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KR970025313A - Multi-stage Input Tape Carrier Package - Google Patents

Multi-stage Input Tape Carrier Package Download PDF

Info

Publication number
KR970025313A
KR970025313A KR1019950038699A KR19950038699A KR970025313A KR 970025313 A KR970025313 A KR 970025313A KR 1019950038699 A KR1019950038699 A KR 1019950038699A KR 19950038699 A KR19950038699 A KR 19950038699A KR 970025313 A KR970025313 A KR 970025313A
Authority
KR
South Korea
Prior art keywords
carrier package
tape carrier
stage
tli
stage input
Prior art date
Application number
KR1019950038699A
Other languages
Korean (ko)
Other versions
KR0182021B1 (en
Inventor
이승준
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950038699A priority Critical patent/KR0182021B1/en
Publication of KR970025313A publication Critical patent/KR970025313A/en
Application granted granted Critical
Publication of KR0182021B1 publication Critical patent/KR0182021B1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)

Abstract

본 발명은 테입 캐리어 패키지에 관한 것으로서, 더욱 상세하게는, PCB 기판과 부착되는 입력 단을 다단으로 형성하는 테입 캐리어 패키지에 관한 것이다. TLI, OLB 및 집적 회로가 실장되는 영역으로 구성되어 있는 테입 캐리어 패키지로서, TLI이 이단 이상의 다단으로 구성되어 있다. 따라서, 본 발명에 따른 데입 캐리어 패키지는 TLI 단을 이단 이상의 다단으로 구성함으로서 회로부에서 입력되는 다수의 입력신호에 대응하여 넓은 피치가 가능하여 미스 어라인을 제거함으로써 작업 실패를 줄이고 이로 인하여 생산률이 향상되고 원가을 줄이는 효과가 있다.The present invention relates to a tape carrier package, and more particularly, to a tape carrier package for forming an input stage attached to a PCB substrate in multiple stages. As a tape carrier package composed of a region in which TLI, OLB, and integrated circuits are mounted, TLI is composed of two or more stages. Therefore, the tapered carrier package according to the present invention can be configured in a multi-stage multi-stage TLI stage to enable a wide pitch in response to a plurality of input signals input from the circuit portion to eliminate the misalignment to reduce the work failure and thereby the production rate It has the effect of improving costs and reducing costs.

Description

다단 입력 테입 캐리어 패키지Multi-stage Input Tape Carrier Package

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명의 실시예에 따른 테입 캐리어 패키지의 구조를 나타낸 평면도이다.2 is a plan view showing the structure of a tape carrier package according to an embodiment of the present invention.

Claims (2)

집적 회로가 실장되는 영역, 상기 집적 회로 실장 영역의 서로 다른 부분에 각각 연력되어 있으며 PCB와 연결되는 다수의 TLI, 상기 집적 회로 실장 영역과 연결되어 있는 OLB를 포함하는 테입 케리어 패키지.A tape carrier package comprising a region in which an integrated circuit is mounted, a plurality of TLIs connected to different parts of the integrated circuit mounting region and connected to a PCB, and an OLB connected to the integrated circuit mounting region. 제1항에 있어서, 상기 집적 회로 실장 영역, 다수의 TLI 및 OLB는 서로 평행하게 형성되어 있는 테입 케리어 패키지.The tape carrier package of claim 1, wherein the integrated circuit mounting area, the plurality of TLIs, and the OLB are formed in parallel with each other.
KR1019950038699A 1995-10-31 1995-10-31 Tape carrier package for multigrade input KR0182021B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950038699A KR0182021B1 (en) 1995-10-31 1995-10-31 Tape carrier package for multigrade input

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950038699A KR0182021B1 (en) 1995-10-31 1995-10-31 Tape carrier package for multigrade input

Publications (2)

Publication Number Publication Date
KR970025313A true KR970025313A (en) 1997-05-30
KR0182021B1 KR0182021B1 (en) 1999-05-15

Family

ID=19432300

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950038699A KR0182021B1 (en) 1995-10-31 1995-10-31 Tape carrier package for multigrade input

Country Status (1)

Country Link
KR (1) KR0182021B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210060718A (en) 2019-11-18 2021-05-27 삼성디스플레이 주식회사 Display device and method of manufacturing display device

Also Published As

Publication number Publication date
KR0182021B1 (en) 1999-05-15

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