KR970077278A - Semiconductor wafer sample polishing machine - Google Patents
Semiconductor wafer sample polishing machine Download PDFInfo
- Publication number
- KR970077278A KR970077278A KR1019960017914A KR19960017914A KR970077278A KR 970077278 A KR970077278 A KR 970077278A KR 1019960017914 A KR1019960017914 A KR 1019960017914A KR 19960017914 A KR19960017914 A KR 19960017914A KR 970077278 A KR970077278 A KR 970077278A
- Authority
- KR
- South Korea
- Prior art keywords
- polishing machine
- semiconductor wafer
- sample
- optical microscope
- wafer sample
- Prior art date
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- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
반도체 웨이퍼 시료연마기에 카메라(Camera)가 설치된 광학현미경을 부설하여, 모니터(Monitor)와 연결시켜 연마되는 웨이퍼의 상을 계속적으로 관찰할 수 있도록 하는 반도체 웨이퍼 시료연마기에 관한 것이다.The present invention relates to a semiconductor wafer sample polishing machine in which an optical microscope equipped with a camera is attached to a semiconductor wafer sample polishing machine and connected to a monitor to continuously observe an image of a wafer to be polished.
본 발명은, 시료를 그라인딩하는 연마기가 구비된 반도체 웨이퍼 시료연마기에 있어서, 상기 연마기에서 그라인딩되는 시료를 관찰하 수 있는 위치에 부설되는 광학현미경, 상기 광학현미경에서 상을 관찰하는 관찰용원도우에 설치되어 그라인딩과정을 촬영하는 촬영수단 및 상기 카메라에서 촬영되는 상을 디스플레이하는 디스플레이수단을 포함하여 이루어진다.The present invention relates to a semiconductor wafer sample polishing machine provided with a polishing machine for grinding a sample, comprising: an optical microscope installed at a position where a sample to be ground in the polishing machine can be observed; And a display means for displaying an image photographed by the camera.
따라서, 본 발명에 의하여 연마되는 시료를 계속적으로 관찰할 수 있어 디펙트 발생소스가 되는 공정을 정확하게 확인할 수 있는 효과가 있다.Therefore, according to the present invention, the sample to be polished can be continuously observed, and it is possible to accurately confirm the process of becoming a defect generating source.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.
제1도는 본 발명에 따른 반도체 웨이퍼 시료연마기의 실시예를 나타내는 모식도이다.FIG. 1 is a schematic view showing an embodiment of a semiconductor wafer sample polishing machine according to the present invention.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960017914A KR970077278A (en) | 1996-05-25 | 1996-05-25 | Semiconductor wafer sample polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960017914A KR970077278A (en) | 1996-05-25 | 1996-05-25 | Semiconductor wafer sample polishing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970077278A true KR970077278A (en) | 1997-12-12 |
Family
ID=66220354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960017914A KR970077278A (en) | 1996-05-25 | 1996-05-25 | Semiconductor wafer sample polishing machine |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970077278A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100436861B1 (en) * | 2001-08-27 | 2004-06-30 | 나노메트릭스코리아 주식회사 | Method and apparatus for inspecting defects on polishing pad to be used with chemical mechanical polishing apparatus |
-
1996
- 1996-05-25 KR KR1019960017914A patent/KR970077278A/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100436861B1 (en) * | 2001-08-27 | 2004-06-30 | 나노메트릭스코리아 주식회사 | Method and apparatus for inspecting defects on polishing pad to be used with chemical mechanical polishing apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19960525 |
|
| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |