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MX2010004829A - Reduccion de perdidas dielectricas a traves del uso de organoarcilla en composiciones de aislante o semiconductor. - Google Patents

Reduccion de perdidas dielectricas a traves del uso de organoarcilla en composiciones de aislante o semiconductor.

Info

Publication number
MX2010004829A
MX2010004829A MX2010004829A MX2010004829A MX2010004829A MX 2010004829 A MX2010004829 A MX 2010004829A MX 2010004829 A MX2010004829 A MX 2010004829A MX 2010004829 A MX2010004829 A MX 2010004829A MX 2010004829 A MX2010004829 A MX 2010004829A
Authority
MX
Mexico
Prior art keywords
dielectric losses
reduction
organoclay
semiconductor
insulator compositions
Prior art date
Application number
MX2010004829A
Other languages
English (en)
Inventor
Timothy J Person
Robert F Eaton
Original Assignee
Union Carbide Chem Plastic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=40429787&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MX2010004829(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Union Carbide Chem Plastic filed Critical Union Carbide Chem Plastic
Publication of MX2010004829A publication Critical patent/MX2010004829A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002—Inhomogeneous material in general
    • H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Laminated Bodies (AREA)
  • Inorganic Insulating Materials (AREA)
  • Insulated Conductors (AREA)
  • Communication Cables (AREA)

Abstract

Organoarcillas son adicionadas a composiciones semiconductoras para proporcionar una reducción en las pérdidas dieléctricas de compuestos en capas, en las cuales la capa semiconductora contiene especies que podrían migrar hacia el aislamiento y resultar en pérdidas dieléctricas indeseablemente altas. Las composiciones semiconductoras de la invención proporcionan el desempeño mejorado en aplicaciones de cable de energía.
MX2010004829A 2007-11-02 2008-10-15 Reduccion de perdidas dielectricas a traves del uso de organoarcilla en composiciones de aislante o semiconductor. MX2010004829A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US98481307P 2007-11-02 2007-11-02
PCT/US2008/079915 WO2009058560A1 (en) 2007-11-02 2008-10-15 Reduction of dielectric losses through use organoclay in semiconductor or insulator compositions

Publications (1)

Publication Number Publication Date
MX2010004829A true MX2010004829A (es) 2010-07-28

Family

ID=40429787

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2010004829A MX2010004829A (es) 2007-11-02 2008-10-15 Reduccion de perdidas dielectricas a traves del uso de organoarcilla en composiciones de aislante o semiconductor.

Country Status (11)

Country Link
US (2) US9959951B2 (es)
EP (1) EP2215158B1 (es)
JP (1) JP5473926B2 (es)
KR (1) KR101461700B1 (es)
CN (1) CN101918486B (es)
AT (1) ATE541890T1 (es)
BR (1) BRPI0817164A2 (es)
CA (1) CA2703974C (es)
MX (1) MX2010004829A (es)
TW (1) TW200936665A (es)
WO (1) WO2009058560A1 (es)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR112014012380B1 (pt) 2011-12-13 2020-11-10 Dow Global Technologies Llc composição e artigo
BR112017003006B1 (pt) 2014-08-19 2022-03-03 Borealis Ag Uma nova composição de polímero reticulado, camada estruturada e cabo
US20160104555A1 (en) * 2014-10-10 2016-04-14 General Electric Company Method for improving the electric field distribution in a high voltage direct current cable
JP6895900B2 (ja) 2015-06-17 2021-06-30 ダウ グローバル テクノロジーズ エルエルシー 管状反応器において製造され、任意選択的に分岐剤で修飾された高溶融強度エチレン系ポリマーを使用して架橋ケーブル絶縁体を製造するための方法
EP4413070A1 (en) 2021-10-05 2024-08-14 Borealis AG Cable

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2627194B2 (ja) * 1989-07-31 1997-07-02 株式会社豊田中央研究所 ポリエステル複合材料及びその製造方法
JPH0652728A (ja) * 1992-07-31 1994-02-25 Showa Electric Wire & Cable Co Ltd 電力ケーブル
JP3349747B2 (ja) * 1993-02-26 2002-11-25 株式会社フジクラ 絶縁組成物および電力ケーブル
US5780376A (en) * 1996-02-23 1998-07-14 Southern Clay Products, Inc. Organoclay compositions
WO1998029491A1 (en) 1996-12-31 1998-07-09 The Dow Chemical Company Polymer-organoclay-composites and their preparation
FR2793592B1 (fr) * 1999-03-04 2001-06-08 Cit Alcatel Cable d'energie ayant des caracteristiques mecaniques, thermiques, electriques, et de tenue au feu sensiblement ameliorees
US6524702B1 (en) 1999-08-12 2003-02-25 Dow Global Technologies Inc. Electrical devices having polymeric members
US6737464B1 (en) * 2000-05-30 2004-05-18 University Of South Carolina Research Foundation Polymer nanocomposite comprising a matrix polymer and a layered clay material having a low quartz content
US6740396B2 (en) * 2001-02-26 2004-05-25 Pirelli Cavi E Sistemi S.P.A. Cable with coating of a composite material
JP2003022710A (ja) * 2001-07-06 2003-01-24 Toshiba Corp 低誘電型絶縁材料とその製造方法
US6825253B2 (en) 2002-07-22 2004-11-30 General Cable Technologies Corporation Insulation compositions containing metallocene polymers
JP5091389B2 (ja) 2002-09-10 2012-12-05 ユニオン カーバイド ケミカルズ アンド プラスティックス テクノロジー エルエルシー 溶融強度および物理特性が強化されたポリプロピレンケーブル被覆組成物
US7226422B2 (en) * 2002-10-09 2007-06-05 Cardiac Pacemakers, Inc. Detection of congestion from monitoring patient response to a recumbent position
US7144934B2 (en) 2002-10-24 2006-12-05 Dow Global Technologies Inc. Charge dissipation modifiers for olefinic interpolymer compositions
MXPA05013441A (es) * 2003-06-09 2006-03-17 Union Carbide Chem Plastic Blindaje de aislamiento semiconductor desprendible.
DE602004026326D1 (de) * 2003-09-25 2010-05-12 Dow Global Technologies Inc Ablösbare halbleitende abschirmung und zusammensetzungen dafür
JP2006028208A (ja) * 2004-07-12 2006-02-02 Fujikura Ltd 低誘電性・耐熱性樹脂組成物、これを用いた成形品及びプリント回路基板

Also Published As

Publication number Publication date
EP2215158A1 (en) 2010-08-11
CN101918486B (zh) 2016-05-11
ATE541890T1 (de) 2012-02-15
JP5473926B2 (ja) 2014-04-16
TW200936665A (en) 2009-09-01
US10354775B2 (en) 2019-07-16
KR20100099688A (ko) 2010-09-13
US20180211742A1 (en) 2018-07-26
JP2011503784A (ja) 2011-01-27
EP2215158B1 (en) 2012-01-18
WO2009058560A1 (en) 2009-05-07
CA2703974A1 (en) 2009-05-07
BRPI0817164A2 (pt) 2016-08-09
CN101918486A (zh) 2010-12-15
CA2703974C (en) 2017-03-07
US9959951B2 (en) 2018-05-01
US20110100675A1 (en) 2011-05-05
KR101461700B1 (ko) 2014-11-17

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