sl) Obdelovalna glava obdelovanca z minimalnim mazanjem
PH12016000312B1 (en) Connector holder
RU2015156139A (ru) Градиентное защитное покрытие