[go: up one dir, main page]

KR970049037A - Chemically Amplified Photoresist and Manufacturing Method Thereof - Google Patents

Chemically Amplified Photoresist and Manufacturing Method Thereof Download PDF

Info

Publication number
KR970049037A
KR970049037A KR1019950067004A KR19950067004A KR970049037A KR 970049037 A KR970049037 A KR 970049037A KR 1019950067004 A KR1019950067004 A KR 1019950067004A KR 19950067004 A KR19950067004 A KR 19950067004A KR 970049037 A KR970049037 A KR 970049037A
Authority
KR
South Korea
Prior art keywords
chemically amplified
amplified photoresist
base resin
single monomer
manufacturing
Prior art date
Application number
KR1019950067004A
Other languages
Korean (ko)
Inventor
최상준
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950067004A priority Critical patent/KR970049037A/en
Publication of KR970049037A publication Critical patent/KR970049037A/en

Links

Landscapes

  • Materials For Photolithography (AREA)

Abstract

본 발명은 화학증폭형 포토레지스트 및 그 제조방법에 관해 개시한다. 본 발명에 의한 포토레지스트의 베이스 수지는 친수성부분과 수소성부분을 함께 갖는 아래의 단일 모노머를 구비하고 있다.The present invention discloses a chemically amplified photoresist and a method of manufacturing the same. The base resin of the photoresist according to the present invention includes the following single monomer having both a hydrophilic portion and a hydrogenated portion.

따라서 본 발명에 의하면, 종래에 있어서는 친수성모노머와 소수성모노머를 각각 형성해야하는 것과는 달리, 본 발명에서는 이들 두성질을 함께 갖는 단일 모노머를 형성하면되므로 포토레지스트의 제조공정을 줄이는 것이 가능하다. 따라서 제조공정 단축에 따른 경제적인 부담은 종래에 비해 감소하는 것을 자명하다. 아울러 다른 기능을 갖는 단일 모노머와 공중합시키므로써, 다양한 기능을 갖는 포토레지스트를 제조할 수 있다.Therefore, according to the present invention, in contrast to the conventional need to form a hydrophilic monomer and a hydrophobic monomer, in the present invention, it is possible to reduce the manufacturing process of the photoresist by forming a single monomer having these two properties. Therefore, the economic burden of shortening the manufacturing process is obviously reduced compared to the prior art. In addition, by copolymerizing with a single monomer having a different function, it is possible to produce a photoresist having a variety of functions.

Description

화학 증폭형 포토레지스트 및 그 제조방법Chemically Amplified Photoresist and Manufacturing Method Thereof

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명에 의한 방법으로 단일 모노머(monomer)가 형성되는 반응을 나타내는 화학주조식이다,1 is a chemical casting formula showing a reaction in which a single monomer is formed by the method according to the present invention.

제2도는 제1도의 모노머(monomer)를 이용하여 베이스 수지가 형성되는 반응을 나타내는 화학구조식이다,2 is a chemical structural formula showing a reaction in which a base resin is formed using the monomer of FIG.

제3도는 본 발명에 의한 포토레지스트의 광학적 미케니즘을 나타내는 화학구조식이다.3 is a chemical structural formula showing the optical mechanism of the photoresist according to the present invention.

Claims (9)

친수성부분과 소수성부분으로 구성된 베이스 수지를 구비하는 화학증폭형 포토레지스트에 있어서, 상기 베이스 수지는 단일 모노머에 상기 친수성과 소수성 부분을 구비하는 것을 특징으로 하는 화학증폭형 포토레지스트.A chemically amplified photoresist having a base resin composed of a hydrophilic portion and a hydrophobic portion, wherein the base resin has the hydrophilic and hydrophobic portion in a single monomer. 제1항에 있어서, 상기 단일 모노머는 다음과 같은 화학구조식을 갖는 것을 특징으로 하는 화학증폭형 포토레지스트.The chemically amplified photoresist of claim 1, wherein the single monomer has the following chemical structure. 제1항에 있어서, 상기 베이스수지는 다음과 같은 화학구조식을 갖는 것을 특징으로 하는 화학증폭형 포토레지스트.The chemically amplified photoresist according to claim 1, wherein the base resin has the following chemical structural formula. 단, n:m은 5:5이다.However, n: m is 5: 5. 제1항에 있어서, 상기 베이스수지에서 상기 단일 모노머의 비율은 30 내지 70%인 것을 특징으로 하는 화학증폭형 포토레지스트.The chemically amplified photoresist according to claim 1, wherein the ratio of the single monomer in the base resin is 30 to 70%. 제3항에 있어서, 상기 베이스 수지의 화학구조식에서 "R"기는 수소 또는 메틸기중 선택된 어느 하나인 것을 특징으로 하는 화학증폭형 포토레지스트.The chemically amplified photoresist according to claim 3, wherein the "R" group in the chemical formula of the base resin is any one selected from hydrogen or methyl group. 친수성부분과 소수성부분을 갖는 베이스 수지를 포함하는 화학증폭형 포토레지스트 제조방법에 있어서, 상기 친수성 부분과 소수성부분을 함께 갖는 단일 모노머를 제조하는 단계를 포함하는 것을 특징으로 하는 화학증폭형 포토레지스트 제조방법.In the method of manufacturing a chemically amplified photoresist comprising a base resin having a hydrophilic portion and a hydrophobic portion, a chemically amplified photoresist comprising the step of preparing a single monomer having both a hydrophilic portion and a hydrophobic portion Way. 제6항에 있어서, 상기 단일 모노머를 제조하는 단계는 500ml의 플라스크(flask)에 43.7g(0.247mol)의 디에틸 시아노메틸포스포네이트(diethylcyanomethyl phosphonate)와 140g의 프롬알데히드(formaldehyde)용액을 혼합하는 제1단계; 상기 제1단계의 결과물에 촉매제로써, 포화 칼륨 카보네이트(K2CO3)용액 75ml를 천천히 첨가하는 제2단계; 상기 제2단계의 결과물을 1시간정도 반응시킨 후 상기 반응결과물에 110ml의 염화암모늄(NH3C1) 용액을 첨가하고 상기 염화암모늄 용액이 첨가된 결과물에 디에틸 에테르를 사용하여 추출물을 침전시키는 제3단계; 및 상기 침전된 추출물을 황산마크네슘(MgSO4)을 사용하여 건조한 다음, 건조된 결과물을 칼럼 크로마토그라피(colume-chromatography)를 이용하여 분리하는 제4단계를 포함하는 것을 특징으로 하는 화학증폭형 포토레지스트 제조방법.The method of claim 6, wherein the preparing of the single monomer is performed by using 43.7 g (0.247 mol) of diethylcyanomethyl phosphonate and 140 g of formaldehyde solution in a 500 ml flask. A first step of mixing; A second step of slowly adding 75 ml of saturated potassium carbonate (K 2 CO 3 ) solution as a catalyst to the resultant of the first step; After reacting the resultant of the second step for about 1 hour, 110 ml of ammonium chloride (NH 3 C1) solution is added to the reaction resultant, and an agent is precipitated using diethyl ether to the resultant to which the ammonium chloride solution is added. Step 3; And a fourth step of drying the precipitated extract using magnesium sulfate (MgSO 4 ), and then separating the dried product using column chromatography (colume-chromatography). Resist Manufacturing Method. 제6항에 있어서, 상기 베이스 수지는 상기 모노머와 아래의 반응식으로 형성되는 것을 특징으로 하는 화학증폭형 포토레지스트 제조방법.The method of claim 6, wherein the base resin is formed by the following reaction formula with the monomer. 제8항의 반응식에 있어서, "R"기로는 수소(H) 및 메틸기(CH3)중 선택된 어느 하나를 사용하는 것을 특징으로 하는 화학증폭형 포토레지스트 제조방법.The chemically amplified photoresist manufacturing method according to claim 8, wherein any one selected from hydrogen (H) and methyl group (CH 3 ) is used as the "R" group. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950067004A 1995-12-29 1995-12-29 Chemically Amplified Photoresist and Manufacturing Method Thereof KR970049037A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950067004A KR970049037A (en) 1995-12-29 1995-12-29 Chemically Amplified Photoresist and Manufacturing Method Thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950067004A KR970049037A (en) 1995-12-29 1995-12-29 Chemically Amplified Photoresist and Manufacturing Method Thereof

Publications (1)

Publication Number Publication Date
KR970049037A true KR970049037A (en) 1997-07-29

Family

ID=66638214

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950067004A KR970049037A (en) 1995-12-29 1995-12-29 Chemically Amplified Photoresist and Manufacturing Method Thereof

Country Status (1)

Country Link
KR (1) KR970049037A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000076980A (en) * 1999-03-29 2000-12-26 카네코 히사시 Chemically amplified resist

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000076980A (en) * 1999-03-29 2000-12-26 카네코 히사시 Chemically amplified resist

Similar Documents

Publication Publication Date Title
KR100354871B1 (en) Copolymer resin, method for producing the same, and photoresist using the same
KR970049037A (en) Chemically Amplified Photoresist and Manufacturing Method Thereof
KR100190012B1 (en) Method of manufacturing base resin for chemically amplified resist
KR920002510A (en) Method for preparing 4-hydroxybutyl (meth) acrylate
KR970022550A (en) Chemically Amplified Resist Type Base Resin and Manufacturing Method Thereof
KR100275748B1 (en) Resist composition comprising dialkyl malonate in base polymer
KR970049021A (en) Chemically Amplified Resist and Manufacturing Method Thereof
KR970028844A (en) Base resin for chemically amplified resist and its manufacturing method
KR970049014A (en) Base Resin for Chemical Amplified Resist
JP3353292B2 (en) Chemically amplified resist
KR970049017A (en) Base resin for chemically amplified resist
KR970028840A (en) Base resin for chemically amplified resist and method for producing same
KR970028838A (en) Base resin for chemically amplified resist and its manufacturing method
KR970049028A (en) Base resin for chemically amplified resist
KR20030043752A (en) Novel ester compounds
KR970028841A (en) Base resin for chemically amplified resist and its manufacturing method
FR2415823A1 (en) PHOTORETICULABLE COMPOSITION CONTAINING A POLYMER WITH A CARBONYL GROUP, PHOTOSENSITIVE PRODUCT OBTAINED FROM THIS COMPOSITION AND IMAGE FORMATION PROCESS WHICH USES THIS PRODUCT
KR970028842A (en) Base resin for chemically amplified resist and its manufacturing method
KR970049034A (en) Base resin for chemically amplified resist and its manufacturing method
KR970076085A (en) Base resin for chemically amplified resist
KR970059835A (en) Base resin for chemically amplified resist
KR980011711A (en) Base resin for chemically amplified resist
KR970022545A (en) Dissolution Inhibitor for Chemical Amplified Resist
KR19980015736A (en) Chemically amplified base resin
KR970049013A (en) Base resin for two layer resist

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19951229

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid