KR970060465A - 표면 보상형 열 분산 장치 - Google Patents
표면 보상형 열 분산 장치 Download PDFInfo
- Publication number
- KR970060465A KR970060465A KR1019970002602A KR19970002602A KR970060465A KR 970060465 A KR970060465 A KR 970060465A KR 1019970002602 A KR1019970002602 A KR 1019970002602A KR 19970002602 A KR19970002602 A KR 19970002602A KR 970060465 A KR970060465 A KR 970060465A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor integrated
- integrated circuit
- circuit board
- heat sink
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (7)
- 반도체 집적회로의 열 분산 장치에, 상기 반도체 집적회로가 장착되며, 상기 반도체 집적회로의 바로 밑에 홈이 형성되는 인쇄 회로 기판과, 상기 홈에 위치된 히트 싱크와, 열을 분산하기 위해 상기 홈을 통해 상기 마이크로 프로세서의 저면에 상기 히트 싱크를 접착하는 수단을 구비함을 특징으로 하는 열 분산장치.
- 제1항에 있어서, 상기 히트 싱크 부착 수단이 상기 반도체 집적회로의 저면에 상기 히트 싱크가 위치되도록 하기 위한 상기 히트 싱크 상부의 열 전도 테이프인 것을 특징으로 하는 열 분산 장치.
- 제2항에 있어서, 인쇄 회로 기판 트레이와, 상기 인쇄 회로 기판에 트레이를 고착시키기 위한 수단을 더 구비하여, 상기 히트 싱크 상부가 상기 반도체 집적회로와 접촉하고 상기 히트 싱크의 저면이 상기 트레이와 접촉됨을 특징으로 하는 열 분산 장치.
- 제3항에 있어서, 상기 히트 싱크의 상기 저면과 상기 트레이 사이에 위치한 열 전도 테이프를 더 구비함을 특징으로 하는 열 분산 장치.
- 제3항에 있어서, 상기 트레일르 상기 인쇄 회로 기판에 고착하는 고착 수단은 상기 인쇄 회로 기판을 통과하여 상기 트레이에 접착된 상응하는 스크루 포스트들과 연결됨을 특징으로 하는 열 분산 장치.
- 제5항에 있어서, 메인 히트 싱크를 상기 반도체 집적회로의 상부에 고정하여 상기 스크루에 의해 상기 인쇄 회로 기판에 접착되는 클립을 더 구비함을 특징으로 하는 열 분산 장치.
- 반도체 집적회로의 열 분산 방법에 있어서, 상기 반도체 집적회로가 장착하는 인쇄 회로 기판을 제공하는 단계와, 상기 반도체 집적회로 바로 밑에서 상기 인쇄 회로 기판쪽으로 홈을 형성하는 단계와, 상기 홈을 통하여 상기 반도체 집적회로의 저면에 히트 싱크를 부착하는 단계와, 상기 부착된 히트 싱크를 통하여 열을 분산하는 단계로 이루어짐을 특징으로 하는 반도체 집적회로의 자연적 열 분산 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US59428996A | 1996-01-30 | 1996-01-30 | |
US08/594,289 | 1996-01-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970060465A true KR970060465A (ko) | 1997-08-12 |
Family
ID=24378302
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019970002602A Ceased KR970060465A (ko) | 1996-01-30 | 1997-01-29 | 표면 보상형 열 분산 장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5790379A (ko) |
JP (1) | JPH09213851A (ko) |
KR (1) | KR970060465A (ko) |
CN (1) | CN1089457C (ko) |
GB (1) | GB2309827B (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000039046A (ko) * | 1998-12-10 | 2000-07-05 | 밍 루 | 히트싱크 부착방법 |
KR100451650B1 (ko) * | 2001-11-28 | 2004-10-08 | 엘지전자 주식회사 | 집적 회로 방열 장치 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW406454B (en) | 1996-10-10 | 2000-09-21 | Berg Tech Inc | High density connector and method of manufacture |
AU713440B3 (en) * | 1999-05-25 | 1999-12-02 | First International Computer, Inc. | A support structure for a central processing unit |
KR100561328B1 (ko) | 1999-06-11 | 2006-03-16 | 왕지웅중 | 휴대용 컴퓨터의 중앙 처리 장치의 방열기 |
FR2796801B1 (fr) * | 1999-07-23 | 2001-10-05 | Valeo Electronique | Assemblage du type comportant une carte a circuit imprime et une semelle formant drain thermique disposes sur une embase formant radiateur |
US6560108B2 (en) * | 2000-02-16 | 2003-05-06 | Hughes Electronics Corporation | Chip scale packaging on CTE matched printed wiring boards |
US6256202B1 (en) * | 2000-02-18 | 2001-07-03 | Advanced Interconnections Corporation | Integrated circuit intercoupling component with heat sink |
US6456515B1 (en) | 2000-11-27 | 2002-09-24 | Briggs & Stratton Corporation | Three-phase H-bridge assembly and method of assembling the same |
US20040184236A1 (en) * | 2003-03-20 | 2004-09-23 | Kuang-Yao Lee | Central processing unit (CPU) heat sink module |
JP2004356492A (ja) | 2003-05-30 | 2004-12-16 | Toshiba Corp | 電子機器 |
US7019394B2 (en) * | 2003-09-30 | 2006-03-28 | Intel Corporation | Circuit package and method of plating the same |
US20050207115A1 (en) * | 2004-03-18 | 2005-09-22 | Hewlett-Packard Development Company, L.P. | Heat dissipating arrangement |
CN101221588B (zh) * | 2007-01-09 | 2011-01-26 | 昆山杰得微电子有限公司 | 一种pcb设计中的散热设计方法 |
CN101970982B (zh) * | 2008-03-19 | 2012-07-25 | 株式会社安川电机 | 形状测量装置和具有该形状测量装置的机器人装置 |
JP6737221B2 (ja) | 2017-04-11 | 2020-08-05 | 株式会社デンソー | 電動パワーステアリング制御装置および電子ユニット。 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8304890D0 (en) * | 1983-02-22 | 1983-03-23 | Smiths Industries Plc | Chip-carrier substrates |
US5019940A (en) * | 1987-02-24 | 1991-05-28 | Thermalloy Incorporated | Mounting apparatus for electronic device packages |
US5175612A (en) * | 1989-12-19 | 1992-12-29 | Lsi Logic Corporation | Heat sink for semiconductor device assembly |
US5045921A (en) * | 1989-12-26 | 1991-09-03 | Motorola, Inc. | Pad array carrier IC device using flexible tape |
US5331507A (en) * | 1991-05-15 | 1994-07-19 | Dell Usa L.P. | Clip for mounting a heat sink on an electronic device package |
WO1993017536A1 (en) * | 1992-02-28 | 1993-09-02 | Aavid Engineering, Inc. | Self-locking heat sinks for surface mount devices |
US5272599A (en) * | 1993-03-19 | 1993-12-21 | Compaq Computer Corporation | Microprocessor heat dissipation apparatus for a printed circuit board |
US5329426A (en) * | 1993-03-22 | 1994-07-12 | Digital Equipment Corporation | Clip-on heat sink |
US5386339A (en) * | 1993-07-29 | 1995-01-31 | Hughes Aircraft Company | Monolithic microelectronic circuit package including low-temperature-cofired-ceramic (LTCC) tape dielectric structure and in-situ heat sink |
US5434105A (en) * | 1994-03-04 | 1995-07-18 | National Semiconductor Corporation | Process for attaching a lead frame to a heat sink using a glob-top encapsulation |
JPH0846098A (ja) * | 1994-07-22 | 1996-02-16 | Internatl Business Mach Corp <Ibm> | 直接的熱伝導路を形成する装置および方法 |
-
1997
- 1997-01-28 GB GB9701644A patent/GB2309827B/en not_active Expired - Fee Related
- 1997-01-29 JP JP9015447A patent/JPH09213851A/ja active Pending
- 1997-01-29 KR KR1019970002602A patent/KR970060465A/ko not_active Ceased
- 1997-01-30 CN CN97103200A patent/CN1089457C/zh not_active Expired - Fee Related
- 1997-11-05 US US08/968,848 patent/US5790379A/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000039046A (ko) * | 1998-12-10 | 2000-07-05 | 밍 루 | 히트싱크 부착방법 |
KR100451650B1 (ko) * | 2001-11-28 | 2004-10-08 | 엘지전자 주식회사 | 집적 회로 방열 장치 |
Also Published As
Publication number | Publication date |
---|---|
GB9701644D0 (en) | 1997-03-19 |
JPH09213851A (ja) | 1997-08-15 |
CN1167934A (zh) | 1997-12-17 |
GB2309827B (en) | 1998-04-22 |
US5790379A (en) | 1998-08-04 |
GB2309827A (en) | 1997-08-06 |
CN1089457C (zh) | 2002-08-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19970129 |
|
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19970129 Comment text: Request for Examination of Application |
|
PG1501 | Laying open of application | ||
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 19990312 Patent event code: PE09021S01D |
|
E601 | Decision to refuse application | ||
PE0601 | Decision on rejection of patent |
Patent event date: 19990617 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 19990312 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |