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KR970058440A - Device for soldering release part of double-sided board and its method - Google Patents

Device for soldering release part of double-sided board and its method Download PDF

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Publication number
KR970058440A
KR970058440A KR1019950068216A KR19950068216A KR970058440A KR 970058440 A KR970058440 A KR 970058440A KR 1019950068216 A KR1019950068216 A KR 1019950068216A KR 19950068216 A KR19950068216 A KR 19950068216A KR 970058440 A KR970058440 A KR 970058440A
Authority
KR
South Korea
Prior art keywords
double
substrate
soldering
sided
sided board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019950068216A
Other languages
Korean (ko)
Inventor
심상범
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950068216A priority Critical patent/KR970058440A/en
Publication of KR970058440A publication Critical patent/KR970058440A/en
Ceased legal-status Critical Current

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

이 발명은 양면 기판의 이형 부품 납땜 장치 및 그 방법에 관한 것으로서, 부품이 삽입된 양면 기판을 올려 놓는 기판 안착 지그와; 양면 기판면의 리드와 신호선을 연결하는 납을 담고 있는 납땜조와; 상기 기판 안착 지그를 밀어 올리는 실린더와; 상기 기판 안착 지그와 실린더를 연결하는 일관절 링크와; 상기 기판 안착 지그와 실린더를 연결하는 이관절 링크로 이루어지며; 양면 기판을 경사지게 납땜조에서 들어올려 표면장력 및 간섭으로 인한 납땜 불량을 줄이는 효과를 가진 양면 기판의 이형 부품 납땜 장치 및 그 방법에 관한 것이다.The present invention relates to a release component soldering apparatus for a double-sided board and a method thereof, comprising: a substrate seating jig for mounting a double-sided board on which a component is inserted; A solder bath containing lead connecting lead and signal lines on both sides of the substrate; A cylinder for pushing up the substrate mounting jig; An integrated link connecting the substrate seating jig and the cylinder; A joint link connecting the substrate seating jig and the cylinder; An apparatus and a method for soldering a release component of a double-sided board having an effect of lifting the double-sided board from the soldering tank inclined to reduce soldering failure due to surface tension and interference.

Description

양면 기판의 이형 부품 납땜 장치 및 그 방법Device for soldering release part of double-sided board and its method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 이 발명의 실시예에 따른 양면 기판의 이형 부품 납땜 장치.2 is a release component soldering apparatus for a double-sided substrate according to an embodiment of the present invention.

Claims (2)

부품이 삽입된 양면 기판을 올려 놓는 기판 안착 지그와; 양면 기판면의 리드와 신호선을 연결하는 납을 담고 있는 납땜조와; 상기 기판 안착 지그를 밀어올리는 실린더와; 상기 기판 안착 지그와 실린더를 연결하는 일관절 링크(LINK)와; 상기 기판 안착 지그와 실린더를 연결하는 이관절 링크로 이루어지는 것을 특징으로 하는 양면 기판의 이형 부품 납땜 장치.A substrate seating jig for placing a double-sided board into which parts are inserted; A solder bath containing lead connecting lead and signal lines on both sides of the substrate; A cylinder for pushing up the substrate mounting jig; An integrated link (LINK) for connecting the substrate mounting jig and the cylinder; Release device soldering device of the double-sided board, characterized in that consisting of a two-way link connecting the substrate seating jig and the cylinder. 양면 기판 납땜 장치가 전원이 들어와 동작을 시작하는 단계와; 양면 기판에 이형 커넥터를 삽입하는 단계와; 양면 기판의 리드 면에 용매제를 바르는 단계와; 양면 기판을 기판 안착 지그 위에 투입하는 단계와; 기판 안착 지그를 납땜조로 하강시키는 단계와; 양면 기판이 납땜조 표면에 정해진 높이까지 내려왔는지 판단하는 단계와; 양면 기판의 리드와 신호선을 납으로 납땜을 하는 단계와; 납땜이 완료되었는지 판단하는 단계와; 기판 안착 지그 우측을 실린더로 올리는 단계와; 기판 안착 지그의 좌측을 실린더로 올리는 단계와; 양면 기판의 납땜의 동작이 완료되는 단계로 이루어지는 것을 특징으로 하는 양면 기판의 이형 부품 납땜 방법.The double-sided substrate soldering device is powered on to start operation; Inserting a release connector into the double-sided substrate; Applying a solvent to the lead side of the double-sided substrate; Putting a double-sided substrate onto the substrate mounting jig; Lowering the substrate seating jig into a solder bath; Determining whether the double-sided substrate is lowered to a predetermined height on the surface of the solder bath; Soldering the leads and the signal lines of the double-sided board with lead; Determining whether soldering is completed; Raising the right side of the substrate seating jig into a cylinder; Raising the left side of the substrate seating jig into a cylinder; Method for soldering a release component of a double-sided board, characterized in that the step of completing the operation of the soldering of the double-sided board. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950068216A 1995-12-30 1995-12-30 Device for soldering release part of double-sided board and its method Ceased KR970058440A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950068216A KR970058440A (en) 1995-12-30 1995-12-30 Device for soldering release part of double-sided board and its method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950068216A KR970058440A (en) 1995-12-30 1995-12-30 Device for soldering release part of double-sided board and its method

Publications (1)

Publication Number Publication Date
KR970058440A true KR970058440A (en) 1997-07-31

Family

ID=66638472

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950068216A Ceased KR970058440A (en) 1995-12-30 1995-12-30 Device for soldering release part of double-sided board and its method

Country Status (1)

Country Link
KR (1) KR970058440A (en)

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Legal Events

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A201 Request for examination
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19951230

PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19951230

Comment text: Request for Examination of Application

PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 19981017

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 19990226

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 19981017

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I